Product Announcements:
Micro Connectors and Nano Connectors

Omnetics Micro Circular Series (spaced at .050" / 1.27 mm centerline-to-centerline) is ideal for tight spaces and rugged environments. This family of interconnect solutions features a mated length of less than 12.4 mm. Read more...

On any given day approximately 2,300 man-made satellites are orbiting the earth's surface. These satellites are responsible for relaying both analog and digital signals
carrying a plethora of voice, video and data-streaming to and from various locations worldwide. Each second, these satellites directly impact everyday luxuries we
enjoy, such as cellphones and email, to mo... Read more...

This innovative, first-to-market, high density miniature solution is ideally suited for handheld or body-worn applications when space is limited; it provides more functionality into smaller devices and lowers the total cost of ownership. Read more...

The Hermetic Solutions Group's hermetically-sealed Junior-D™ (.030 Contact Pitch) connectors are a miniature version of our mil-spec Sub-D hermetic connectors and provide a space savings of 70% over a standard Sub-D. Read more...

Hermetic Solutions Group's unique ceramic-to-metal sealing technology accommodates BeCu pins that carry nearly 3x the current, compared to Kovar pins in glass sealed connectors. Read more...

JAE's DX4 waterproof series is an IPX7 rated, fully submersible Micro USB 2.0 Type-B connector with a specially designed guard plate for robustness and increased reliability. 11.5mm in width and 6.15mm in depth. Read more...

May the “ Magnetic Forces ” be with you.

Omnetics’ Nano Strip connectors encompass an ultra-low profile and rugged form factor, making it an ideal interconnect solution for a number of design challenges currently plaguing today’s engineering community. From inside the box to board-to-board connections, this family of Nano-miniature connectors makes the toug... Read more...

For years, standard D-sub-miniature connectors (MIL-DTL-24308) were the poster child in relation to overall ruggedness and reliability when it came to interconnect greatness. However, much of this has changed with the influx of today’s digital explosion.

an impact size and weight are pla... Read more...