Bonding Electronic and IC Packaging Services

Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected... [See More]

• Backend Processing: Wire Bonding; FlipChip; Hermetic Sealing; Die Bonding
• Certifications: ITAR Certified

• Company Information: With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.