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Supplier: Ironwood Electronics, Inc.
Description: We use the term "Land Sockets" to refer to a part that provides SMT lands for soldering an IC device onto. Land sockets present a pluggable interface to one of our compatible sockets or SMT emulator feet. Land sockets are a very cost effective alternative to large bodied
- Number of Contacts: 144
- Contacts Pitch: 1.27 mm
- Socket Type: BGA
- Contact Plating: Gold Plating
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Supplier: Ironwood Electronics, Inc.
Description: ZIF sockets, such as as our GHzBGA sockets ,allow for repeated hand insertions of IC devices. Production sockets are less expensive than typical ZIF's, but do not hold up to as many insertion cycles.
- Number of Contacts: 144
- Contacts Pitch: 1.27 mm
- Socket Type: BGA
- Features: Clamshell Socket, Other, Solderless, ZIF Lock
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Supplier: Ironwood Electronics, Inc.
Description: the contactor is 0.62 nH with a loss of < 1 dB at 10 GHz. The current capacity of each contactor is 4 amps at ambient temperature. Socket temperature range is -40C to +150C. The socket is mounted to the PCB with a backing plate and requires only 2.54mm border around the IC. The
- Number of Contacts: 144
- Contacts Pitch: 0.8 mm
- Socket Type: BGA
- Features: Clamshell Socket, Other, Solderless, ZIF Lock
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Supplier: Newark, An Avnet Company
Description: SOCKET MODULE, 121 BGA, FOR MPLAB PM3; Accessory Type:PM3 Socket Module for 121P BGA (10x10); For Use With:DV007004 MPLAB PM3 Universal Device Programmer; Features:Socket Module Supports 144L LQFP Packages; Product Range:- RoHS Compliant: NA
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: parts, BOM lines, package options, lifecycle status, and procurement availability. Key searchable attributes include 32-bit, 32bit, 66MHz, BGA. Search-friendly keywords include connector, interconnect, header, socket, terminal block, 32-bit, 32bit, 66MHz, BGA, Electronic
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Thermal Resistance: 5.48 °C / W
- Material: Aluminum
- Device: Passive Heat Sink
- Mounting: Socket Mount
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ic chips - offers from ic chips manufacturers, suppliers, exporters & wholesalers
860 ic chips Products Page 1 of 144 BGA324 Test Socket Test Fixture Chip Socket IC Socket BGA Test ...
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ic chip - offers from ic chip manufacturers, suppliers, exporters & wholesalers
860 ic chip Products Page 1 of 144 BGA324 Test Socket Test Fixture Chip Socket IC Socket BGA Test ...
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Third Party Company Page:Xeltek Inc.
… broad range of products ranging from 48-pin entry-level universal programmers to 144 -pin drivers, ultra … Xeltek also manufactures ISP Programmers, Automated Handlers and full line of socket adapters including PLCC, SOIC, SOP, TSOP, QFP, SDIP, and BGA .
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Coupled Data Communication Techniques for High-Performance and Low-Power Computing
144 L2: BGAL2: BGA Socket .
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IC Component Sockets
… contact design, 103 S-type side contact design, 105 tweezer contact design, 107 wiggle wire contact design, 105 wire-in-elastomer contact design, 104 Y contact design, 106 BGA /CSP package, 100 Burn … … adhesives, 3 IC component sockets , 3 solder joints, 2 … … 29, 52, 53, 55, 56, 58–60, 62–72, 74, 80, 127, 138, 139, 141– 144 , 151, 152, 158 …
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2009 Index IEEE Transactions on Device and Materials Reliability Vol. 9
… Razmi, J., Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints; TDMR … Assessing the Reliability of Elas- tomer Sockets in Temperature Environments; TDMR March 2009 80-86 Lu, G … … Quantification of Plasma-Induced Damage Detected on Productive Hardware; TDMR June 2009 135- 144 Martin, A., see …
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Soldering: Understanding the Basics
144 / Soldering—Understanding the Basics They are often mounted on PCBs either by being in- serted into a socket or by through … The result was the BGA , a surface-mount package that uses an ordered array of preplaced solder …
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Low Power Methodology Manual
Interestingly with typical silicon the 50% performance level ( 144 MHz) is no more energy efficient than 67% … Thus, the actual silicon has additional IR drop from the circuit board, BGA socket , bonding wires and on-chip power rails – while the transistor sim- ulations do not take any of these into account.
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First Programmable, Powerline Communication Chipset Runs Both The Powerline Mac And Your Application Software*
… to floor in a building, and still access the powerline network from any ordinary wall socket . " The MAX2980 and MAX2986 are packaged in 64-pin LQFP and 144 -pin BGA , respectively.
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http://www-us-east.intel.com/content/dam/doc/design-guide/xeon-e7500-e7501-chipset-guide.pdf
mPGA604 Socket Only The MCH is a 1005-ball FC- BGA package and contains the following functionality: • System Bus … • Memory Bus — 144 -bit wide, DDR200 / DDR266 memory interface with memory peak bandwidth of …