Casting Resin / Two-part (A+B) EMI and RFI Shielding
from Master Bond, Inc.
Master Bond Polymer System EP21TDC-7 is a two component highly flexible epoxy resin system for high performance bonding, sealing, and coating. It is formulated to cure at ambient temperatures or more quickly at elevated temperatures with an easy to use one to seven mix ratio by weight. The cured... [See More]
- Type / Form: Casting Resin
- Use Temperature: -100 to 250
- Material System: Plastic; Thermally cured
- Features: Electrically Conductive
from Master Bond, Inc.
Master Bond Polymer System EP21CLV compound is a two component epoxy compound for general purpose bonding or casting formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more... [See More]
- Type / Form: Casting Resin
- Use Temperature: -60 to 250
- Material System: Plastic; Thermally cured
- Features: Electrically Conductive
from Master Bond, Inc.
Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The optimum... [See More]
- Type / Form: Casting Resin; Thermally Conductive or Thermal Interface Material
- Features: Electrically Conductive
- Material System: Metal; Plastic; Thermally cured
from Epoxy Technology
EPO-TEK ® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical, electrical, and... [See More]
- Type / Form: Casting Resin; Thermally Conductive or Thermal Interface Material
- Use Temperature: 482
- Material System: Metal; Plastic; Thermally cured
- Features: Electrically Conductive