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Hermetic Sealing Electronic and IC Packaging Services

2 Results
IC Packaging
from Palomar Technologies, Inc

Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected... [See More]

  • Backend Processing: Wire Bonding; FlipChip; Hermetic Sealing; Die Bonding
  • Certifications: ITAR Certified
  • Company Information: With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.
Ceramic Electronic Packages
from Advanced Technical Ceramics Company

AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non-captive supplier of... [See More]

  • Backend Processing: Soldering / Pasting; Hermetic Sealing; Dicing
  • Type: BGA; MCM; LCCC; Custom Pin Grid Arrays
  • Company Information: AdTech Ceramics has 30+ years of multilayer ceramic (MLC) manufacturing and 15+ years of AlN Multilayer technology experience, and offers microwave modeling and design and developmental partnerships.
  • Material: Ceramic; Co-fired Metal Ceramic Packages