Tape Reel Ceramic Capacitors
from Shenzhen Shengyu Electronics Technology Limited
ACST310-8BTR [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
from Knowles Precision Devices
The AEC-Q200 Ultra-Low ESR X8G range offers a very stable X8R High Q material system that provides excellent low loss performance. The range is tested and approved to automotive specification AEC-Q200. Optimized for lowest possible ESR, the electrode system provides low metal losses resulting in... [See More]
- Packing Method: Tape Reel; Tray (optional feature); Bulk (optional feature)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; X8R
from Richardson RFPD
Richardson RFPD, an Arrow Company, is a specialized electronic component distributor providing design engineers with deep technical expertise and localized global design support for the latest new products from the world's leading suppliers of RF, Wireless, Energy and Power Technologies. [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Technology: Multilayer
- Capacitance Range: 2.00E-7
from DigiKey
CAP ARRAY 1.0UF 25V X5R 0504 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1
from Win Source Electronics
Manufacturer: Kemet. Storage Condition: Dry storage cabinet & Humidity protection package. Win Source Part Number: 992133-C1632C100K5GAC7800. Packaging: Tape and Reel. Length: 3.2 mm. Number of Terminals: 8. Mounting: SMD (SMT). Capacitance: 10 pF. Tolerance: 10 %. Composition: Ceramic. Terminal... [See More]
- Packing Method: Tape Reel; Tape and Reel
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition
- Capacitance Range: 1.00E-5
from Utmel Electronic Limited
0.1 μF ±5% 25V Ceramic Capacitor X7R 0402 (1005 Metric) [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; CERAMIC
- Capacitance Range: 0.1000
from Shenzhen Shengyu Electronics Technology Limited
AUIRF7738L2TR [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from Knowles Precision Devices
Made from highly stable, low loss dielectric formulations, these traditional porcelain MLCs are known for their high RF power handling capability. Available in all industry common case sizes. The special silver-palladium termination and the proprietary ceramic formulations guarantee consistent... [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Technology: Multilayer
- Capacitance Type: Fixed
from DigiKey
CAP ARRAY 15PF 50V C0G/NP0 0508 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.50E-5
from Win Source Electronics
Manufacturer: Samsung Electro-Mechanics America, Inc. Win Source Part Number: 769423-CL21B104MOCNBNC. Series: CL. Packaging: Reel package. Package: 0805. Mounting: SMD. Capacitance: 0.1 μF. Tolerance: ±20%. Temperature Coefficient: X7R. Dielectric Material: Ceramic. Circuit Type: Isolated. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 0.1000
- Dielectric: Ceramic Composition
- WVDC: 16
from Utmel Electronic Limited
0201 51 pF 50 V ±2% Tolerance C0G/NP0 Surface Mount Multilayer Ceramic Capacitor [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; CERAMIC
from Shenzhen Shengyu Electronics Technology Limited
BTS5242-2L [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from Knowles Precision Devices
Bar-Caps are specifically designed for MMIC circuits, require multiple capacitors. Multi-Array capacitors have been essential due to High Q & Low inductance. Benefits: Can be integrated into IC package. Offers next level assembly performance improvement. Single insertion reduces complexity and... [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP CER AUTO 2.2NF 50V X7R 0612 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0022
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1000111-04025C332KAT2A. Packaging: Reel - TR. Voltage Rating: 50V. Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 3300pF. Tolerance: ±10%. Temperature Coefficient: X7R. Thickness (Max): 0.022" (0.56mm). Family... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 0.0033
- Dielectric: Ceramic Composition
- WVDC: 50
from Utmel Electronic Limited
0201 C; CBR 12pF Ceramic Multilayer Capacitor; 25V dc; +125C; C0G Dielectric; +/-5% [See More]
- Packing Method: Tape Reel; Cut Tape (CT)
- Dielectric: Ceramic Composition; Ceramic
- Technology: Multilayer
- RoHS Compliant: Yes
from Shenzhen Shengyu Electronics Technology Limited
MAX1836EUT50#TG16 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from Knowles Precision Devices
Small size is compatible with microwave geometrics. Ideal for prototype circuits. Benefits: Fine Tuning. Well-suited with microwave geometries. Ideal for trimming, tuning or aiding with breadboard applications. [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP CER ARRAY 10PF 100V NPO 0508 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1000251-06035A270J4T2A. Packaging: Reel - TR. Voltage Rating: 50V. Applications: Automotive. Mounting: Surface Mount, MLCC. Capacitance: 27pF. Tolerance: ±5%. Temperature Coefficient: C0G, NP0. Ratings: AEC-Q200. Thickness (Max): 0.035"... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 2.70E-5
- Dielectric: Ceramic Composition
- WVDC: 50
from Utmel Electronic Limited
0402 0.22 uF 6.3 V ±10 % Tolerance X5R SMT Multilayer Ceramic Capacitor [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; CERAMIC
from Knowles Precision Devices
High Performance and High Frequency Single Layer Capacitors for RF Microwave and Millimeter-Wave Applications. The Border-Cap is a conventional parallel plate capacitors with recessed metallization on one or both sides. Bene fits: Recessed metallization reduces potential of shorting during die... [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP ARRAY 30PF 10000PF 10V X5R [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 3.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1120709-06035C103KAT2A. Packaging: Reel. Mounting Style: SMT, MLCC. Applications: General Purpose. Capacitance: 10000pF. Tolerance: ±10%. Voltage - Rated: 50V. Temperature Coefficient: X7R. Family Name: X7R Dielectric. Categories:... [See More]
- Packing Method: Tape Reel; Reel
- Capacitance Range: 0.0100
- Dielectric: Ceramic Composition
- WVDC: 50
from Utmel Electronic Limited
0603 C 2.2pF Ceramic Multilayer Capacitor; 100V dc; +125C; C0G Dielectric; +/-0.25pF [See More]
- Packing Method: Tape Reel; Bulk; Tape & Reel (TR)
- Dielectric: Ceramic Composition; Ceramic
- Technology: Multilayer
- RoHS Compliant: Yes
from Knowles Precision Devices
High Performance and High Frequency Single Layer Capacitors for RF Microwave and Millimeter-Wave Applications. The Di-Cap is a conventional parallel plate capacitors with metallization to the edge. Benefits: Gold metallization for wire bonding. Rugged construction. Thin film Technology. [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP ARR 82PF .22UF 10V X5R 0402 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 8.20E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1000274-06036D475KAT2A. Packaging: Reel - TR. Voltage Rating: 6.3V. Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 4.7 μF. Tolerance: ±10%. Temperature Coefficient: X5R. Thickness (Max): 0.035" (0.90mm). [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 4.7
- Dielectric: Ceramic Composition
- WVDC: 6.3
from Utmel Electronic Limited
0805 10 uF 10V ±10 % Tolerance X5R SMT Multilayer Ceramic Capacitor [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; CERAMIC
from Knowles Precision Devices
Series Configured Capacitors for Microwave Applications. The products unique configuration eliminates the need for wirebonding thus reducing performance variations. Benefits: Consistent performance. Eliminates the need for wirebonding. Low Insertion Loss [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP ARRAY 0.1UF 50V X7R 0508 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1000347-08051A220JAT2A. Packaging: Reel - TR. Voltage Rating: 100V. Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 22pF. Tolerance: ±5%. Temperature Coefficient: C0G, NP0. Thickness (Max): 0.037" (0.94mm). Family... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 2.20E-5
- Dielectric: Ceramic Composition
- WVDC: 100
from Utmel Electronic Limited
1206 1000pF Ceramic Multilayer Capacitor; 50VDC; 125degC; C0G Dielec; +/-5% SMD [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; Ceramic
from Knowles Precision Devices
A reliable solution in DC Blocking and RF Bypassing Applications. Mirrors Di-Cap technology and processing with one difference it provides a consistent physical size. Benefits: Gold Metallization for wire bonding. Consistent resonance performance at microwave frequencies. Repeatable lot to lot... [See More]
- Packing Method: Tape Reel
- Technology: Single-Layer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from DigiKey
CAP ARRAY 10PF 50V NP0 0612 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 736013-08053C225KAT2A. Packaging: Reel. Mounting Style: SMT, MLCC. Applications: General Purpose. Capacitance: 2.2 μF. Tolerance: ±10%. Voltage - Rated: 25V. Temperature Coefficient: X7R. Categories: Capacitors. Temperature Range -... [See More]
- Packing Method: Tape Reel; Reel
- Capacitance Range: 2.2
- Dielectric: Ceramic Composition
- WVDC: 25
from Utmel Electronic Limited
1206 C 4.7uF Ceramic Multilayer Capacitor; 16 VDC; +85degC; X5R Dielec; +/-10% [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Dielectric: Ceramic Composition; Ceramic
- Technology: Multilayer
- RoHS Compliant: Yes
from DigiKey
CER CAP [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 1000794-100B560JT500XT. Packaging: Reel - TR. Features: High Q, Low Loss, Low ESL. Voltage Rating: 500V. Applications: RF, Microwave, High Frequency. Mounting: Surface Mount, MLCC. Capacitance: 56pF. Tolerance: ±5%. Temperature... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 5.60E-5
- Dielectric: Ceramic Composition
- WVDC: 500
from Utmel Electronic Limited
1206 C 680nF Ceramic Multilayer Capacitor; 25 VDC; +125degC; X7R Dielec; +/-10% [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Dielectric: Ceramic Composition; Ceramic
- Technology: Multilayer
- RoHS Compliant: Yes
from DigiKey
CAP ARRAY 10PF 50V C0G/NP0 1206 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1001101-12063D106KAT2A. Packaging: Reel - TR. Voltage Rating: 25V. Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 10 μF. Tolerance: ±10%. Temperature Coefficient: X5R. Thickness (Max): 0.070" (1.78mm). [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 10
- Dielectric: Ceramic Composition
- WVDC: 25
from Utmel Electronic Limited
1210 47 uF 16 V ±20 % Tol. X5R Surface Mount Multilayer Ceramic Capacitor [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; CERAMIC
from DigiKey
CAP ARRAY 10PF 50V CH 1206 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 785086-1206CC153KAT1A. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Voltage. Package: 1206 (3216 Metric). Applications: General. Mounting: Surface Mount, MLCC. Capacitance: 0.015 μF. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 0.0150
- Dielectric: Ceramic Composition
- WVDC: 630
from Utmel Electronic Limited
2.2 µF ±10% 4V X6S Ceramic Capacitor -55 °C ~ 105 °C Surface Mount, MLCC 0402 (1005 Metric) 0.039" L x 0.020" W (1.00mm x 0.50mm) [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Dielectric: Ceramic Composition; Ceramic
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from DigiKey
CAP ARRAY 10PF 50V NP0 0805 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1121156-1206YD226KAT2A. Packaging: Reel - TR. Operating Temperature Range: -55 °C ~ 85 °C. Package: 1206 (3216 Metric). Applications: General. Mounting: Surface Mount, MLCC. Capacitance: 22 μF. Tolerance: ±10%. Temperature... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 22
- Dielectric: Ceramic Composition
- WVDC: 16
from Utmel Electronic Limited
2.2 μF ±10% 16V Ceramic Capacitor X5R 0805 (2012 Metric) [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; CERAMIC
- Capacitance Range: 2.2
from DigiKey
CAP ARRAY 100PF 50V NP0 1206 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1001228-12103C105KAT2A. Packaging: Reel - TR. Voltage Rating: 25V. Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 1 μF. Tolerance: ±10%. Temperature Coefficient: X7R. Thickness (Max): 0.060" (1.52mm). Family... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 1
- Dielectric: Ceramic Composition
- WVDC: 25
from Utmel Electronic Limited
2.2nF 10% 50V dc Phycomp 4-WayX7R DielectricCapacitor Array, SMT 0612 Package [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Dielectric: Ceramic Composition; Ceramic
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from DigiKey
CAP ARRAY 0.1UF 16V X7R 0508 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 1001767-1808HC102KAT1A. Packaging: Reel - TR. Features: High Voltage. Voltage Rating: 3000V (3kV). Applications: General Purpose. Mounting: Surface Mount, MLCC. Capacitance: 1000pF. Tolerance: ±10%. Temperature Coefficient: X7R. Thickness... [See More]
- Packing Method: Tape Reel; Reel - TR
- Capacitance Range: 1.00E-3
- Dielectric: Ceramic Composition
- WVDC: 3000
from Utmel Electronic Limited
4.7 μF ±10% 6.3V Ceramic Capacitor X5R 0603 (1608 Metric) [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 4.7
from DigiKey
CAP ARRAY 1000PF 100V X7R 0612 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 775619-1808HC221MAT1A. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Voltage. Package: 1808 (4520 Metric). Applications: General. Mounting: Surface Mount, MLCC. Capacitance: 220pF. Tolerance:... [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 2.20E-4
- Dielectric: Ceramic Composition
- WVDC: 3000
from Utmel Electronic Limited
C Series 0201 0.22 uF 25 V ±10 % Tolerance X5R SMT Multilayer Ceramic Capacitor [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition; Ceramic
from DigiKey
CAP ARRAY 0.1UF 10V X5R 0504 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 751034-22201C105KAT1A. Packaging: Tape and Reel. Mounting Style: SMT, MLCC. Applications: General Purpose. Capacitance: 1 μF. Tolerance: ±10%. Voltage - Rated: 100V. Temperature Coefficient: X7R. Family Name: X7R Dielectric. [See More]
- Packing Method: Tape Reel; Tape and Reel
- Capacitance Range: 1
- Dielectric: Ceramic Composition
- WVDC: 100
from Utmel Electronic Limited
CAP [See More]
- Packing Method: Tape Reel; TR, PAPER, 7 INCH
- Capacitance Range: 4.70E-4
- Dielectric: Ceramic Composition; CERAMIC
- WVDC: 50
from DigiKey
CAP ARRAY [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0100
from Win Source Electronics
Manufacturer: AVX Corporation. Win Source Part Number: 775612-2220HC123KAT1A. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Voltage. Package: 2220 (5750 Metric). Applications: General. Mounting: Surface Mount, MLCC. Capacitance: 0.012 μF. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 0.0120
- Dielectric: Ceramic Composition
- WVDC: 3000
from Utmel Electronic Limited
CAP ARRAY 0.022UF 16V X5R 0805 [See More]
- Packing Method: Tape Reel; Cut Tape (CT)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 0.0220
from DigiKey
CAP ARRAY [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769156-600F2R2BT250XT. Series: ATC 600F. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 0805. Applications: RF, Microwave, High Frequency. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 2.20E-6
- Dielectric: Ceramic Composition
- WVDC: 250
from Utmel Electronic Limited
CAP ARRAY 0.1UF 10V X5R 0508 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 0.1000
from DigiKey
CAP ARRAY [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0220
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769157-600F3R3BT250XT. Series: ATC 600F. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 0805. Applications: RF, Microwave, High Frequency. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 3.30E-6
- Dielectric: Ceramic Composition
- WVDC: 250
from Utmel Electronic Limited
CAP ARRAY 0.1UF 16V X7R 0612 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 0.1000
from DigiKey
CAP ARRAY 2200PF 25V X7R 0504 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0022
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769162-600S100FT250XT. Series: ATC 600S. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 0603. Applications: RF, Microwave, High Frequency. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 1.00E-5
- Dielectric: Ceramic Composition
- WVDC: 250
from Utmel Electronic Limited
CAP ARRAY 0.1UF 16V X7R 0612 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 0.1000
from DigiKey
CAP ARRAY 1000PF 50V X7R 0805 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769165-600S2R4AT250XT. Series: ATC 600S. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 0603. Applications: RF, Microwave, High Frequency. [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 2.40E-6
- Dielectric: Ceramic Composition
- WVDC: 250
from Utmel Electronic Limited
CAP ARRAY 15PF 50V NP0 0805 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 1.50E-5
from DigiKey
CAP ARRAY 1.0UF 10V X5R 0805 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769168-800B0R8BT500XT. Series: ATC 800B. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 1111 (2828 Metric). Applications: RF, Microwave, High... [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 8.00E-7
- Dielectric: Ceramic Composition
- WVDC: 500
from Utmel Electronic Limited
CAP ARRAY 2200PF 200V X7R 0612 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; Ceramic
- Capacitance Range: 0.0022
from DigiKey
CAP ARRAY 10PF 50V NP0 0504 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-5
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769169-800B100JT500XT. Series: ATC 800B. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 1111 (2828 Metric). Applications: RF, Microwave, High... [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 1.00E-5
- Dielectric: Ceramic Composition
- WVDC: 500
from Utmel Electronic Limited
Cap Auto-grade 0.0047UF 25VDC X7R 10% SMD 0402 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- Dielectric: Ceramic Composition; CERAMIC
- Configuration / Form Factor: Chip Capacitor
- RoHS Compliant: Yes
from DigiKey
CAP ARRAY 1.0UF 25V X5R 0805 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769170-800B1R5BT500XT. Series: ATC 800B. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 1111 (2828 Metric). Applications: RF, Microwave, High... [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 1.50E-6
- Dielectric: Ceramic Composition
- WVDC: 500
from Utmel Electronic Limited
CAP CER 0.015UF 1KV X7R 1210 [See More]
- Packing Method: Tape Reel; Tape & Reel (TR)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; CERAMIC
- Capacitance Range: 0.0150
from DigiKey
CAP ARRAY 0.1UF 25V X5R 0805 [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Win Source Electronics
Manufacturer: American Technical Ceramics. Win Source Part Number: 769171-800B4R7BT500XT. Series: ATC 800B. Packaging: Reel package. Operating Temperature Range: -55 °C ~ 125 °C. Features: High Q, Low Loss, Ultra Low ESR. Package: 1111 (2828 Metric). Applications: RF, Microwave, High... [See More]
- Packing Method: Tape Reel; Reel package
- Capacitance Range: 4.70E-6
- Dielectric: Ceramic Composition
- WVDC: 500
from Utmel Electronic Limited
CAP CER 0.015UF 50V X7R 0603 [See More]
- Packing Method: Tape Reel; Cut Tape (CT)
- RoHS Compliant: Yes
- Dielectric: Ceramic Composition; CERAMIC
- Capacitance Range: 0.0150
from KEMET Electronics Corporation
KEMET Multilayer Ceramic Capacitors (MLCCs) are a preferred capacitance solution, offering tremendous performance, reliability and cost advantages for circuit designers. Our comprehensive line of surface mount and through-hole devices are utilized in a wide variety of computer, telecommunications,... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor; Chip Capacitor
- Dielectric: Ceramic Composition
from Trigon Components, Inc.
SERIES. CCD. DESCRIPTION. General Purpose Class I, II and III. CAPACITANCE RANGE. 0.5pF to 100000pF. VOLTAGE RATING. 16VDC to 10000VDC. OPERATING TEMPERATURE. -25 to +85 deg C. PACKAGE. Radial. FEATURE. Class 1: Temp. Compensation. •Linear Temp. coeff. Of capacitance. •High stability of... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
High Voltage (1000V and over), Low Dissipation [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CCD-1. DESCRIPTION. Safety Certified Y1, Ceramic Disc. CAPACITANCE RANGE. 100pF to 4700pF. VOLTAGE RATING. 4000VAC for 1m. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
Commercial Grade, Mid Voltage (100 to 630V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0100
from Trigon Components, Inc.
SERIES. CCD-1. DESCRIPTION. Safety Certified Y1, Ceramic Disc. CAPACITANCE RANGE. 100pF to 4700pF. VOLTAGE RATING. 4000VAC for 1m. OPERATING TEMPERATURE. -25 to +125 Deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0100
from Trigon Components, Inc.
SERIES. CCD-2. DESCRIPTION. Safety Certified Y2, Ceramic Disc. CAPACITANCE RANGE. 5.1pF to 1500pF. VOLTAGE RATING. 2600VAC for 1m. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0220
from Trigon Components, Inc.
SERIES. CCD-2. DESCRIPTION. Safety Certified Y2, Ceramic Disc. CAPACITANCE RANGE. 5.1pF to 1500pF. VOLTAGE RATING. 2600VAC for 1m. OPERATING TEMPERATURE. -25 to +125 Deg C. PACKAGE. Radial. FEATURE. •IEC 384-14 Second Edition (1993). •Across-the-line antenna-coupling. •Line-by-Pass... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CCD-R. DESCRIPTION. Class II Epoxy Coated, Low Loss Low D.F. CAPACITANCE RANGE. 100pF to 10000pF. VOLTAGE RATING. 1000VDC to 3000VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. Low Dissipation Factor. •High Voltage. •IEC 384-9: 1988 (Fixed capacitors of... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Materials — General Purpose. Operating Temperature Range — –30 °C to +85 °C. Temperature Characteristic — +22 %, –82 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CCD-W. DESCRIPTION. Class II Epoxy Coated, Low D.F. CAPACITANCE RANGE. 820pF to 100000pF. VOLTAGE RATING. 1000VDC to 3000VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. High Voltage,Low D.F, High Stable,High Reliability. • Coated with flame-retardant epoxy... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CCD-Y. DESCRIPTION. Class I Epoxy Coated, Wide Temperature. CAPACITANCE RANGE. 0.5pF to 1000pF. VOLTAGE RATING. 50VDC to 500VDC. OPERATING TEMPERATURE. -25 to +125 deg C. PACKAGE. Radial. FEATURE. High Temperature Stable. • Established Reliability. • Coated with flame-retardant... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CMCA. DESCRIPTION. Axial Epoxy Coated. CAPACITANCE RANGE. 1pF to 2.2uF. VOLTAGE RATING. 50VDC to 100VDC. OPERATING TEMPERATURE. +10 to +85 °C. PACKAGE. Axial. FEATURE. •CMCR Axial leaded, Epoxy Coated Multilayer Ceramic Capacitors are building by superior moisture and shock... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials. Operating Temperature Range — +10 °C to +85 °C. Temperature Characteristic — +22 %, –56 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CMCR. DESCRIPTION. Radial Epoxy Coated. CAPACITANCE RANGE. 1pF to 22.0uF. VOLTAGE RATING. 50VDC to 100 VDC. OPERATING TEMPERATURE. -55 to +125 deg C. PACKAGE. Radial. FEATURE. •CMCR Radial Leaded Multilayer Ceramic Capacitors has wide application computer, data processing,... [See More]
- Packing Method: Tape Reel; Bulk
- Dielectric: Ceramic Composition
- Configuration / Form Factor: Leaded Capacitor
- Capacitance Type: Fixed
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CP0612. DESCRIPTION. Chip, Low ESL Performance. CAPACITANCE RANGE. 10nF to 150nF. VOLTAGE RATING. 50VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0612. FEATURE. •Standard size with thin thickness. •Small size with high capacitance. •Capacitor with lead-free... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from TDK Corporation
General (Up to 50V) [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Leaded Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CPD. DESCRIPTION. Chip, Medium / High Voltage. CAPACITANCE RANGE. 100pF to 1.2uF. VOLTAGE RATING. 100VDC to 2000VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0805 to 2220. FEATURE. - Low ESR and Low Tan d. - Excellent DC Bias. - Provide Good Ripple Characteristic. - Excellent... [See More]
- Packing Method: Tape Reel; Bulk
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.1000
from Trigon Components, Inc.
SERIES. CPH (Hi-V). DESCRIPTION. Chip, High Voltage. CAPACITANCE RANGE. 10pF to 1.5uF. VOLTAGE RATING. 100VDC to 3000VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0603, 0805, 1206, 1210, 1808, 1812. FEATURE. Recommended Appliction: •Modems. •Telecom Devices. •LAN / WAN... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0100
from Trigon Components, Inc.
SERIES. CPH(Y2). DESCRIPTION. Chip, Safety Certified. CAPACITANCE RANGE. 3pF to 2200pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 1808, 1812, 2211. FEATURE. •TRIGON ’s Safety Certified Multilayer Ceramic chip capacitors are designed for surge or lightning... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0100
from Trigon Components, Inc.
SERIES. CPH(Y3). DESCRIPTION. Chip, Safety Certified. CAPACITANCE RANGE. 5pF to 1000pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 1808. FEATURE. •TRIGON Multilayer Ceramic chip capacitors supplied in bulk or tape & reel package are ideally suitable for... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Trigon Components, Inc.
SERIES. CPH. DESCRIPTION. Chip. CAPACITANCE RANGE. 0.5pF to 100uF. VOLTAGE RATING. 4VDC to 50VDC. OPERATING TEMPERATURE. -55 to +125 deg C. PACKAGE. SMD 0201 to 1812. FEATURE. •Standard EIA Chip Size Available. •Wide range of capacitance 1.0pF – 3.3uF is available for various circuit... [See More]
- Packing Method: Tape Reel
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Trigon Components, Inc.
SERIES. CPH(Y2). DESCRIPTION. Safety Certified, Y2, Ceramic Chip. CAPACITANCE RANGE. 3pF to 2200pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125 Deg C. PACKAGE. SMD 1808 to 2211. FEATURE. •TRIGON ’s Safety Certified Multilayer Ceramic chip capacitors are designed for surge... [See More]
- Packing Method: Tape Reel; Bulk
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-3
from Trigon Components, Inc.
SERIES. CPH(Y3). DESCRIPTION. Safety Certified, Y3, Ceramic Chip. CAPACITANCE RANGE. 5pF to 1000pF. VOLTAGE RATING. 250VAC. OPERATING TEMPERATURE. -55 to +125 Deg C. PACKAGE. SMD 1808. FEATURE. •TRIGON Multilayer Ceramic chip capacitors supplied in bulk or tape & reel package are ideally... [See More]
- Packing Method: Tape Reel; Bulk
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Trigon Components, Inc.
SERIES. CPU. DESCRIPTION. Chip, High Power / High Q. CAPACITANCE RANGE. 0.5pF to 1000pF. VOLTAGE RATING. 25VDC to 50VDC. OPERATING TEMPERATURE. -55 to +125?. PACKAGE. SMD 0402 to 2225. FEATURE. ?High Q value with high frequency from 1MHz ~ 3GHz. ?It has multi-layer monolithic structure and high... [See More]
- Packing Method: Tape Reel; Bulk
- Technology: Multilayer
- Configuration / Form Factor: Chip Capacitor
- Dielectric: Ceramic Composition
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.00E-4
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.50E-4
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1.50E-5
from Allied Electronics, Inc.
EIA Class II Ceramic Materials — Temperature Stable. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±15 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic X7R
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 1
from Allied Electronics, Inc.
EIA Class I Ceramic Materials — Temperature Compensating. Operating Temperature Range — –55 °C to +125 °C. Temperature Characteristic — ±0.3 % [See More]
- Packing Method: Tape Reel
- Dielectric: Ceramic Composition; Ceramic NPO
- Configuration / Form Factor: Chip Capacitor
- Capacitance Range: 0.0022