Our unique product, SARCON is an advanced silicone rubber with high thermal conductivity and superior flame retardancy.

SARCON's versatility in thermal management applications is doubly enhanced by way of the variety of end-use configurations possible, and the many standard material formulations available in each. The silicone rubber-based materials offer other useful elements suc... (read more)

MORE CONDUCTIVITY - LESS COMPRESSION

Thermal gap fillers are used to fill air gaps between components in an
electronic assembly or electronic system to enhance thermal
behavior. These materials are ideal for filling gap openings that result
from design restraints that don’t allow for direct contact of the heat
source and cold surface. Thermal gap fillers... (read more)

Highly Comfortable, Non-Flammable, Isolation and High Heat Conducting Gel materials.

Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities.

​The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements.

This product has a lower specific gravity a... (read more)

Automotive

In addition to our many years of experience for motor vehicles, we will contribute to society with products such as Fujipoly’s heat-dissipating sheets in technological innovations such as electrification and autonomous driving of motor vehicles that will continue to evolve in the future. (read more)

Fujipoly^® offers an assortment of standard as well as custom size molded Sarcon^® Cases. The thermally conductive, box-shaped components are open on one end to facilitate fast and easy installation over transistors and other heat generating components. Once installed, Fujipoly’s unique thermally conductive silicone-based materials efficiently remove exc... (read more)

Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... (read more)

The SARCON^® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON^® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to... (read more)

Highly Conformable and Non-Flammable, Higher Thermal interface materials (read more)

Complex shapes of silicone rubber consisting of different properties such as conductive and non-conductive segments, or color coding. Specifically custom designed to eliminate multiple extruded components by combining different elements into one unitized design.

APPLICATIONS:

• RFI/EMI gaskets and shielding
• Electrostatic discharge (ESD)
• Electric...

Sheet CF210A features double sticky surfaces and ultra high Thermal Conductivity at 21W/m-K based on ASTM D5470. (read more)

Highly Conformable, Non-Flammable, Isolation and High Heat Conducting Gel materials.

• Gap filler materials are supplied in a fully cured state and remain pliable, easy conforming to minute surface irregularities.

• The basic Gap Filler Pad series can be further enhanced for special handling and die-cutting requirements. (read more)

Check out Fujipoly's SARCON^® & ZEBRA sample kits below! With our sample boxes, you can test the performance properties of multiple materials to find the perfect option for your specific application. Request yours today. Simply fill out the form below and well ship right to your door!

Please note, we will only ship this sample kit to North American custome... (read more)

Non-Flammable 13-Watt Thermal Gap Filler (read more)

ON DEMAND WEBINAR: Challenges and Solution for Pick and Place Automation of Thermal Gap Filler Pads Automation in electronics manufacturing is nothing new, but today many thermal gap filler pads are still placed by hand. With an increasing demand for automation the need to incorporate gap filler pad installation into automated processes is growing. In this webinar we will... (read more)

The SARCON^® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON^® LG23A and LG30A easily dispense in a liquid form that will cure at room temperature or can be dramatically accelerated with exposure to... (read more)

Fundamentals of Heat Transfer in Thermal Interface
Gap Filler Materials (read more)

Complex shapes of silicone rubber consisting of different properties such as conductive and non-conductive segments, or color coding. Specifically custom designed to eliminate multiple extruded components by combining different elements into one unitized design.

Quick turnaround and cost-effective tooling preparation for your proprietary needs. For engineering assistance and more... (read more)

Introduction - Compression characteristics are a key function of gap fillers. Unlike thermal greases, the applications for gap fillers are quite different. Being mindful of compression characteristics and the factors that impact stress is important during the design phase to avoid over-stressing the printed circuit board (PCB).

What are Gap Fillers? Gap fillers are a... (read more)

SARCON^® PG65A from Fujipoly^® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible.

This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extremely low material compression. This low modulus thermal gap filler also... (read more)

ZEBRA^® Elastomeric Connectors

ZEBRA^® Elastomeric Electronic Connectors are a comprehensive group of high performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained.

ZEBRA^® E... (read more)

The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints as the in... (read more)

SARCON^® & ZEBRA^® Sample Kits

Check out Fujipoly's SARCON^® & ZEBRA sample kits below! With our sample boxes, you can test the performance properties of multiple materials to find the perfect option for your specific application. Request yours today. Simply fill out the form below and well ship right to your door!

Pl... (read more)

This paper focuses on the primary function of a thermal gap filler – its ability to transfer heat from one surface to another. The selection process for a gap filler can sometimes be confusing because most thermal considerations are left to the end of the design cycle when the selection process must be performed under a tight schedule. This paper will describe steps to making the s... (read more)

The complexity of a modern automobile’s infotainment system is truly remarkable. At the touch of a button or the swipe of a finger, consumers expect a fully integrated electronics suite that manages communications, navigation, entertainment, and environmental controls as well as numerous vehicle systems. These complex units pose significant thermal management challenges, considerin... (read more)

SARCON^® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma... (read more)

To Request a sample - click here

CF210A Carbon Fiber Thermal Gap Fillers

• CF210A is the newest Fujipoly thermal gap filler
• CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials.
• CF210A is rated at 21 W/m•K
• Compliance is closer to a much lower conductivity gap filler (Fujipoly- Sa... (read more)

Fujipoly® recently released SARCON® GR100A series, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.05 K-in2/W at 72.5 PSI with a thermal conductivity of 10 W/m°K.

SARCON® GR100A is available in five thicknesses (0.3, 0.5, 1.0, 1.5, and 2.0mm) up to a maximum dimension of 300mm x 2... (read more)

Fujipoly America introduces SARCON® CF210A, the newest Fujipoly thermal gap filler. CF210A incorporates carbon fibers along with traditional fillers found in thermal gap filler materials. The carbon fibers allow for higher thermal conductivity while remaining compliant. SARCON® CF210A’s compliance is closer to a much lower conductivity gap filler such as SARCON® PG25A.... (read more)

Fujipoly America introduces SARCON® GR25B. This advanced silicone, gel-like thermal interface material delivers a thermal conductivity of 2.5 W/m•K and is a popular choice for higher power electronics applications. GR25B is offered in double sticky surfaces, hardened surfaces for easier handling, with polyester mesh to prevent stretching or with both hardened surface and mesh fo... (read more)

Highly Conformable and Non-Flammable 13-Watt Thermal Gap Filler

SARCON^® PG130A from Fujipoly^® is one of the industry’s newest high-performance thermal interface materials that is extremely compressible. This double-sticky surface TIM is a great choice for applications that have delicate or wide-variation component heights and require extr... (read more)

Newest Silicone Gap Filler Transfers Heat and Absorbs Electromagnetic Waves

Fujipoly^® introduces a new thermal interface material that also absorbs a wide range of unwanted electromagnetic energy. The tacky, gel-like consistency of SARCON^® EGR30A makes it easy to handle and apply without requiring additional adhesive. When placed on top of a he... (read more)

Superior Thermal Transfer from New Form-In-Place Gap Filler

Fujipoly^® America announces the release of its new SARCON^® SPG-70A. It is a high flow rate, high heat transferring compound that exhibits a thermal conductivity of 7.0 W/m°K and has the lowest thermal resistance among our dispensable SPG products. When applied between heat-generating comp... (read more)

Sarcon^® GR14B from Fujipoly^® is a low oil bleed/low specific gravity gap filler pad material that is offered in sheets or custom shapes to fit your exact application. This material is perfect for cost-sensitive, lower-power applications that do not require high conductivity. When placed between heat-generating components and a nearby heatsink, this 0.5mm thi... (read more)

SARCON^® PG45A from Fujipoly® is one of the industry’s newest high-performance thermal interface materials that exhibits a very low compression force even at high compression rates. This makes the putty-like TIM a great choice for applications that have delicate or wide-variation component heights and require material compression up to 90%. This low modulus therma... (read more)

Fujipoly® introduces a new line of two-component thermal gap fillers that also exhibit excellent electrical insulative properties. The SARCON® LG Series is the perfect solution for filling large, complex and uneven gaps between heat generating components that depend on reliable contact with a heat spreader to maintain optimal performance.

SARCON® LG23A and LG30A easily... (read more)

Fujipoly® tube-shaped thermal interface covers provide an easy way to improve transistor cooling while streamlining your manufacturing process. Sarcon® tubes and sleeves are available in several standard sizes to fit many common transistor types and can be custom ordered to your exact specifications. Installation takes seconds by sliding the tube over the heat-generating componen... (read more)

New 4.5-Watt Thermal Putty

Fujipoly® introduces Sarcon® PG45A its newest high-performance, putty-like thermal interface material. This extremely low modulus gap filler exhibits a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 4.5 W/m°K.

Sarcon® PG45A requires very low compression force at high compression rates... (read more)

New 13-Watt Thermal Gap Filler

Fujipoly® recently released Sarcon® GR130A, its newest high-performance, thermal gap filler pad. The highly conformable, gel-like sheets exhibit a thermal resistance as low as 0.02°C•in2/W at 43.5 PSI with a thermal conductivity of 13 W/m°K.

Sarcon® GR130A is available in five thicknesses (0.3, 0.5, 1.0, 1.5, and 2.0mm... (read more)

New Sarcon® Sample Kit

Fujipoly® recently introduced a comprehensive engineering kit that includes free samples of (20) different Sarcon® Thermal Interface Materials. The sample kit gives engineers the flexibility to test the performance properties of multiple Sarcon® materials in order to find the perfect option for their application. The wide selection of product... (read more)

ZEBRA® Elastomeric Connectors ZEBRA® Elastomeric Electronic Connectors are a comprehensive group of high performance interconnect devices with applications throughout the entire field of electronics. With the expansion of micro-electronics and miniaturization of all products, the same high reliability must be maintained.

ZEBRA® Elastomeric Connectors are an obv... (read more)

Sarcon® 30YR-c from Fujipoly® is a compliant silicone thin film that is ideal for filling near-microscopic air gaps that exist between high-power heat generating components and heatsinks. By increasing surface area contact, it is possible to measurably improve cooling effectiveness and operational performance.

Sarcon® 30YR-c is a high-performance 0.3mm thick material t... (read more)

The compression characteristics of thermal gap fillers should be key considerations during a product’s early design phase. For applications that have delicate components or widely varying gap distances, Fujipoly® created a line of Low Compression Force gap filler pads. These TIMs help avoid overstressing the printed circuit board (PCB) and fragile solder joints as the in... (read more)

In an effort to streamline your manufacturing process and improve transistor cooling, Fujipoly® offers a large assortment of box-shaped Sarcon® thermal interface caps. These cases are available in standard sizes to fit many transistors and can be custom ordered to your exact specifications. Installation takes seconds by sliding over the heat-generating component. Once fitted, unw... (read more)

Fujipoly® offers a large selection of thin film, thermal interface materials. Available in eight formulations, these Sarcon® materials offer versatility in managing heat dissipation while exhibiting useful characteristics such as electrical insulation, and UL94 VO flammability.

The Sarcon® series of thin films range in thickness from 0.15mm to 0.85mm. Depending on the... (read more)

Fujipoly® Zebra® Gold 8000A elastomeric connectors transfers both data and power between parallel components and circuit boards while exhibiting a remarkably low electrical resistance of less than 25mΩ.

This interconnect component is constructed from a low durometer silicone core that is wrapped with 100 parallel rows of flat, gold-plated copper wires per inch. This... (read more)

Fujipoly® recently published a video that demonstrates and explains compression testing for thermal interface materials. (read more)

Sarcon® 15GTR from Fujipoly® is a thin, thermal interface composite film made from heat-conducting silicone and a .05mm fiberglass reinforcement layer. The general-purpose, .15mm thick film is ideal for applications with complex die-cut shapes. (read more)

Fujipoly recently added an Engineering Resource section to its website. This technical information library gives engineers unrestricted access to useful whitepapers and webinars as well as an extensive collection of Sarcon® thermal interface material performance datasheets.

The whitepapers cover topics such as the Compression Characteristics of Thermal Interface Gap Fil... (read more)