Product Announcements:
Solder

ALPHA OM-220 is a new, ultra-low temperature solder paste paired with ALPHA ULT1 alloy for soldering of temperature-sensitive components and substrates. This innovative chemistry enables peak reflow temperatures below 150°C, making it ideal for soldering heat sensitive components and sub-assemblies. Read more...

ALPHA OM-372 is designed for superior performance on assemblies with ultra-fine pitch components requiring excellent stencil transfer efficiency and high electrical reliability, such as those found in mobile and wearables, computing, and medical assemblies. Read more...

Indium Corporation is redefining solder with its InFORMS solder preforms. Read more...

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy. Read more...

Indium Corporation has released a new high-reliability alloy with enhanced thermal cycling performance specially formulated for harsh environments. Read more...

Indium Corporation now offers precision AuSn preforms—AuLTRA^® ThInFORMS™—for die-attach applications Read more...

Indium Corporation’s Core 230-RC is specially developed to meet the demanding requirements of robotic and laser soldering. Fully REACH- and RoHS-compliant, it delivers an impressive <1% total flux spatter, as tested per IPC TM-650 2.4.48 standards. Read more...

MacDermid Alpha has high reliability material solutions for electronic assemblies used in a broad range of 5G related equipment; from wearable and handheld mobile devices to antennas and high speed infrastructure hardware. Download new brochure. Read more...

Drop shock is a concern in reliability in the electronics we rely on every day. Solder joints provide the electrical and mechanical bridge between the package & board assembly, and their integrity is vital. Read about the testing on Durafuse^™ LT Read more...

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Read more...