This alumina (Al₂O₃) porous ceramic disc series is designed for precision vacuum adsorption and air floating applications in semiconductor and advanced manufacturing environments. Featuring a uniform porous structure, the ceramics enable stable vacuum holding force and evenly distributed airflow, ensuring non-contact, damage-free handling of wafers, panels, and thin substrates. Read more...
More Product Announcements from Xiamen Innovacera Advanced Materials Co., Ltd.INOVACERA’s small high-voltage feedthrough is an electrical penetration device specifically designed for high-vacuum environments, primarily used to safely and hermetically transmit high-voltage power or high-voltage electrical signals from the atmospheric side into the interior of a vacuum chamber while maintaining system vacuum integrity and insulation performance. Read more...
More Product Announcements from Xiamen Innovacera Advanced Materials Co., Ltd.From LEDs to IGBTs: Customized ceramic substrates meet diverse power and size requirements Read more...
More Product Announcements from Xiamen Innovacera Advanced Materials Co., Ltd.Aluminum Nitride Wafer Substrates are a crucial component in the semiconductor industry, known for their exceptional thermal and electrical properties. Aluminum Nitride (AIN) materials have gained prominence due to their compatibility with silicon, making them ideal for a variety of wafer-related applications. Read more...
More Product Announcements from Xiamen Innovacera Advanced Materials Co., Ltd.Innovacera Ceramic Thermally Conductive Interface Pads are designed to provide a preferential heat-transfer path between heat-generating components, heat sinks, and other cooling devices. The pads are used to fill air gaps caused by imperfectly flat or smooth surfaces, which should be in thermal contact. Read more...
More Product Announcements from Xiamen Innovacera Advanced Materials Co., Ltd.High-precision PTFE ball valve seats ensure reliable sealing in all climates, reducing leakage and enhancing valve performance across chemical and industrial applications. Read more...
More Product Announcements from Jinshiling (Heyuan) Technology Co., Ltd.Our innovative 2-in-1 conductive thermal pad combines EMI shielding and thermal management in a single solution for BMS. It eliminates separate materials, simplifies assembly, reduces BOM complexity, and enhances reliability in EVs. This space-saving technology ensures optimal thermal performance and electromagnetic protection. Read more...
More Product Announcements from Dongguan Sheen Electronic Technology Co., Ltd.Modern electronics are shrinking, making traditional screws and clips a bottleneck in both design and assembly. Sheen Technology’s thermally conductive double-sided tape solves this by combining high-strength structural adhesion with efficient heat transfer. Read more...
More Product Announcements from Dongguan Sheen Electronic Technology Co., Ltd.In the digital age, tablets have become indispensable tools in both daily life and professional work. As these devices grow more powerful, user expectations for performance and experience continue to rise. Read more...
More Product Announcements from Dongguan Sheen Electronic Technology Co., Ltd.For surgical robots & 5G-connected medical devices: Our thermal interface materials eliminate interface gaps, cut thermal resistance, and lock in stable, accurate performance—critical