Product Announcements:
Solder

ALPHA® OM-377 is a no-clean solder paste engineered for ultra-fine feature printing in advanced electronics assemblies. Designed to support long-term electrochemical reliability, the formulation helps manufacturers reduce warpage-induced defects and improve process consistency as component geometries continue to shrink. Read more...

MacDermid Alpha Electronics Solutions will showcase how integrated materials strategies across soldering, die attach, thermal management, and protection can strengthen reliability, improve process stability, and advance sustainability. Visit us at Productronica China 2026 to explore solutions for EV, automotive, consumer, and high-performance computing applications.... Read more...

Macdermid Alpha has been awarded for innovation: driving process optimization and efficiency with major Indian EMS provider. Read more...

Discover why material selection—not just design—is the key to long-term electronics reliability. Read more...

MacDermid Alpha Electronics Solutions Expands Singapore Production Facility to Meet Growing Global Demand for Argomax^® Silver Sintering Paste. Read more...

Clark Dai, one of MacDermid Alpha’s EV Technology market managers, explores market technologies and the automotive sector, while highlighting the role our products play in supporting the critical needs of the industry. He delves into its applications, benefits, and the transformative impact, propelling OEMs into a new era of technological excellence. Read more...

In the rapidly evolving electronics industry, where innovation drives progress, MacDermid Alpha Electronics Solutions is committed to setting a new standard. We are pleased to introduce ALPHA Innolot MXE, a revolutionary alloy meticulously engineered to address the critical needs of enhanced reliability and performance in modern electronic assemblies. Read more...

ALPHA OM-565 is a zero-halogen, low temperature flux chemistry, developed specifically for the HRL3 alloy to enable target peak reflow of 175 °C for minimized warpage induced defects and enhanced product reliability compared to existing low temperature solutions. Read more...

ALPHA^® Exactalloy^® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... Read more...

MacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. Read more...