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Supplier: Indium Corporation
Description: Indium Corporation bar solder is a high purity material manufactured to provide consistent and reliable performance manufactured per J-STD. Bars are triangular in shape (1.4 lbs./bar) packed 18 bars/box 25 lbs./box Minimum order quantity is: 25 lbs.
- Alloy: Tin-Silver (Sn-Ag), Other
- Form / Shape: Other
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Supplier: Lucas Milhaupt Global Brazing Solutions
Description: Soft solders are filler metals that melt and flow below 800° F. They are typically available in solid wire or cored with a rosin or acid flux. Soldering alloys are available in tin, lead, silver, copper, antimony and other compositions and can be fabricated into wire,
- Alloy: Tin-Silver (Sn-Ag)
- Approvals / Conformance: ASTM / UNS
- Conductivity: 8.12E10 µS/cm
- Form / Shape: Paste, Powder, Preform, Wire
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Supplier: RS Components, Ltd.
Description: Tin and silver alloy in packaging suitable for wave soldering machines and tinning crucibles. Bar dimensions: 380 x 15 x 8 mm. Product Form = Granules Melting Point = +221°C Percent Silver = 4% Percent Tin = 96% Product Weight = 500g
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Powder
- Melting Range: 430 F
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Supplier: RS Components, Ltd.
Description: Melting Point = +217 - +219°C Percent Silver = 3% Percent Tin = 96.5% Flux Type = Refined Resin- REL0 Product Weight = 250g Flux Content Percent = 2.2% Percent Copper = 0.5%
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 426 F
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Supplier: Win Source Electronics
Description: Manufacturer: TE Connectivity Storage Condition: Dry storage cabinet & Humidity protection package Win Source Part Number: 1013213-D-181-1222-9 0/9 Color: Blue Connector Type: Solder Length: 21.59 mm Contact Plating: Tin Insulation Material: PVDF
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Supplier: TE Connectivity
Description: Body Features Primary Product Color : Black Configuration Features Connector Contact Load Condition : Fully Loaded Number of Loaded Positions : 96 Number of Positions
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Current Rating: 35 amps
- Insulation Resistance: 5000 Mohms
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Supplier: TE Connectivity
Description: Sealable : No Termination Features Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 3.96 MM [.156 INCH ] Usage
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Current Rating: 35 amps
- Mounting: Through-hole, Other
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Supplier: TE Connectivity
Description: Sealable : No Termination Features Termination Method to PCB : Through Hole - Solder Termination Post & Tail Length : 3.96 MM [.156 INCH
- Contact Plating: Other
- Contacts Pitch: 2.54 mm
- Current Rating: 35 amps
- Mounting: Through-hole, Other
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Supplier: Techsil Limited
Description: MG Chemicals 4886 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: Techsil Limited
Description: MG Chemicals 4884 is an electronic grade solder wire. It uses the eutectic tin-to-lead alloy ratio which is complemented with a RA-like flux core. This range of solders is one of the easiest to work with because it offers a low-melting temperature with a sharp
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
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Supplier: RS Components, Ltd.
Description: No-clean solder wire (RT15) and activated no-clean solder wire (A11). A11 spools are designed for soldering connectors to all substrates. RT15 spools with fast wetting are suitable for SMD repairs. Wire Diameter = 0.35mm Product Form = Wire Melting Point = +217°C Percent
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 F
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Supplier: RS Components, Ltd.
Description: wetting of the soldering tip. Reduced Fe leaching. Application: For use in hand soldering and automatic solder feed applications Model Number = WSW SAC M1 Wire Diameter = 0.3mm Product Form = Wire Melting Point = +217 °C, +221 °C Percent Silver = 3% Percent Tin =
- Alloy: Tin-Silver (Sn-Ag)
- Form / Shape: Wire
- Melting Range: 423 to 430 F
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compatibility, improved coplanarity, and EH&S compliance. MICROFAB TS-650 NXG is designed for lead-free and capping applications, providing exceptional within-wafer (WIW), within-die (WID), and within-feature (WIF) uniformity. The tunable tin-silver alloy produced by MICROFAB TS-650 NXG removes the (read more)
Browse Plating Chemicals and Anodizing Chemicals Datasheets for MacDermid Alpha Electronics Solutions -
finish of a PCB serves to protect the exposed copper traces from oxidation and facilitate solderability during assembly. Common surface finish options for Halogen-Free PCBs include immersion silver, immersion tin, and organic surface finishes (OSFs), which are free from halogen-containing compounds (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
Class II if not specially required Double Layer PCB Capability ? Material: FR-4 ? Thickness Options: 0.3mm up to 10mm ?Copper Thickness:18um-700um ? Min. Trace Width and space: 2/2mil ? Solder Mask (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
packaging of Kovar, carbon steel, stainless steel, tungsten copper and aluminum alloy, and can also meet the energy storage Welding, parallel seam welding, tin soldering and laser sealing welding and other welding methods; -Insulation resistance ≥5000MΩ (500V DC); -Air tightness (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
iron powder or hydride powder, with binder, is applied to the welded parts of ceramics and metals. The solder (pure silver, silver-copper solder or low-temperature solder such as lead, tin and indium) is directly added to the metal parts without sintering, and then it is fired in vacuum at one time (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
Cu 20 µm (0.8 mil) min Solder Mask Green, Red, Blue, Black, White, Yellow Surface Finishes ENIG, HAL Leadfree, Immersion Silver, HASL, ENEPIG (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd.
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Indicates content that may require registration and/or purchase.
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HVAC: Equations, Data, and Rules of Thumb, Second Edition > Hydronic (Water) Piping Systems
Pipe: type “L” copper tubing, ASTM B88, Hard DrawnFittings: wrought copper solder joint fittings, ANSI/ASME B16.22Joints: solder joint with 95-5 tin antimony solder, 96 - 4 tin silver solder , or 94-6 tin silver solder, ASTM B32.
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National Spherical Torus Experiment (NSTX) Torus Design, Fabrication and Assembly
The overlapped surfaces are pre-tinned with 96 % tin / 4 % silver solder .
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Status of 4-cm-aperture, 17-m-long SSC dipole magnet R D program at BNL
The conductor is then spliced over a length of 76.2 mm to conductor from the outer layer pole turn using a 96 % tin - 4 % silver solder .
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Deposition Diagnostics for Next-step Devices
The copper wires were soldered to the circuit board with 96 % tin / 4 % silver solder .
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An optimized head coil design for MR imaging at 0.15 T
The +-in. outside diameter (0.d.) soft copper tubing elements are electrically connected in parallel using silver solder ( 96 % tin , 4 %silver).
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Engineering design of the National Spherical Torus Experiment
… several configurations were investigated and tested for ultimate strength prior to selecting a scheme consisting of a 4” overlap of the two conductors to be joined, soldered together with 96 % tin / 4 % silver soft solder , then secured using Sil …
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CR4 - Blog Entry: Is Brazing Welding? - Part II
A Silver Soldering example is using 96 % Tin - 4 % Silver filer metal for small diameter copper to copper joints on residential lines.
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Proceedings of the 2010 Monitoring Research Review: Ground-Based Nuclear Explosion Monitoring Technologies
Solder connections are made using 96 % tin with 4 % silver .
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An investigation into a low insulation resistance failure of multilayer ceramic capacitors
Elemental analysis indicated that the solder used on the board contained tin ( 96 %) and silver ( 4 %).
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Thermoplastic Polyester Engineering Resins
The replacement solder , usually a mixture of 96 % tin / 4 % silver alloy, melts at a higher temperature, thus requiring a vapor phase temperature of around 250°C.