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United States Only Electronic and IC Packaging Services

2 Results
IC Packaging
from Palomar Technologies, Inc

Development of complex technologies continues to grow at a rapid pace, challenging existing technology giants and start-ups alike to keep pace with the growing demands for higher data capacity, faster speed, smaller designs and more sustainable solutions that are the foundation of the connected... [See More]

  • Company Information: With over 40 years of experience in the industry assembling microelectronic and photonic chip packages, Palomar Technologies Innovation Centers are full-service advanced packaging laboratories offering solutions for process development/optimization, package prototyping, die attach, wire bonding, outsourced package assembly, test, and measurement.
  • Certifications: ITAR Certified
  • Backend Processing: Wire Bonding; FlipChip; Hermetic Sealing; Die Bonding
Ceramic Electronic Packages
from Advanced Technical Ceramics Company

AdTech prides itself on being the innovation leader in the ceramic package business. Co-fired ceramic technology was invented in our Chattanooga facility over 35 years ago, and numerous patents have been issued over the years. Today, the company remains the leading US-owned non-captive supplier of... [See More]

  • Company Information: AdTech Ceramics has 30+ years of multilayer ceramic (MLC) manufacturing and 15+ years of AlN Multilayer technology experience, and offers microwave modeling and design and developmental partnerships.
  • Backend Processing: Soldering / Pasting; Hermetic Sealing; Dicing
  • Type: BGA; MCM; LCCC; Custom Pin Grid Arrays
  • Material: Ceramic; Co-fired Metal Ceramic Packages