Product Announcements:
Solder

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA^® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). Read more...

ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with Antimony (Sb) content ranging from 5-10%. They are well suited for automotive and power semiconductor applications. Read more...

Non-Eutectic, Low Temperature, Pin Testable, Solder Paste for
Motherboard Assemblies with High Warpage Chips Read more...

Void reduction is complex. A number of factors contribute to void generation, so in order to address this common problem, Alpha is focused on understanding all the variables. Read more...

Written by Morgana Ribas and other expert authors from Alpha Assembly Solutions, this ebook on Low-Temperature Soldering illustrates the importance of chemistry when developing low-temperature solders, and discusses advanced and emerging applications where lower melting point alloys can provide unique assembly solutions. Read more...

Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Read more...

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? Read more...

Indium Corporation's - new SACM™ is a high-reliability solder alloy that offers drop shock performance far superior to other SAC alloys, without compromising on thermal cycling - all at a cost below that of typical SAC solder alloys Read more...

Indium Corporation - The portable electronics industry has ongoing challenges to improve drop-shock performance without sacrificing thermal cycling performance, reduce need for expensive board-level underfills (and associated material, process and re-work costs), as well as the inability to even reach some areas with underfill; and reduce costs. Read more...

An OEM’s long-term competitiveness and endurance is dependent upon their ability to provide effi cient and consistent assemblies. The right combination of Solder Paste, Liquid Flux, Cored Wire and Flux Gel is a critical aspect to producing highperforming products that will meet stringent specifi cations, and thereby a key concern for OEMs and customers alike. So what material sets... Read more...