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Bonding Electronic and IC Packaging Services

1 Result
IC Packaging
from Palomar Technologies, Inc

Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected... [See More]

  • Backend Processing: Wire Bonding; FlipChip; Hermetic Sealing; Die Bonding
  • Certifications: ITAR Certified
  • Company Information: With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.