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Supplier: Infineon Technologies AG
Description: free lead plating, RoHs compliant Complete product spectrum and SPICE models Benefits Low switching loses on competitive price Improved controllability Humidity ruggedness improvement Easy to design in products – drop in SMD
- Package Type: SOT223, Other
- Transistor Type: IGBT
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Supplier: Infineon Technologies AG
Description: Pb free lead plating, RoHs compliant Complete product spectrum and SPICE models Benefits Low switching loses on competitive price Improved controllability Humidity Ruggedness improvement Easy to design in products
- Package Type: TO-251 / TO-252, Other
- Packing Method: Tape Reel, Other
- Switching Speed: 4 to 20 kHz
- TJ: -40 to 175 C
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Supplier: Infineon Technologies AG
Description: Pb free lead plating, RoHs compliant Complete product spectrum and SPICE models Benefits Low switching loses on competitive price Improved controllability Humidity Ruggedness improvement Easy to design in products
- Package Type: TO-251 / TO-252, Other
- Packing Method: Tape Reel, Other
- Switching Speed: 4 to 20 kHz
- TJ: -40 to 175 C
-
-
Supplier: Infineon Technologies AG
Description: Pb free lead plating, RoHs compliant Complete product spectrum and SPICE models Benefits Low switching loses on competitive price Improved controllability Humidity Ruggedness improvement Easy to design in products
- Package Type: TO-251 / TO-252, Other
- Packing Method: Tape Reel, Other
- Switching Speed: 4 to 20 kHz
- TJ: -40 to 175 C
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High accuracy SPICE behavioral macromodeling of insulated gate bipolar transistor (IGBT)
In the last years several IGBT SPICE models have been proposed [l], with an increasing complexity, and thus a higher accuracy.
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A review of IGBT models
[40] F. Mihalic, K. Jezernik, D. Krischan, and M. Rentmeister, “ IGBT SPICE model ,” IEEE Trans Ind. Electron., vol.
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A novel analog behavioral IGBT spice macromodel
F. Mihalic, K. Krischan, M. Rentmeister , " IGBT SPICE model ", IEEE Transaction on Industrial Electronics, vol.
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Electromagnetic Compatibility in Railways
IEEE Transactions on Power Delivery 24(4), 1940–1950 (2009) [547] Mihalic, F., Jezernik, K., Krischan, K., Rentmeister, M.: IGBT SPICE model .
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An effective parameters calibration technique for PSpice IGBT models application
In this paper we propose an efficient and robust parameters calibration procedure implemented in MATLAB environment [4] and devoted to IGBT Spice models : the algorithm is based on the evaluation of parameter-to-curve differential coefficients whereby only some parameters have to…
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IGBT spice - An experimentally verified model with parameters extraction by device nondestructive measurements
[4] S.C. Yuan and C.C. Zhu, “Novel IGBT SPICE model with non-destruc- tive parameters extraction and measured verification,” in Inst. Electr. Eng. Proc.
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A new IGBT circuit model for SPICE simulation
The results of the proposed IGBT SPICE model are .
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Lifetime estimation with thermal models of semiconductors
IGBT SPICE model (IRG4PC40UD) [12] .
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Trench gate IGBTs for zero current switching applications
The enhanced IGBT Spice model demonstrated very good agreement with experimental results.
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Simulation and experimental investigation of parallel connected IGBTs
A new, straight forward, measurement based algorithm for the determination of critical parameters of an IGBT Spice model , which is provided by the IGBT manufacturer, is introduced.