Epoxy die attach, sometimes referred to as epoxy die bonding, is the most commonly used die attach method. Whether dispensed or daubed via single pin or stamp transfer, it is a more cost-effective solution compared to eutectic bonding; this is due to lower material and process costs. Typical epoxy die attach applications include: Simple transistors, encapsulation of wire bonds, LED attachment, MCMs, and complex hybrids. Hybrid microcircuits, in particular, have seen tremendous growth in popularity due to their built-in flexibility and small package sizes. Aerospace and defense, medical, and optoelectronic device manufacturers have integrated the hybrid package to achieve multiple-need and multi-performance requirements. With rapid time-to-market needs, automating the packaging process has become more critical than ever before. Epoxy die attach is a consistent, reliable, and flexible form of component attach. Automated epoxy dispense systems have kept up with these advances by maintaining a high level of control, handling, and integration through sophisticated process control software.

Epoxy die attach is a low cost attachment method that is often faster, and more flexible than conventional eutectic die attach. Although it does not boast the same thermally conductive bonds that eutectic die attach does, it offers the ability to create precise electrically conductive paths without the risk of shorting through the use of various adhesive types. Both the conductive and non-conductive solutions can be applied via dispense, jetting, or pin transfer for both extremely small and large components, while maintaining controlled, repeatable bonds. Applying these adhesives with extreme precision is necessary to make the most of the control that epoxy has to offer. Automated die bonding systems such as the Palomar 3880 and 6500 are prime examples of platforms that can make the most of epoxy die attach, by offering access to all epoxy die attach process methods while being highly stable, precise, and customizable.

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