Silicon Nitride (Si?N?) Substrates
Featured Product from Xiamen Innovacera Advanced Materials Co., Ltd.
Innovacera’s Silicon Nitride (Si?N?) Substrates combine exceptional thermal conductivity, high mechanical strength, and excellent fracture toughness, providing outstanding reliability for high-power electronic and thermal management applications. With a thermal expansion coefficient closely matched to silicon and superior resistance to thermal shock, these substrates maintain stable performance under extreme conditions. Their precision-engineered surfaces and customizable specifications make them ideal for IGBT power modules, high-power heat sinks, and advanced wireless modules.
Features
- High thermal conductivity
- Thermal expansion coefficient close to silicon wafer
- High strength and toughness
Application
- High power IGBT power module
- High power heat sink
- Wireless module
Material Properties Table
| Project | Test conditions | Unit | Si?N? | |
| SN-90 | ||||
| Material | – | – | Si?N? | |
| Appearance | – | – | grey | |
| Surface roughness | Ra | μm | 0.2~0.75 | |
| Density | – | g/cm 3 | ≥3.2 | |
| Physical properties | Bending strength | 3 -point bending resistance | MPa | ≥750 |
| Vickers hardness | Load 4.9 | GPa | ≥14 | |
| Water absorption | – | % | 0 | |
| Thermal performance | Thermal conductivity | 25? | W/(m·k) | ≥85 |
| Linear thermal expansion coefficient | 25-500? | x10 -6 mm/? | 2~4 | |
| Thermal shock resistance | 800? | Time | ≥10 | |
| Specific heat | – | J/(kg·K) | 680 | |
| Electrical properties | Dielectric constant | 1MHz/25? | – | 7~8 |
| Dielectric loss | 1MHz/25? | x10 -4 | ≤4 | |
| Volume resistivity | 25? | Ω·cm | > 10 14 | |
| Breakdown voltage | – | kV/mm | > 15 | |
| Light performance | Reflectivity | Reflectivity meter | – | – |
| Whiteness | Whiteness meter | – | – | |
Specifications and Dimensions
| Material | Unit | Al?O? | ZTA | AlN | Si?N? |
| Effective dimensions ( A , B ) | mm | 50.8-190 | 50.8-190 | 50.8-190 | 138*190 |
| Thickness ( T ) | mm | 0.25-1.5 | 0.25-1.5 | 0.25-1.0 | 0.25 , 0.32 |
| Thickness tolerance | mm | ±5% ( Min±0.03mm ) | ±5% ( Min±0.03mm ) | ±5% ( Min±0.03mm ) | ±5% ( Min ±0.03mm ) |
| Warpage ( C ) | mm | ≤0.3% | ≤0.3% | ≤0.3% | ≤0.3% |
| surface roughness | μm | 0.2-0.6 | 0.2-0.5 | 0.2-0.75 | 0.2-0.75 |
| Size, thickness and surface roughness can be customized | |||||
Processing
• Laser processing
• Grinding and polishing sheet roughness table
| Project | Qualified | Special Grade | ||
| Internal dimension tolerance | ±0.05mm | ±0.03mm | ||
| External dimension tolerance | ±0.15mm | ±0.1mm | ||
| Hole tolerance (φ0.07-0.15mm) | ±0.05mm | ±0.02mm | ||
| Hole tolerance (φ ? 0.15mm) | ±0.1mm | ±0.02mm | ||
| Project | Surface roughness (μm ) | |||
| Qualified | Special Grade | |||
| Grinding | 0.3-0.6 | 0.3-0.5 | ||
| Fine grinding | 0.1-0.4 | 0.1-0.3 | ||
| Polishing | ≤0.1 | ≤0.05 | ||
