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Epoxy Adhesives

Two Part Epoxy Adhesive is consists of two separate components: a resin and a hardener. These components are typically stored in separate containers and are mixed together in a specific ratio just prior to use, a chemical reaction is initiated, leading to the curing and hardening of the adhesive, causing it to cross-link and form a strong, durable bond. Read more...

Epoxy adhesives are high-performance adhesives often used in carpentry and woodworking or for specialized creative uses like making costume jewelry. Read more...

When it comes to bonding plastic surfaces, epoxy glue can be a suitable option. Epoxy adhesives are known for their strength, durability, and versatility, making them effective for bonding various types of plastics. Read more...

SMT epoxy adhesive refers to a type of adhesive that is specifically designed for use in surface mount technology (SMT) applications. SMT is a method used in electronics manufacturing where components are directly mounted onto the surface of a printed circuit board (PCB) rather than being inserted through holes in the board. Read more...

Shenzhen DeepMaterial Technologies Co., Ltd is flip chip bga underfill epoxy material and epoxy encapsulant manufacturer in china,manufacturing underfill encapsulants,smt pcb underfill epoxy,one component epoxy underfill compounds,flip chip underfill epoxy for csp and bga and so on. Read more...

The one component epoxy adhesive bonding method is a popular technique for bonding a wide range of materials. One component epoxy adhesives are pre-mixed and come in a single container, making them easy to use and convenient for bonding applications. Read more...

Super Glue Plastic Fusion Epoxy Adhesive is a type of adhesive designed specifically for bonding plastic materials. It is a two-part epoxy adhesive, which means it consists of two components that need to be mixed together before use. Read more...

DeepMaterial offers new capillary flow underfills for flip chip, CSP and BGA devices. DeepMaterial’s new capillary flow underfills are high fluidity, high-purity, one-component potting materials that form uniform, void-free underfill layers that improve the reliability and mechanical properties of components by eliminating stress caused by solder materials... Read more...

One component epoxies, (also called single part epoxies, one part epoxies, 1K or 1-C or heat cured epoxy) contain latent hardeners. Latent hardeners are mixed into the epoxy resin and have very limited reactivity at ambient temperature. They react at elevated temperature to cure the epoxy adhesive. Read more...

This product is a one component heat curing epoxy with good adhesion to a wide range of materials. A classic underfill adhesive with ultra-low viscosity suitable for most underfill applications. The reusable epoxy primer is designed for CSP and BGA applications. Read more...