Tape Reel Ceramic Capacitors

Capacitor Array, 0.01Uf, 50V, X7R, 20%, 0612; Capacitance Avx -- 55J0165 [W3A45C103MAT2A from AVX Corporation]
from Newark, An Avnet Company

CAPACITOR ARRAY, 0.01UF, 50V, X7R, 20%, 0612; Capacitance:0.01 µF; Capacitance Tolerance: ± 20%; Capacitor Case Style:0612 [1632 Metric]; Capacitor Dielectric Type:Ceramic; Capacitor Mounting:SMD; Capacitor Terminals:SMD; No. of Pins:2RoHS Compliant: Yes [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic
  • Configuration / Form Factor: Chip Capacitor; SMD
  • Capacitance Type: Fixed
AEC-Q200 Multi-Layer Ceramic Capacitor, High Q -- X8G HiQ
from Knowles Precision Devices

The AEC-Q200 Ultra-Low ESR X8G range offers a very stable X8R High Q material system that provides excellent low loss performance. The range is tested and approved to automotive specification AEC-Q200. Optimized for lowest possible ESR, the electrode system provides low metal losses resulting in... [See More]

  • Packing Method: Tape Reel; Tray (optional feature); Bulk (optional feature)
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition; X8R
Ceramic Multilayer Capacitor (P90 & NP0) -- 600L0R2AT200T1 [600L0R2AT200T from American Technical Ceramics Corp.]
from Richardson RFPD

Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Technology: Multilayer
  • Capacitance Range: 2.00E-7
Capacitor Networks, Arrays -- 1276-2390-1-ND [CL14A105MA5NANC from Samsung Electro-Mechanics]
from Digi-Key Electronics

CAP ARRAY 1.0UF 25V X5R 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
Capacitor Ceramic 2200Pf, 50V, X7R, +50,-20%, 1206; Capacitance Avx -- 23C9959 [W3F15C2228AT1A from AVX Corporation]
from Newark, An Avnet Company

CAPACITOR CERAMIC 2200PF, 50V, X7R, +50,-20%, 1206; Capacitance:2200pF; Capacitance Tolerance:+50%, -20%; Capacitor Case Style:1206 [3216 Metric]; Capacitor Dielectric Type:Ceramic; Capacitor Mounting:SMD; Capacitor Terminals:SMD RoHS Compliant: Yes [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic
  • Configuration / Form Factor: Chip Capacitor; SMD
  • Capacitance Type: Fixed
Non-Magnetic Multi-Layer Ceramic Capacitor
from Knowles Precision Devices

Made from highly stable, low loss dielectric formulations, these traditional porcelain MLCs are known for their high RF power handling capability. Available in all industry common case sizes. The special silver-palladium termination and the proprietary ceramic formulations guarantee consistent... [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Technology: Multilayer
  • Capacitance Type: Fixed
Capacitor Networks, Arrays -- 1276-2391-1-ND [CL14A105MO5NANC from Samsung Electro-Mechanics]
from Digi-Key Electronics

CAP ARRAY 1.0UF 16V X5R 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
Single Layer Capacitor, High Reliability -- Bar Cap®
from Knowles Precision Devices

Bar-Caps are specifically designed for MMIC circuits, require multiple capacitors. Multi-Array capacitors have been essential due to High Q & Low inductance. Benefits: Can be integrated into IC package. Offers next level assembly performance improvement. Single insertion reduces complexity and... [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 1276-2392-1-ND [CL14A105MO8NANC from Samsung Electro-Mechanics]
from Digi-Key Electronics

CAP ARRAY 1.0UF 16V X5R 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
Single Layer Capacitor, High Reliability -- Bi-Cap®
from Knowles Precision Devices

Small size is compatible with microwave geometrics. Ideal for prototype circuits. Benefits: Fine Tuning. Well-suited with microwave geometries. Ideal for trimming, tuning or aiding with breadboard applications. [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 1276-2452-1-ND [CL21B104MOCNBNC from Samsung Electro-Mechanics]
from Digi-Key Electronics

CAP ARRAY 0.1UF 16V X7R 0805 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
Single Layer Capacitor, High Reliability -- Border Cap®
from Knowles Precision Devices

High Performance and High Frequency Single Layer Capacitors for RF Microwave and Millimeter-Wave Applications. The Border-Cap is a conventional parallel plate capacitors with recessed metallization on one or both sides. Bene fits: Recessed metallization reduces potential of shorting during die... [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 1276-2741-1-ND [CL31B104KACNBNC from Samsung Electro-Mechanics]
from Digi-Key Electronics

CAP ARRAY 0.1UF 25V X7R 1206 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
Single Layer Capacitor, High Reliability -- Di-Cap®
from Knowles Precision Devices

High Performance and High Frequency Single Layer Capacitors for RF Microwave and Millimeter-Wave Applications. The Di-Cap is a conventional parallel plate capacitors with metallization to the edge. Benefits: Gold metallization for wire bonding. Rugged construction. Thin film Technology. [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 13-CA0508KRNPO9BN101CT-ND [CA0508KRNPO9BN101 from Yageo USA]
from Digi-Key Electronics

CAP ARRAY 100PF 50V NPO 0508 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Single Layer Capacitor, High Reliability -- Gap Cap
from Knowles Precision Devices

Series Configured Capacitors for Microwave Applications. The products unique configuration eliminates the need for wirebonding thus reducing performance variations. Benefits: Consistent performance. Eliminates the need for wirebonding. Low Insertion Loss [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 13-CA0612JRNPO9BN101CT-ND [CA0612JRNPO9BN101 from Yageo USA]
from Digi-Key Electronics

CAP ARRAY 100PF 50V NP0 0612 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Single Layer Capacitor, High Reliability -- T-Cap®
from Knowles Precision Devices

A reliable solution in DC Blocking and RF Bypassing Applications. Mirrors Di-Cap technology and processing with one difference it provides a consistent physical size. Benefits: Gold Metallization for wire bonding. Consistent resonance performance at microwave frequencies. Repeatable lot to lot... [See More]

  • Packing Method: Tape Reel
  • Technology: Single-Layer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor Networks, Arrays -- 1761-P21BNL300MA04282TCT-ND
from Digi-Key Electronics

CAP ARRAY 30PF 10V X5R 0201 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 3.00E-5
Capacitor Networks, Arrays -- 1761-P42BNL820MA3152TCT-ND
from Digi-Key Electronics

CAP ARR 82PF .22UF 10V X5R 0402 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 8.20E-5
Capacitor Networks, Arrays -- 1761-P62BNL820MA2636TCT-ND
from Digi-Key Electronics

CAP ARRAY 82PF .1UF 10V X7R 0603 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 8.20E-5
Capacitor Networks, Arrays -- 399-10024-1-ND [CA052X104K5RAC7800 from KEMET Electronics Corporation]
from Digi-Key Electronics

CAP ARRAY 0.1UF 50V X7R 0508 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
Capacitor Networks, Arrays -- 399-10025-1-ND [CA064C100K5GAC7800 from KEMET Electronics Corporation]
from Digi-Key Electronics

CAP ARRAY 10PF 50V NP0 0612 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-5
Capacitor Networks, Arrays -- 399-CA064C101K3GACAUTOTR-ND [CA064C101K3GACAUTO from KEMET Electronics Corporation]
from Digi-Key Electronics

CER CAP [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Capacitor Networks, Arrays -- 399-CA064X100J5GACTUCT-ND [CA064X100J5GACTU from KEMET Electronics Corporation]
from Digi-Key Electronics

CAP ARRAY 10PF 50V C0G/NP0 1206 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-5
Capacitor Networks, Arrays -- 445-10058-1-ND [CKCA43CH1H100F100AA from TDK U.S.A. Corporation]
from Digi-Key Electronics

CAP ARRAY 10PF 50V CH 1206 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-5
Capacitor Networks, Arrays -- 445-10088-1-ND [CKCL22C0G1H100F085AK from TDK U.S.A. Corporation]
from Digi-Key Electronics

CAP ARRAY 10PF 50V NP0 0805 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-5
Capacitor Networks, Arrays -- 478-11155-1-ND [W2A4YC104KAT2A from AVX Corporation]
from Digi-Key Electronics

CAP ARRAY 0.1UF 16V X7R 0508 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
Capacitor Networks, Arrays -- 478-11165-1-ND [W3A41C102KAT2A from AVX Corporation]
from Digi-Key Electronics

CAP ARRAY 1000PF 100V X7R 0612 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-3
Capacitor Networks, Arrays -- 478-2884-2-ND [W1A2ZD104MAT2A from AVX Corporation]
from Digi-Key Electronics

CAP ARRAY 0.1UF 10V X5R 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
Capacitor Networks, Arrays -- 490-3399-1-ND [GNM1M2R71E222MA01D from Murata Electronics]
from Digi-Key Electronics

CAP ARRAY 2200PF 25V X7R 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0022
Capacitor Networks, Arrays -- 490-3407-1-ND [GNM214R71H102MA01D from Murata Electronics]
from Digi-Key Electronics

CAP ARRAY 1000PF 50V X7R 0805 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-3
Capacitor Networks, Arrays -- 490-3413-1-ND [GNM212R61A105MA13D from Murata Electronics]
from Digi-Key Electronics

CAP ARRAY 1.0UF 10V X5R 0805 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
Capacitor Networks, Arrays -- 490-3416-1-ND [GNM314R72A271MD01D from Murata Electronics]
from Digi-Key Electronics

CAP ARRAY 270PF 100V X7R 1206 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 2.70E-4
Capacitor Networks, Arrays -- 587-1025-1-ND [U2K110CG100FB-T from Taiyo Yuden Co., Ltd.]
from Digi-Key Electronics

CAP ARRAY 10PF 50V NP0 0504 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-5
Capacitor Networks, Arrays -- 587-1041-1-ND [T2K212BJ105KD-T from Taiyo Yuden Co., Ltd.]
from Digi-Key Electronics

CAP ARRAY 1.0UF 25V X5R 0805 [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
CCD Series
from Trigon Components, Inc.

SERIES. CCD. DESCRIPTION. General Purpose Class I, II and III. CAPACITANCE RANGE. 0.5pF to 100000pF. VOLTAGE RATING. 16VDC to 10000VDC. OPERATING TEMPERATURE. -25 to +85 deg C. PACKAGE. Radial. FEATURE. Class 1: Temp. Compensation. •Linear Temp. coeff. Of capacitance. •High stability of... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Ceramic Capacitors
from KEMET Electronics Corporation

KEMET Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability and cost advantages for circuit designers. Our comprehensive line of surface mount and through-hole devices are utilized in a wide variety of computer, telecommunications,... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor; Chip Capacitor
  • Dielectric: Ceramic Composition
Disc Type Multilayer Ceramic Capacitor -- CC45SL3AD100JYVNA
from TDK Corporation

High Voltage (1000V and over), Low Dissipation [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic; .1uF;10%;16V;Cut-Tape -- 70002474 [0603YC104KAT2A from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CCD-1 Series
from Trigon Components, Inc.

SERIES. CCD-1. DESCRIPTION. Safety Certified Y1, Ceramic Disc. CAPACITANCE RANGE. 100pF to 4700pF. VOLTAGE RATING. 4000VAC for 1m. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Disc Type Multilayer Ceramic Capacitor -- CS45SL2GA150JAVKA
from TDK Corporation

Commercial Grade, Mid Voltage (100 to 630V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.01uF;10%;100V;Cut-Tape -- 70001141 [06031C103KAT2A from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0100
CCD-1 Series
from Trigon Components, Inc.

SERIES. CCD-1. DESCRIPTION. Safety Certified Y1, Ceramic Disc. CAPACITANCE RANGE. 100pF to 4700pF. VOLTAGE RATING. 4000VAC for 1m. OPERATING TEMPERATURE. -25 to +125 Deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK11C0G1H104JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.01uF;10%;50V;Cut-Tape -- 70001124 [08055C103KAT2A from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0100
CCD-2 Series
from Trigon Components, Inc.

SERIES. CCD-2. DESCRIPTION. Safety Certified Y2, Ceramic Disc. CAPACITANCE RANGE. 5.1pF to 1500pF. VOLTAGE RATING. 2600VAC for 1m. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK14C0G1H103JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.022uF;Chip;Case 1206;+/-10%;100V;SMD;Cut Tape -- 70001088 [12061C223KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0220
CCD-2 Series
from Trigon Components, Inc.

SERIES. CCD-2. DESCRIPTION. Safety Certified Y2, Ceramic Disc. CAPACITANCE RANGE. 5.1pF to 1500pF. VOLTAGE RATING. 2600VAC for 1m. OPERATING TEMPERATURE. -25 to +125 Deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK16C0G1H103JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;10%;50V;Cut-Tape -- 70002479 [08055C104KAT2A from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CCD-R Series
from Trigon Components, Inc.

SERIES. CCD-R. DESCRIPTION. Class II Epoxy Coated, Low Loss Low D.F. CAPACITANCE RANGE. 100pF to 10000pF. VOLTAGE RATING. 1000VDC to 3000VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. Low Dissipation Factor. •High Voltage. •IEC 384-9: 1988 (Fixed capacitors of... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK18C0G1H010CN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 0402;X5V;+/-10%;16WVDC;SMD;3.5% ,Cut Tape -- 70001158 [0402YG104ZAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Materials — General Purpose. Operating Temperature Range — –30 °C to +85 °C. Temperature Characteristic — +22 %, –82 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CCD-W Series
from Trigon Components, Inc.

SERIES. CCD-W. DESCRIPTION. Class II Epoxy Coated, Low D.F. CAPACITANCE RANGE. 820pF to 100000pF. VOLTAGE RATING. 1000VDC to 3000VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. High Voltage,Low D.F, High Stable,High Reliability. • Coated with flame-retardant epoxy... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK20C0G1H104JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 0805;+/-10%;25WVDC;SMD;X7R;cut tape -- 70001114 [08053C104KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CCD-Y Series
from Trigon Components, Inc.

SERIES. CCD-Y. DESCRIPTION. Class I Epoxy Coated, Wide Temperature. CAPACITANCE RANGE. 0.5pF to 1000pF. VOLTAGE RATING. 50VDC to 500VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. High Temperature Stable. • Established Reliability. • Coated with flame-retardant... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK22C0G1H154JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 0805;+/-20%;50WVDC;SMD;X7R;cut tape -- 70001095 [08055C104MAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CMCA Series
from Trigon Components, Inc.

SERIES. CMCA. DESCRIPTION. Axial Epoxy Coated. CAPACITANCE RANGE. 1pF to 2.2uF. VOLTAGE RATING. 50VDC to 100VDC. OPERATING TEMPERATURE. +10 to +85 °C. PACKAGE. Axial. FEATURE. •CMCR Axial leaded, Epoxy Coated Multilayer Ceramic Capacitors are building by superior moisture and shock... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK24C0G1H103JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 0805;+/-20%;50WVDC;SMD;Z5U;cut tape -- 70001175 [08055E104MAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials. Operating Temperature Range — +10 °C to +85 °C. Temperature Characteristic — +22 %, –56 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CMCR Series
from Trigon Components, Inc.

SERIES. CMCR. DESCRIPTION. Radial Epoxy Coated. CAPACITANCE RANGE. 1pF to 22.0uF. VOLTAGE RATING. 50VDC to 100 VDC. OPERATING TEMPERATURE. -55 to +125 deg C. PACKAGE. Radial. FEATURE. •CMCR Radial Leaded Multilayer Ceramic Capacitors has wide application computer, data processing,... [See More]

  • Packing Method: Tape Reel; Bulk
  • Dielectric: Ceramic Composition
  • Configuration / Form Factor: Leaded Capacitor
  • Capacitance Type: Fixed
Multilayer Ceramic Capacitor with Radial Leads -- FK26C0G1H103JN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 0805;+/-5%;50WVDC;SMD;X7R;cut tape -- 70001134 [08055C104JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CP0612 Series
from Trigon Components, Inc.

SERIES. CP0612. DESCRIPTION. Chip, Low ESL Performance. CAPACITANCE RANGE. 10nF to 150nF. VOLTAGE RATING. 50VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0612. FEATURE. •Standard size with thin thickness. •Small size with high capacitance. •Capacitor with lead-free... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Multilayer Ceramic Capacitor with Radial Leads -- FK28C0G1H010CN006
from TDK Corporation

General (Up to 50V) [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Leaded Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 1206;+/-10%;100V;SMD;+/-15%, X7R; Cut tape -- 70001091 [12061C104KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CPD Series
from Trigon Components, Inc.

SERIES. CPD. DESCRIPTION. Chip, Medium / High Voltage. CAPACITANCE RANGE. 100pF to 1.2uF. VOLTAGE RATING. 100VDC to 2000VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0805 to 2220. FEATURE. - Low ESR and Low Tan d. - Excellent DC Bias. - Provide Good Ripple Characteristic. - Excellent... [See More]

  • Packing Method: Tape Reel; Bulk
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;0.1uF;Chip;Case 1206;+/-10%;50V;SMD;X7R;cut tape -- 70002468 [12065C104KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.1000
CPH (Hi-V) Series
from Trigon Components, Inc.

SERIES. CPH (Hi-V). DESCRIPTION. Chip, High Voltage. CAPACITANCE RANGE. 10pF to 1.5uF. VOLTAGE RATING. 100VDC to 3000VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0603, 0805, 1206, 1210, 1808, 1812. FEATURE. Recommended Appliction: •Modems. •Telecom Devices. •LAN / WAN... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;10000pF;Chip;Case 1206;+/-10%;100V;SMD;+/-15%,cut tape -- 70002467 [12061C103KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0100
CPH (Y2) Series
from Trigon Components, Inc.

SERIES. CPH(Y2). DESCRIPTION. Chip, Safety Certified. CAPACITANCE RANGE. 3pF to 2200pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 1808, 1812, 2211. FEATURE. •TRIGON ’s Safety Certified Multilayer Ceramic chip capacitors are designed for surge or lightning... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;10000pF;Chip;Case 1206;+/-5%;100V;SMD;+/-15%, cut tape -- 70001161 [12061C103JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0100
CPH (Y3) Series
from Trigon Components, Inc.

SERIES. CPH(Y3). DESCRIPTION. Chip, Safety Certified. CAPACITANCE RANGE. 5pF to 1000pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 1808. FEATURE. •TRIGON Multilayer Ceramic chip capacitors supplied in bulk or tape & reel package are ideally suitable for... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;1000pF;Chip;Case 0603;0 +/-30ppm/degC, 5%, 50V, cut tape -- 70001131 [06035A102JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-3
CPH Series
from Trigon Components, Inc.

SERIES. CPH. DESCRIPTION. Chip. CAPACITANCE RANGE. 0.5pF to 100uF. VOLTAGE RATING. 4VDC to 50VDC. OPERATING TEMPERATURE. -55 to +125 deg C. PACKAGE. SMD 0201 to 1812. FEATURE. •Standard EIA Chip Size Available. •Wide range of capacitance 1.0pF – 3.3uF is available for various circuit... [See More]

  • Packing Method: Tape Reel
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;1000pF;Chip;Case 0805;+/-10%;50WVDC;SMD;X7R;cut tape -- 70001119 [08055C102KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-3
CPH(Y2) Series
from Trigon Components, Inc.

SERIES. CPH(Y2). DESCRIPTION. Safety Certified, Y2, Ceramic Chip. CAPACITANCE RANGE. 3pF to 2200pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125 Deg C. PACKAGE. SMD 1808 to 2211. FEATURE. •TRIGON ’s Safety Certified Multilayer Ceramic chip capacitors are designed for surge... [See More]

  • Packing Method: Tape Reel; Bulk
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;1000pF;Chip;Case 0805;0+/-30ppm/degC;+/-5%;50WVDC;Scut tape -- 70001103 [08055A102JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-3
CPH(Y3) Series
from Trigon Components, Inc.

SERIES. CPH(Y3). DESCRIPTION. Safety Certified, Y3, Ceramic Chip. CAPACITANCE RANGE. 5pF to 1000pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125 Deg C. PACKAGE. SMD 1808. FEATURE. •TRIGON Multilayer Ceramic chip capacitors supplied in bulk or tape & reel package are ideally... [See More]

  • Packing Method: Tape Reel; Bulk
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;100pF;Chip;Case 0402;NPO;+/-5%;50WVDC;SMD;2.5% ,cut tape -- 70002476 [04025A101JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
CPU Series
from Trigon Components, Inc.

SERIES. CPU. DESCRIPTION. Chip, High Power / High Q. CAPACITANCE RANGE. 0.5pF to 1000pF. VOLTAGE RATING. 25VDC to 50VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0402 to 2225. FEATURE. ?High Q value with high frequency from 1MHz ~ 3GHz. ?It has multi-layer monolithic structure and high... [See More]

  • Packing Method: Tape Reel; Bulk
  • Technology: Multilayer
  • Configuration / Form Factor: Chip Capacitor
  • Dielectric: Ceramic Composition
Capacitor, Ceramic;100pF;Chip;Case 0603;0 +/-30ppm/degC5%,100V, cut tape -- 70001155 [06031A101JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Capacitor, Ceramic;100pF;Chip;Case 0805;0+/-30ppm/degC;+/-5%;100WVDC;cut tape -- 70001048 [08051A101JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Capacitor, Ceramic;100pF;Chip;Case 1206;+/-5%;100V;SMD;Cut Tape -- 70001099 [12061A101JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.00E-4
Capacitor, Ceramic;150pF;Chip;Case 1206;+/-5%;100V;SMD;0+/-30ppm/degC, COG(NPO); -- 70001104 [12061A151JAT2A from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.50E-4
Capacitor, Ceramic;15pF;Chip;Case 0805;0+/-30ppm/degC;+/-5%;100WVDC;cut tape -- 70001115 [08051A150JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1.50E-5
Capacitor, Ceramic;1uF;Chip;Case 1206;+/-10%;25V;SMD;+/-15%, X7R;cut tape -- 70001083 [12063C105KAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic X7R
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 1
Capacitor, Ceramic;2200pF;Chip;Case 0805;0+/-30ppm/degC;+/-5%;50WVDC;cut tape -- 70001102 [08055A222JAT2A/BKN from AVX Corporation]
from Allied Electronics, Inc.

EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]

  • Packing Method: Tape Reel
  • Dielectric: Ceramic Composition; Ceramic NPO
  • Configuration / Form Factor: Chip Capacitor
  • Capacitance Range: 0.0022