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Supplier: Ironwood Electronics, Inc.
Description: ZIF sockets, such as as our GHzBGA sockets ,allow for repeated hand insertions of IC devices. Production sockets are less expensive than typical ZIF's, but do not hold up to as many insertion cycles.
- Contact Plating: Gold Plating
- Contacts Pitch: 1 mm
- Features: Solderless, ZIF Lock
- Mounting: Other
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Supplier: Ironwood Electronics, Inc.
Description: We use the term "Land Sockets" to refer to a part that provides SMT lands for soldering an IC device onto. Land sockets present a pluggable interface to one of our compatible sockets or SMT emulator feet. Land sockets are a very cost effective alternative to large bodied
- Contact / Pin Type: Low Profile Pins
- Contact Plating: Gold Plating
- Contacts Pitch: 1.27 mm
- Mounting: SMT, Through-hole
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Supplier: Ironwood Electronics, Inc.
Description: constructed of aluminum which provides heatsinking up to 7.5 watts. Custom heatsinks can easily be designed for higher power dissipation. The user simply places the IC into the socket, closes the lid, and rotates the heatsink screw to seat the IC. PCB finish on pads can be HASL, Immersion,
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: Ironwood Electronics, Inc.
Description: These adapters provide ZIF sockets for the BGA device. Several styles of ZIF sockets are employed, includng "Clam Shell", "Open Top", and "Open Top with Lever". All of the ZIF sockets employ gold contacts and are capable of 10,000 insertion cycles.
- Features: Solderless, ZIF Lock, Open Top Socket
- Product Type: Prototyping Adapters
- RoHS Compliant: Yes
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Socket Mount
- Thermal Resistance: 5.71 °C / W
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Socket Mount
- Thermal Resistance: 5.48 °C / W
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Socket Mount
- Thermal Resistance: 5.48 °C / W
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Device: Passive Heat Sink
- Material: Aluminum
- Mounting: Socket Mount
- Thermal Resistance: 20.62 °C / W
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Supplier: RS Components, Ltd.
Description: The SuperPro-6100 is an universal programmer equipped with ARM9 processor in USB 2.0 interface. Equipped with a 48-pin ZIF socket it can program over 88000 differents components among EPROMs, EEPROMs, FLASHs memories, PLDs and microcontrollers. Additionally, it can program components up to
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ic chips - offers from ic chips manufacturers, suppliers, exporters & wholesalers
860 ic chips Products Page 1 of 144 BGA324 Test Socket Test Fixture Chip Socket IC Socket BGA Test ...
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ic chip - offers from ic chip manufacturers, suppliers, exporters & wholesalers
860 ic chip Products Page 1 of 144 BGA324 Test Socket Test Fixture Chip Socket IC Socket BGA Test ...
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Third Party Company Page:Xeltek Inc.
… broad range of products ranging from 48-pin entry-level universal programmers to 144 -pin drivers, ultra … Xeltek also manufactures ISP Programmers, Automated Handlers and full line of socket adapters including PLCC, SOIC, SOP, TSOP, QFP, SDIP, and BGA .
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Coupled Data Communication Techniques for High-Performance and Low-Power Computing
144 L2: BGAL2: BGA Socket .
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IC Component Sockets
… contact design, 103 S-type side contact design, 105 tweezer contact design, 107 wiggle wire contact design, 105 wire-in-elastomer contact design, 104 Y contact design, 106 BGA /CSP package, 100 Burn … … adhesives, 3 IC component sockets , 3 solder joints, 2 … … 29, 52, 53, 55, 56, 58–60, 62–72, 74, 80, 127, 138, 139, 141– 144 , 151, 152, 158 …
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2009 Index IEEE Transactions on Device and Materials Reliability Vol. 9
… Razmi, J., Interaction Effect of Voids and Standoff Height on Thermomechanical Durability of BGA Solder Joints; TDMR … Assessing the Reliability of Elas- tomer Sockets in Temperature Environments; TDMR March 2009 80-86 Lu, G … … Quantification of Plasma-Induced Damage Detected on Productive Hardware; TDMR June 2009 135- 144 Martin, A., see …
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Soldering: Understanding the Basics
144 / Soldering—Understanding the Basics They are often mounted on PCBs either by being in- serted into a socket or by through … The result was the BGA , a surface-mount package that uses an ordered array of preplaced solder …
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Low Power Methodology Manual
Interestingly with typical silicon the 50% performance level ( 144 MHz) is no more energy efficient than 67% … Thus, the actual silicon has additional IR drop from the circuit board, BGA socket , bonding wires and on-chip power rails – while the transistor sim- ulations do not take any of these into account.
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First Programmable, Powerline Communication Chipset Runs Both The Powerline Mac And Your Application Software*
… to floor in a building, and still access the powerline network from any ordinary wall socket . " The MAX2980 and MAX2986 are packaged in 64-pin LQFP and 144 -pin BGA , respectively.
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http://www-us-east.intel.com/content/dam/doc/design-guide/xeon-e7500-e7501-chipset-guide.pdf
mPGA604 Socket Only The MCH is a 1005-ball FC- BGA package and contains the following functionality: • System Bus … • Memory Bus — 144 -bit wide, DDR200 / DDR266 memory interface with memory peak bandwidth of …