The EPCS4SI8N is a reliable, high-speed configuration device offering 4Mb memory in a compact 8-SOIC package. Ideal for medical, video processing, and surveillance applications. Read more...
More Product Announcements from Win Source ElectronicsThe 57401AW/883B is a 64 x 4 asynchronous FIFO memory chip, designed for uni-directional data flow and ideal for real-time data acquisition, embedded systems, and communication systems. Read more...
More Product Announcements from Nova Technology(HK) Co.,LtdThe W25Q32JVSSIQ from Winbond is a high-performance 32Mb SPI NOR flash memory chip offering fast data transfer, high-speed performance, and broad temperature compatibility for embedded systems, communication devices, and consumer electronics. Read more...
More Product Announcements from Nova Technology(HK) Co.,LtdInfineon CY62256NL-70PXC is a 256Kbit asynchronous SRAM with 70ns access time, 4.5V–5.5V supply, and a 28-DIP package. Ideal for legacy systems needing fast, volatile data storage. Read more...
More Product Announcements from Win Source ElectronicsThe AT25DF011-MAHN-T is a high-speed 1Mbit SPI Flash memory from Renesas, ideal for space-constrained applications with its compact 8-UDFN package. Read more...
More Product Announcements from Shenzhen Shengyu Electronics Technology LimitedDiscover the S29AL008D90MFI010, a reliable 1MB Flash Memory Chip from Spansion. Ideal for various applications, it features a limited supply and medium market popularity. Read more...
More Product Announcements from Win Source ElectronicsThe Optimon 5D turnkey imaging module - simultaneously delivering 2M vision and 3D depth data
Optimom™ 5D is a unique new turnkey imaging module featuring our recently announced Topaz5D™ image sensor, a compact board, standard MIPI-CSI2 interface and a pre-assembled lens. This comprehensive and truly innovative board-level vision extension seamlessly integrates full-HD... Read more...
More Product Announcements from Teledyne e2v SemiconductorsThe DS1260-100 from Analog Devices is a 3V smart battery IC in a 16-DIP package, designed for reliable battery management and memory applications. Read more...
More Product Announcements from Quarktwin Technology Ltd.How modern multi-core space processors increase data throughput with lossless compression Read more...
More Product Announcements from Teledyne e2v SemiconductorsDiscover why we recently switched to organic packages for our components, what are the implications, and how we work to keep the reliability at its maximum. Read more...
More Product Announcements from Teledyne e2v Semiconductors