802.11 AC Chipsets

Description: Dual-band 1 x 1 802.11ac + Bluetooth 4.1 The QCA9377-3 is a single-die wireless local area network (WLAN) and Bluetooth combination solution to support 1 × 1 802.11a/b/g/n/ac WLAN standards and Bluetooth 4.1 + HS, designed to deliver superior integration of WLAN/Bluetooth and

• Data Rate: 433,000 kbps
• Technology: Bluetooth, Wi-Fi / WiMAX / Wi-Mesh
• Features: Bluetooth^® EDR Chip, Class I, Class II, Other, UART
• Interface: I²C, PCI Express

Description: applications. The architecture and interface are optimized for most stringent EVM requirements of next generation 802.11.ac WLAN devices. The PA module features chipset logic compatible control voltages that draw very low current to facilitate ease of use and

• Frequency Range: 4,900 to 5,925 MHz
• Minimum Gain: 32 dB
• Maximum Gain: 32 dB
• Amplifier Type: Power Amplifier

Description: Compact 2013 (WEC 2013) devices using QCA9377 (802.11 ac,1×1, USB). The IGX 802.11ac USB Wi-Fi5 SoftAP provides a proven, readily deployable solution for Industrial, Medical, Retail and IoT Products. WEC7 Native Wi-Fi stack does not support SoftAP mode of operation, and

Description: AIRETOS® E98 Class - Series X: High-class 802.11ac (Wi-Fi 5) powerful Dual-Band Modules up to industrial-grade for demanding home and enterprise networks. Key Features IEEE 802.11ac Dual Band (backwards compatible with 802.11abgn) Up to Industrial operating temperature grade

Description: IGX-PACAF1-9880a1 is a IEEE 802.11ac wireless adapter that operates in 2.4GHz and 5 GHz bands, available in PCIe mini card form factor. Featuring QCA9880 chipset, the IGX-PACAF1-9880a1 dramatically increases the overall throughput up to 1.3Gbps with 3 x 3 MIMO techniques. Leveraging

• Frequency Band: 5,850 MHz
• Data Rate: 1.3 Gbps
• Network Equipment: Modem
• Features: Radio Modem

Description: The IGX-UACF1-9379b7-BT is a highly integrated Wireless Local Area Network (WLAN) system-on-chip (SOC) for 5GHZ 802.11ac, or 2.4/5GHz 802.11n WLAN applications. Dual-stream spatial multiplexing up to 867Mbps data rate is featured. It is based on the Qualcomm Atheros QCA9379

• Sensitivity: -92 to -74 dBm
• Output Power: 11.00000000000001 to 15.000000000000002 dBm
• Operating Frequency: 2,400 to 5,845 MHz
• Operating Temperature: 0 to 70 C

Description: AIRETOS® E61 Class - Series R: 802.11 ac/abgn Wi-Fi BLE 5.0 Combo Dual Band modules. Key Features Fully featured WAVE2 choice for the computing market Dual Band with Multi User MIMO support Bluetooth 5.0 Compliance with Class I mode, ANT+ and BLE Extended Grade Variant X;

Description: The IGX-SACF1-9379a3-BT is a single-die Wireless Local Area Network (WLAN) and Bluetooth (BT) combo module. It supports 2×2 MIMO with two spatial streams. It features IEEE 802.11 a/b/g/n/ac WLAN standards and BT v4.2+HS. Based on the Qualcomm QCA9379-3 chipset it enables

• Sensitivity: -94 dBm
• Output Power: 1.9999999999999905 to 4 dBm
• Operating Frequency: 2,400 to 5,850 MHz
• Supply Voltage: 3.3 volts

Description: (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART

Description: (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to 1775Mbps (dynamic) Industrial Reference Based on Qualcomm reference design (Hastings) Communications Interface WLAN via PCI Express Standard 2.1 host I/O + Bluetooth via UART

Description: ENTERPRISE 11AC RADIO CHIPSET

Description: 2+3 GE WLAN CHIPSET (11N+11AC)

Description: 2+2 GE WLAN CHIPSET(11N+11AC)

Description: Panel PCs 21.5" 250cd/m FHD Medical panel PC with Intel H81 chipset, Pentium Dual Core G3320TE Processor (2.3 GHz), TDP 35W, 2*2GB DDR3 RAM, 802.11a/b/g/n/ac WiFi module, PCAP touchscreen, 2M camera, microphone, support iRIS-2400, R12

Description: offer a broad selection of 802.11n and 802.11ac antennas to deliver optimal coverage in a variety of scenarios. Chipset with the best-in-class RF architecture Our chipset provides a high-density experience for industrial, enterprise, and service provider networks. It is

• Network Equipment: Access Points
• Form Factor: Ceiling / Wall Mount
• Network Media: Wireless

Description: CD-ROM, and a 2.5” horizontal internal hard drive bay behind a latchable door. The passive backplane system comes with either a 150-watt AC or 250-watt –48vDC ATX auto-select power supply. A positive pressure cooling scheme (with low profile CPU heat sink/fan, four 4cfm fans, filter and power

• Speed: 433 MHz
• RAM: 0.064 GB
• Operating System: Linux, Microsoft®
• Features: Other

Description: such as QNX will also be available. JODY-W2 undergoes extended automotive qualification according to ISO 16750-4 and is manufactured in line with ISO/TS 16949. Radio type approvals are pending for the US, Europe, and Canada. Key features IEEE 802.11a/b/g/n/ac, Wi-Fi 5 Wi-Fi 1x1 SISO

• Technology: GPS
• Device Type: Receiver

Description: topologies for 18-36Vin isolated DC-DC converters. Together with IRs low-voltage MOSFETs and controller ICs, these mid-range MOSFETs form secondary-side chipsets for medium-power, converter applications. In addition, when combined with the SmartRectifierTM IR1167 in AC-DC power

Description: The MDM9207-1 LTE modem offers device makers, system integrators, and developers a commercially proven chipset platform with high quality 3G/4G LTE multimode and multiband support, designed to bring reliable cellular connectivity on major network carriers worldwide. With Category 1 support,

• Operating Frequency: 1,300 MHz
• Data Rate: 5,000 to 10,000 kbps
• Technology: Bluetooth, CDMA, GSM, Wi-Fi / WiMAX / Wi-Mesh
• Features: Bluetooth^® EDR Chip, Other

Description: Specs Wi-Fi Wi-Fi Standards 802.11ac 802.11n Wi-Fi Spectral Bands 2.4 GHz 5 GHz MIMO Configuration 2x2 (2-stream) Bluetooth Bluetooth Version Bluetooth 4.1 Location Satellite Systems Support GPS GLONASS NFC Near Field Communications Supported RF RFFE Qualcomm® RF360™ front-end solution

• Clock Speed: 1,500 MHz
• Bits: 32 Bit
• Serial Interface: USB

Description: Supports up to 8K MAC address table Provides 320KB buffer memory Data Transfer Rates 10 Mbps, 100 Mbps and 1000 Mbps Protocol IEEE 802.3 10Base-T IEEE 802.3u 100Base-TX IEEE 802.3ab 1000Base-T IEEE 802.3x Full duplex flow control MAC Address Table 8KB Packet Buffer Memory

• Network Equipment: Switch

Description: PCI-Express, 1x 64-bit 133MHz PCI-X, 2x 64-bit 100MHz PCI-X, 1x 32-bit 33MHz PCI 8. Zero-Channel RAID Support 9. AC'97 Audio, 6-Channel Sound 10. SAS 4 + 4 Support 11. Fan Speed Control

Description: Intel 82815 Chipset, supports the low power processors and Intel socket 370 processors up to 1.2GHz. The performance that comes with this chipset includes SDRAM memory optimization and FSB 133HMz , PCI ATA, and USB design. The IND-P815LV integrated Intel® 82559 and 82562 10/100 based

Description: for phase noise, noise figure, vector signal analysis, analog demodulation, EMI diagnostics Wireless measurement applications for LTE (including LTE-Advanced), WLAN (including IEEE 802.11 AC), WCDMA/HSPA+, TD-SCDMA, GSM/EDGE, CDMA2000®/1xEV-DO, Bluetooth® Frequency range up to

• Frequency Range: 7,000,000 kHz

Description: resolution 1280x1024@24bpp, 1600x1200@8bpp Intel 82815 & 82801BA chipset include Graphic Memory Controller Hub, I/I controller Hub 2, and Firmware Hub Dual LAN, Intel 81559 controller, 10/100 Mbps, autoswitch, with dual RJ-45 connectors CompactFlash socket for up to 512MByte, 8 Mbit Flash

Description: static display of all connected temperature sensors Variable safety shutdown temperature Blue reservoir LED lighting Variable temperature alarm and shutdown Adapted power connection - does not require an AC power outlet Single high-speed 120mm radiator fan Optional attachment strap for

Description: interface candidates, LTE (up to Release 12), 3GPP FDD/HSPA/HSPA+, GSM/EDGE/EDGE Evolution, CDMA2000®/1xEV-DO, WLAN IEEE 802.11a/b/g/n/j/p/ac/ad No separate PC software required for digital standards Generation of radar signal scenarios for module, receiver and DFS tests LTE and 3GPP

• Minimum Frequency Range: 0.1 MHz
• Maximum Frequency Range: 40,000 MHz
• Device Type: Generator
• Form Factor: Portable / Benchtop

Description: Type B USB connector features industrial strength and high-retention design FACTORY OPTIONS Extended operating temperature (-40° to +85°C) External power components and AC/DC adapter Screw terminals for power input provide high retention connection OEM (board only) version with PC/104

• Number of Counters: 15
• Counter Resolution: 16 bits
• Maximum Count Frequency: 10,000 kHz
• Operating Temperature: 32 to 158 F

Description: OPTIONS Eight or four input/output versions available Input only and relay only versions External power from AC/DC adapter for high current capabilities OEM (board only) version with PC/104 mounting holes and PCB footprint for added flexibility in embedded applications DIN rail mounting

• Digital I/O Channels: 16 #
• Operating Temperature: 32 to 158 F
• Features: Application Software Included
• User Interface: Computer Programmable

Description: multifunction device is ideal for a variety of applications such as industrial monitoring, control and communication. DIGITAL The isolated, non-polarized inputs may be driven by either DC sources of 3-31 V (or higher by special order) or AC sources at frequencies of 40Hz to 10kHz. Optically

• Number of Ports: 4
• Operating Temperature: 0 to 60 C
• Operating Humidity: 5 to 95 %
• Features: CE Conformity Marks, RoHS