MacDermid Alpha Electronics Solutions

Solder ball formation during reflow or wave soldering is the result of uneven solder particle melt due to an oxide layer or unwettable surfaces. Whether the defect is random, non-random, or a result of splash back, Alpha offers on-site expertise to combat these problems Read more...

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Indium Corporation

Indium Corporation now offers precision AuSn preforms—AuLTRA™ ThInFORMS™—for die-attach applications Read more...

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Indium Corporation

Drop shock is a concern in reliability in the electronics we rely on every day. Solder joints provide the electrical and mechanical bridge between the package & board assembly, and their integrity is vital. Read about the testing on DurafuseLT Read more...

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Indium Corporation

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Read more...

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MacDermid Alpha Electronics Solutions

ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... Read more...

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Indium Corporation

Indium Corporation’s ultrafine flux-cored wire was developed to meet the progressively demanding requirements for increased solder joint density and miniaturization in applications where solder paste reflow and other soldering approaches are not effective, such as robotic soldering, fine-pitch component attachment, and hand soldering. Read more...

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Indium Corporation

With the vast amount of electronics now in our cars & trucks, ensuring the performance of those systems is vital. Indium has proven their commitment to supplying the best, high-reliability materials & products for vehicle applications by achieving IATF 16949, meeting the highest standard for automotive industry Read more...

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Indium Corporation

One of the key hurdles in product development is being able to test a variety of options at a reasonable cost. With our Solder Ribbon Selector Kits you can select various assembly solders to experiment with, then choose the one that works best in your application. Read more...

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MacDermid Alpha Electronics Solutions

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). Read more...

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MacDermid Alpha Electronics Solutions

ALPHA® PowerBond® Solder Preforms are based on a family of lead-free, high-reliability alloys with Antimony (Sb) content ranging from 5-10%. They are well suited for automotive and power semiconductor applications. Read more...

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