Apple has conquered the smartphone market in North America as it is the largest device maker in the region. It has amassed a loyal following as well with numerous consumers waiting every year for the new iteration of the iPhone.

The iPhone 14 Plus was released in September of last year with all sorts of new features as well as the latest technology including Apple’s 64-bit hexa-core applications processor and main memory from Samsung. The smartphone features three 12-megapixel cameras and a sensor suite.

The following is a partial teardown of the latest iPhone conducted from TechInsights.

Summary

• 6.66 inch AMOLED
• 6 GB mobile SDRAM
• 12 MP BSI CMOS/12 MP BSI CMOS wide-angle and 12 MP BSI CMOS ultra-wide-angle

Released: September 2022

Price: $1,157

Availability: Worldwide

Target market: Consumer/communications

Main board

The main board inside the Apple iPhone 14 Plus includes the main Apple processor, the 64-bit hexa-core applications processor, 5 GB of mobile LPDDR4X SDRAM multichip memory from Samsung and power management and audio codecs from Apple. Other electronic components include:

• DC/DC converter from ST Microelectronics
• Flash LED driver and AMOLED display power supply from Texas Instruments
• Audio amplifier from Cirrus Logic
• Voltage level transistor from Nexperia
• 600 mA synchronous boost regulator from Onsemi
• Bidirectional voltage level transistor from NXP Semiconductors
• HB and MB front-end module from Broadcom
• Quad-band GSM power amplifier and RxD front-end module from Skyworks
• SPDT RF switch from Qorvo
• Six-axis MEMS accelerometer and gyroscope from Bosch Sensortec
• USB Type-C port controller from Infineon
• Wideband envelope power tracker from Qualcomm

(Learn more about power ICs from Globalspec.com)

Sensor flex board

The sensor board includes several components used to communicate with outside internet connected devices. The electronic components inside the sensor flex board include a three-axis electronic compass, a proximity sensor from ST Microelectronics and an ambient light sensor from ST Microelectronics.

(Learn more about sensor chips from Globalspec.com)

RF board

The RF board is used to connect the smartphone to the cellular network as well as Wi-Fi, Bluetooth and other wireless connectivity. It is one of the hearts of the Apple 14 Plus smartphone. The electronic components on the board include:

• Qualcomm’s Snapdragon X85 5G modem
• Apple’s audio amplifier
• Qorvo’s 5G average power tracker and GPIO interface
• Analog Devices’ haptic engine driver
• Murata’s 2.4 GHz Wi-Fi front-end module
• Skyworks’ LB front-end modules and RF switch
• Broadcom’s UHB LTE and 5G NR front-end module

(Learn more about RF and wireless chips on Globalspec.com)

Major components

• $78.86 — 64-bit hexa-core applications processor — Apple (Qty: 1)
• $67.84 — 60 Hz display/touchscreen subsystem — Samsung (Qty: 1)
• $45.65 — 12 MP wide-angle rear camera subsystem (Qty: 1)
• $34.53 — Main enclosure (Qty: 1)
• $27.15 — Snapdragon X65 5G modem with memory — Qualcomm (Qty: 1)
• $26.18 — Multichip memory — 256 GB 3D TLC NAND flash — Kioxia (Qty: 1)
• $18.31 — 12 MP ultra-wide-angle rear camera subsystem (Qty: 1)
• $17.90 — Multichip memory — 6 GB mobile SDRAM — Samsung (Qty: 1)
• $15.85 — Back cover (Qty: 1)
• $14.99 — RF transceiver — Qualcomm (Qty: 2)