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Supplier: APITech
Description: API Technologies' LTCC is an alternative glass-ceramic multilayer substrate medium that incorporates conventional thick-film-material metal systems, providing a rugged, cost competitive substrate that can incorporate embedded passive components, along with more advanced devices such as
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Aluminum Oxide and Alumina Ceramics - Low Temperature Co-fired Multilayer Ceramic Substrates -- LTCCSupplier: NIKKO Company
Description: conductors Capable of embedded L. C, R components Good thermal expansion coefficient match with Silicon Capable of co-firing surface conductor and overcoat glass
- Aluminum Oxide / Aluminate Type: Alumina / Aluminum Oxide
- Applications: Other, Dielectric Ceramics / Materials
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip low pass filters are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 824MHz ~ 5900MHz EIA case sizes 0402 ~ 0805 (1005~2012M) LTCC (Low
- Frequency (Fc): 824 to 3800 MHz
- Insertion Loss: 0.4200 to 0.9000 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Qorvo
Description: this problem require expensive co-fired ceramics with temperature sensitive materials or current hungry PIN diodes with elaborate area consuming control circuits. This temperature compensating attenuator requires only a single supply voltage and two logic bits to set
- Attenuation: 7.4 dB
- Frequency Range: 0.0500 to 6 GHz
- Package Type: Other
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Description: According to the demands of customers,printing the circuit on the Al2O3/AIN ceramic tapes,after lamination, slicing, high temperature co-firing, brazing, gold plating and other processes, a ceramic and metal integrated package structure with a certain high air tightness
- Material Type: Alumina / Aluminum Oxide
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip diplexers are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 824MHz ~ 5900MHz LTCC (Low Temperature Co-fired Ceramic)
- Device Type: Diplexer
- Insertion Loss: 0.5500 to 3.5 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip couplers are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. Frequency range: 2400MHz ~ 2700MHz LTCC (Low Temperature Co-fired Ceramic)
- Coupling: 9 to 11 dB
- Frequency Range: 2400 to 2700 MHz
- Insertion Loss: 0.7400 dB
- Package Type: Surface Mount Technology (SMT)
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Supplier: Frontier Electronics Corp.
Description: Frontier's series of chip baluns are manufactured using the LTCC (Low Temperature Co-fired Ceramic) process which allows for high performance in a small package. EIA 0603 ~ 0805 case sizes 50O/50O 50O/100O 50O/200O Frequency range: 869MHz ~ 5800MHz LTCC (Low
- Mounting / Form Factor: Chip Transformer
- Operating Frequency Range: 8.69E8 to 5.80E9 Hz
- Package Type: Surface Mount Technology (SMT)
- Standards / Compliance: RoHS Compliant
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Supplier: FX PCB Co., Ltd.
Description: .cm = 10¹³ GB/T 5594.5 Thermal Expansion 10?6 mm 20~300? 2~3 GB/T 5593 The Technology for The Ceramic Circuit Board There are four kinds of technologies: LTCC (Low-temperature Co-fired Ceramic), HTCC (High-temperature Co-fired Ceramic
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.0150 inches
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Description: passive devices and through substrate via • Low-temperature co-fired ceramic and liquid crystal polymer based microwave devices • Large-area printing, inkjet printing and 3D printing materials and processes for RF and THz applications • Engineered metamaterials and plasmonics
- Industry: Electronics and Semiconductor
- Type: Conference
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Supplier: Jiangyin Deli Laser Solutions Co., Ltd.
Description: Technical Specifications for LTCC: Processable materials: low temperature co-fired ceramic (LTCC) Processing aperture: =20µm Processing precision: ±5µm Working area: 400mmX400mm Processing speed: 1000-2000 holes per second Technical
- Applications: Other
- Automation: Semi-automatic
- Media Handling: Metals, Plastics, Semiconductors / Electronics
- Operation: Electric
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Supplier: Zhuhai Cersol Technology Co., Ltd.
Description: heater is a new generation of electric heating elements produced by printing resistance slurry directly on alumina ceramic green body, CO firing at a high temperature of about 1600 °C, and then treated with electrodes and leads. Application It is widely used in daily
- Material Type: Alumina / Aluminum Oxide
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Supplier: RS Components, Ltd.
Description: RS Pro range offers RFBPF Series Multilayer Ceramic Band Pass Filter which have a miniature footprint: 2.0 x 1.2 x 0.8 mm³. Low profile thickness. Low Insertion loss . High Rejection Rate. High attenuation on second harmonic suppressed. LTCC (Low Temperature
- Filter Category: Other
- Package Type: Other
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Supplier: RS Components, Ltd.
Description: RS Pro range offers RFBPF Series Multilayer Ceramic Band Pass Filter which have a miniature footprint: 2.0 x 1.2 x 0.8 mm³. Low profile thickness. Low Insertion loss . High Rejection Rate. High attenuation on second harmonic suppressed. LTCC (Low Temperature
- Filter Category: Other
- Package Type: Other
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Supplier: RS Components, Ltd.
Description: RS Pro range offers RFBPF Series Multilayer Ceramic Band Pass Filter which have a miniature footprint: 1.6 x 0.8 x 0.6 mm³. Low profile Thickness. Low Insertion loss . High Rejection Rate. High attenuation on second harmonic suppressed. Low Temperature
- Filter Category: Other
- Package Type: Other
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Supplier: RS Components, Ltd.
Description: RS Pro range offers RFBPF Series Multilayer Ceramic Band Pass Filter which have a miniature footprint: 1.6 x 0.8 x 0.6 mm³. Low profile Thickness. Low Insertion loss . High Rejection Rate. High attenuation on second harmonic suppressed. Low Temperature
- Filter Category: Other
- Package Type: Other
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Description: electromagnetic microgenerators • polyvinylidene fluoride (PVDF) nanoscale/microscale fiber • piezo-micro-generato rs Presents innovative technologies including LTCC (low temperature co-fire ceramic) processes, and PCB (printed circuit board) processes Uses an
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Supplier: Henkel Corporation - Industrial
Description: cavity or potting dam is required for flow control. LOCTITE ECCOBOND FP4802 is suitable for bare chip protection of a variety of advanced packages, such as Ball Grid Arrays (BGA’s), Chip Scale Packages (CSP’s), Plastic Ball Grid Arrays (PBGA’s), and full arrays on Low Temperature
- Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
- Viscosity: 80000 cP
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Supplier: Richardson RFPD
Description: The AD9042 is a high speed, high performance, low power, monolithic 12-bit analog-to-digital converter. All necessary functions, including track-and-hold (T/H) and reference are included on chip to provide a complete conversion solution. The AD9042 runs off of a single +5 V supply and
- IC Package Type: DIP
- Resolution: 12 bits
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resistance and no chemical reaction with fired ceramic parts, it’s widely work as setter plate ceramic capacitors, sensitive parts, magnetic materials and other electronic components. Max working Temperature: 2600? Working Environment: Atmospheric Environment, Vacuum, Atmospheric Reduction (read more)
Browse Zirconium Oxide and Zirconia Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
The extremely hard surfaces of ceramic/cermet bearings can handle corrosive materials, contaminated lubricant and temperatures beyond the limits of polymers and traditional materials. About Waukesha Bearings (read more)
Browse Ceramic Bearings Datasheets for Waukesha Bearings -
the thermal conductivity of metals with the low thermal expansion of ceramics, AlSiC delivers a rare balance of mechanical and thermal performance that traditional aluminum or steel simply can’t achieve (read more)
Browse Specialty Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
customized services. LTCC ceramic package shell LTCC (Low Temperature Co-fired Ceramic) is a multilayer ceramic substrate, the main components of which are alumina and glass, and high conductivity metals such as gold, silver, and copper are used as conductor pastes (read more)
Browse Glass Ceramics Datasheets for Xiamen Innovacera Advanced Materials Co., Ltd. -
divided into alumina substrates and aluminium nitride substrates according to their materials, and single-layer substrates and multi-layer substrates (two layers) according to their structures. At present, there are four kinds of common ceramic heat dissipation substrates: LTCC (low temperature co-fired (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
) Ionic conductivity Disadvantages of alumina ceramics: Alumina ceramics have low toughness and poor thermal shock resistance, and can not withstand the sharp change of temperature. Low impact resistance, easy to break, unable to resist high pressure impact. At the same time, because of its low brittleness, its subsequent processing capacity is very weak, which is not conducive to recycling. It can only be used once. (read more)
Browse Aluminum Oxide and Alumina Ceramics Datasheets for 3X Ceramic Parts Company Limited -
increasing sensitivity. ST120 TO-5 Series- A single-channel silicon-based thermopile provides lowest cost solutions in a small active area of 1.2mm x 1.2mm in a TO-5 package. Time constant of 25ms with Nitrogen encapsulation gas. Delivers a very low Temperature Coefficient (read more)
Browse Thermopiles Datasheets for Dexter Research Center, Inc. -
Temperature Sensor Module Featuring Expanded Ranges Announced by Dexter Research. Dexter's Temperature Sensor Module is a ready-to use, cost-effective, non-contact IR thermometer. Calibrated output (read more)
Browse Noncontact Infrared Temperature Sensors Datasheets for Dexter Research Center, Inc. -
LUCANT™, a hydrocarbon-based synthetic oil having no polar groups, is a co-oligomer of ethylene and -olefin. The material boasts excellent resistance to heat and cold and low dependence of viscosity on temperature. This co-oligomer has a number of distinctive (read more)
Browse Specialty Polymers and Resins Datasheets for Mitsui Chemicals America, Inc. -
These state-of-the-art Semiconductor Electrostatic Chucks (ESCs) deliver exceptional clamping uniformity and stability. Engineered with high-purity ceramic materials (AlN/Al2O3), they provide reliable performance across ultra-high vacuum and high-temperature (read more)
Browse Oxide Ceramics Datasheets for Fountyl Technologies Pte. Ltd.
Conduct Research Top
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Low Temperature Co-fired Ceramic Substrates
High density 3 dimensional circuitry available in multilayer substrates
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What's Is Machinable Glass Ceramic?
plastics, it is also stable in high temperatures (continuous at 800 Celsius, up to a peak of 1,000 Celsius) with 0.0069% porosity. The ceramic material also acts as an electrical insulator that is radiation resistant and has low thermal conductivity.
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Glass vs. Metal CO2 Laser Tubes
of laser tube the machine uses as its laser source. The two main options you'll come across are water-cooled glass tubes and air-cooled metal tubes. Epilog Laser machines come equipped with metal tubes. Our tubes are also built with quality ceramic components. Let's take a look at both glass and metal
More Information Top
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AbstractsbyID
Paper 10: 46-89466 Design ofa Microstrip Patch Antenna Using Low Temperature Co Fired Ceramic Technology .
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Compact Ku-band Transmitter Design for Satellite Communication Applications
…LC matching 112 Lesson 64 Link budget analysis 23 LMDS 2, 55 LNA vi LNB 91 LO radiation, 16 LO rejection, 9, 41, 46, 125, 132 LO-RF isolation, 13, 30, 46, 98 Low temperature co fired ceramic iii, vi, vii, 4…
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SiO2 -modified carbon paste electrode for electrochemical determination of pyrogallol
a Fabricated by low temperature co fired ceramic technique. b L = 5,7,7,12,14,14 hexemethyl 1,4,8,11 tetraazacyclotetradeca 4,11 diene. c A glassy carbon electrode in an alkaline mixture containing luminol, pyrogallol and KCl. d A…
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Metamaterials and their application in microwaves: A review
In the latter case, the low temperature co fired ceramic (LTCC) method was applied.
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Microwave Dielectric Properties of Low‐Temperature Sinterable BaCe 2 (MoO 4 ) 4 Ceramics
Zhu, M. Lu, H. Zhou, L. Li, and A. Lv, ‘‘Preparation and Properties of Low Temperature Co Fired Ceramic of CaO–SiO2–B2O3 System,’’ J. Mater.
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Integrated microfluidic capillary in a waveguide resonator for chemical and biomedical sensing
Also planned is a novel biosensor packaging scheme on a LTCC ( Low temperature co fired ceramic ) platform Figure.
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Lirias: GaN HEMT Based RF Power Amplifier Design and Integration (Ontwerp en integratie van GaN HEMT gebaseerde RF vermogenversterkers)
Throughout this PhD work, we have studied and proved that low temperature co fired ceramic (LTCC) and multi-chip module deposition (MCM-D) technologies are the most suitable integration platforms for GaN HEMTs.
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Wave guide type photo receiver module with 20 dB amplifier at 60 GHz millimeter wave frequency band
Photographs of 60 GHz photo-receiver module The module consisted of the LTCC ( Low Temperature co fired Ceramic ) substrate with photo diode and pre amplifier chips, covar case with a V connector and a collimated lens set, and a optical fiber pig…
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Advanced Ceramic Technologies & Products
143 7.3 Hybrid IC Incorporating Low Temperature Co - Fired Ceramic Multilayer Substrate (1990–1992)..................................................................
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The Handbook of Advanced Materials: Enabling New Designs Complete Document
Microwave Characteriza- tion of Low Temperature Co - fired Ceramic ,” Proc. 4th Int.