Indium Corporation

Indium Corporation’s high-temperature AuSn (Eutectic Gold Tin) preforms have the highest tensile strength of any solder, ensuring high-reliability for joining and sealing. The semiconductor-grade AuSn preforms are designed to meet industry challenges as devices continue to get smaller, with increasing power density and power ratings. Read more...

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Indium Corporation

Indium Corporation has released a new low-temperature solder paste specifically developed to minimize solder beading and solder balling. Indium5.7LT-1 is an air reflow, halogen-free, no-clean solder paste designed for low-temperature assembly processes using indium and bismuth alloys. Read more...

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MacDermid Alpha Electronics Solutions

ALPHA® Exactalloy® Preforms in tape and reel packaging are used with solder paste to selectively increase solder volume using standard pick and place equipment.

The preform is placed directly into the solder paste prior to assembly reflow. Alpha Solder Preform Tape & Reel packaging provides you with a time-to-market advantage, solving y... Read more...

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Indium Corporation

Indium Corporation’s ultrafine flux-cored wire was developed to meet the progressively demanding requirements for increased solder joint density and miniaturization in applications where solder paste reflow and other soldering approaches are not effective, such as robotic soldering, fine-pitch component attachment, and hand soldering. Read more...

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Indium Corporation

The most common melting temperature range for standard solders (like SnPb or SnPbAg) is in the 180°C to 190°C range, and the most popular Pb-free alloys melt in the 220°C to 225°C. But, what do you do if you need a solder that reflows at a lower temperature? Read more...

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Indium Corporation

Avoid shortened product life; avoid field failures; avoid customer dissatisfaction, plus a whole lot more with Indium Corporation’s advanced solder paste technology. Our suite of solder pastes offers formulations that deliver low-voiding, plus enhanced benefits such as improved response-to-pause, stability, HiP minimization, reliable in-circuit testing, and enhanced SIR performance. Read more...

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Indium Corporation

With the vast amount of electronics now in our cars & trucks, ensuring the performance of those systems is vital. Indium has proven their commitment to supplying the best, high-reliability materials & products for vehicle applications by achieving IATF 16949, meeting the highest standard for automotive industry Read more...

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Indium Corporation

Solder Preforms come in standard shapes such as squares, rectangles, washers and discs. Typical sizes range from .010" (.254mm) up to 2" (50.8mm). Smaller and larger sizes, as well as custom shapes, are also available. Dimensions can be held to tight tolerances to assure volume accuracy. Read more...

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Indium Corporation

One of the key hurdles in product development is being able to test a variety of options at a reasonable cost. With our Solder Ribbon Selector Kits you can select various assembly solders to experiment with, then choose the one that works best in your application. Read more...

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MacDermid Alpha Electronics Solutions

Alpha Assembly Solutions, the world leader in the production of electronic soldering and bonding materials, has recently introduced ALPHA® AccuFlux™ BTC-578 Solder Preforms, designed to enhance reliability and heat transfer through the reduction of voiding under bottom termination components (BTC). Read more...

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