Gate Drivers Specifications

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General Specifications


	Driver Type
	Your choices are...
	High-side Gate Driver		High-side gate drivers are used to drive power MOSFETs or IGBTs that are connected to a positive supply and are not ground-referenced (floating).
	Low-side Gate Driver		Low-side gate drivers are used to drive power MOSFETs or IGBTs that are connected to a negative supply.
	Dual Gate Driver (Half-bridge)		The driver has both low-side and high-side gates. These drivers are also known as half-bridge gate drivers.
	Three-phase		These drivers have three independent low-side and high-side referenced output channels. They are used in three-phase applications.
	Other		Other unlisted, specialized or proprietary driver type.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Number of Output Channels
	Your choices are...
	1		The device has only one output channel.
	2		The device has two output channels.
	4		The device has four output channels.
	Other		Other unlisted number of channels.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Output Configuration
	Your choices are...
	Inverting		The output voltage is inverted.
	Noninverting		The output voltage is not inverted.
	Other		Other unlisted or specialized output configurations.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Performance


	Output Voltage		The nominal value of the output voltage.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Peak Output Current		The value of maximum output current that the device can support.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Supply Voltage		This voltage can be Vcc or Vdd.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

	Rise Time		The time that is takes for the output voltage to rise from 10% to 90% of the maximum.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Fall Time		The time that is takes for the output voltage to decrease from 90% to 10% of the maximum.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Propagation Delay		The time interval between the application of an input signal and the appearance of the corresponding output.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Power Dissipation		The amount of power in the form of heat that the device dissipates.
	Search Logic:		All matching products will have a value less than or equal to the specified value.

	Switching Frequency		The maximum switching frequency that can be sustained without exceeding the specifications.
	Search Logic:		All matching products will have a value greater than or equal to the specified value.

	Operating Temperature:		This is the full-required range of ambient operating temperature.
	Search Logic:		User may specify either, both, or neither of the limits in a "From - To" range; when both are specified, matching products will cover entire range. Products returned as matches will meet all specified criteria.

Packaging Characteristics


	IC Package Type
	Your choices are...
	PBGA		Plastic ball-grid array (PBGA) is the general terminology for the BGA package adopting plastic (epoxy molding compound) as the encapsulation. According to JEDEC standard, PBGA refers to an overall thickness of over 1.7mm.
	TBGA		Tape ball-grid array (TBGA) uses a fine, polyimide substrate and provides good thermal performance with high pin counts.
	CSP		Chip scale package or chip size package (CSP) has an area that is no more than 20% larger than the built-in die. CSP is compact for second level packaging efficiency and encapsulated for second level reliability. CSP is superior to both direct-chip-attach (DCA) and chip-on-board (COB) technologies. CSP is used in a variety of integrated circuits (IC), including radio frequency ICs (RFIC), memory ICs, and communication ICs.
	UCSP		Ultra chip scale package (UCSP).
	FLGA		Fine-pitch land-grid array (FLGA) is extremely compact and lightweight, making it suitable for miniature disc drives and digital cameras.
	QFP		Quad flat packages (QFP) contain a large number of fine, flexible, gull wing shaped leads. Lead width can be as small as 0.16 mm. Lead pitch is 0.4 mm. QFPs provide good second-level reliability and are used in processors, controllers, ASICs, DSPs, gate arrays, logic, memory ICs, PC chipsets, and other applications.
	LQFP		Low quad flat package (LQFP).
	TQFP		Thin quad flat package (TQFP).
	SOP		Small outline package (SOP).
	SOIC		Small outline integrated circuit (SOIC).
	TSOP Type I		Thin small outline package (TSOP), Type I is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	TSOP Type II		Thin small outline package (TSOP), Type II is a DRAM package that uses gull wing shaped leads on both sides. TSOP DRAM mounts directly on the surface of the printed circuit board. The advantage of the TSOP package is that it is one-third the thickness of an SOJ package. TSOP components are commonly used in small outline DIMM and credit card memory applications.
	SSOP		Shrink small outline package (SSOP).
	TSSOP		Thin shrink small outline L-leaded package (TSSOP).
	VSSOP		Very thin shrink small outline package (VSSOP).
	TVSOP		Thin very small outline package (TVSOP).
	SOJ		Small outline J-lead (SOJ) is a common form of surface-mount DRAM packaging. It is a rectangular package with J-shaped leads on the two long sides of the device.
	HSOF		Small outline flat-leaded package with heat sink (HSOF).
	PLCC		Plastic leaded chip carrier (PLCC).
	LCCC		Leadless ceramic chip carrier (LCCC).
	DIP		Dual in-line package (DIP) is a type of DRAM component packaging. DIPs can be installed either in sockets or permanently soldered into holes extending into the surface of the printed circuit board.
	CDIP		Ceramic dual in-line package (CDIP) consists of two pieces of dry pressed ceramic surrounding a "DIP formed" lead frame. The ceramic / LF / ceramic system is held together hermetically by frit glass reflowed at temperatures between 400° - 460° centigrade.
	PDIP		Plastic dual in-line package (PDIP) is widely used for low cost, hand-insertion applications including consumer products, automotive devices, logic, memory ICs, micro-controllers, logic and power ICs, video controllers commercial electronics and telecommunications.
	SIP		Single in-line package (SIP).
	SDIP		Shrink dual in-line package (SDIP).
	SZIP		Shrink zigzag in-line package (SZIP).
	SC-70		SC-70 is one of the smallest available IC packages. It is used in cellular phones, PDAs, electronic games, laptops and other portable and hand-held applications where space is extremely limited.
	Other		Other unlisted, specialized or proprietary IC packages.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Production Status
	Your choices are...
	Full Production		Devices are currently being manufactured.
	Discontinued		Devices are no longer available from the manufacturer, but may still be found in the supply chain.
	In Development		Devices are in development and not yet available.
	New Product		Devices are new products that have been announced by the manufacturer.
	Other		Other unlisted or proprietary production status.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Screening Level
	Your choices are...
	Commercial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for commercial applications.
	Industrial		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for industrial applications.
	Military		Devices support a temperature range and feature mechanical and electrical specifications that are suitable for military applications.
	Other		Other unlisted, specialized or proprietary screening levels.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Packing Method
	Your choices are...
	Tape Reel		Components are packed in tape reel assemblies that include a carrier tape with embossed cavities for storing individual components. A cover tape seals the carrier tape in place. This composite tape is then wound on a reel that is placed in a corrugated shipping box for transport and delivery. Customers unpack the reels and load them into industry-standard, pick-and-place board assembly equipment. Tape and reel assemblies provide component isolation and are designed for surface mount packages such as quad flat package (QFP) and thin quad flat package (TQFP). Typically, carrier tape is made from a polystyrene (PS) or PS-laminate film with a uniform film thickness between 0.2 mm to 0.4 mm. Carrier tape design is defined largely by component length, width, and thickness. Cover tape is made from a polyethylene teraphthalate (PET) film or film laminate with an adhesive applied to the underside of the film. This adhesive is usually heat and pressure sensitive to ensure a positive, consistent seal between the carrier tape and the cover tape. The reels that contain the composite tape are typically made of polystyrene and have one, two, or three parts. Reel dimensions meet EIA-481-1, EIA-481-2, and EIA-481-3 standards.
	Tray / Rail		Components are packed in trays (rails) that are made of carbon-powder or fiber materials and molded into rectangular outlines that contain matrices of uniformly spaced pockets. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. Trays are designed for components for that have leads on four sides and that require component lead isolation during shipping, handling, or processing. For example, quad flat package (QFP) and thin quad flat package (TQFP) components are often shipped in trays. To facilitate shipping and handling, trays are stacked and bound together in standard configurations. To provide rigidity, an empty cover tray is added to the top of the load. Typical stacking configurations consist of five full trays and one cover tray, and ten full trays and one cover tray. Customer requirements determine whether trays are shipped in single or multiple stacks.
	Bulk		Components are distributed as individual parts.
	Tube		Components are packed in shipping tubes or stick magazines that are made of rigid polyvinylchloride (PVC) and extruded in industry-standard sizes. These containers protect components during shipping and provide proper component location and orientation for use with industry-standard, pick-and-place board assembly equipment. To facilitate shipping and handling, shipping tubes and stick magazines are usually loaded into intermediate containers such as boxes or bags to form standard quantities. Intermediate-level packing quantities for shipping tubes and stick magazines often vary by pin count and package type.
	Other		Other unlisted or proprietary packing method.
	Search Logic:		Products with the selected attribute will be returned as matches. Leaving or selecting "No Preference" will not limit the search criteria for this question; products with all attribute options will be returned as matches.

Features


	Input Threshold
	Your choices are...
	TTL		Transistor-transistor logic (TTL).
	CMOS		Complementary metal oxide semiconductor (CMOS).
	TTL/CMOS		Transistor-transistor logic (TTL) and complementary metal oxide semiconductor (CMOS).
	PWM		Pulse width modulation (PWM)
	TTL/PWM		Transistor-transistor logic (TTL) and pulse width modulation (PWM).
	Other		Other unlisted input threshold.
	Search Logic:		All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.

	Integrated Protection		Types: over-voltage protection (OVP), undervoltage lockout (UVLO), thermal shutdown (TSD), over-current protection (OCP), over-voltage protection current (OVPC), etc.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Dead Time Control		Dead time control allows the elimination of shoot-through currents, making the device more efficient.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

	Internal Regulator		An internal regulator controls and regulates the level of the output voltage.
	Search Logic:		"Required" and "Must Not Have" criteria limit returned matches as specified. Products with optional attributes will be returned for either choice.

Gate Drivers Specifications

Driver Type:

Number of Output Channels:

Output Configuration:

Output Voltage:

Peak Output Current:

Supply Voltage:

Rise Time:

Fall Time:

Propagation Delay:

Power Dissipation:

Switching Frequency:

Operating Temperature:

IC Package Type:

Production Status:

Screening Level:

Packing Method:

Input Threshold:

Help with Gate Drivers specifications: