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Supplier: ToneCooling Technology Co., Ltd
Description: loads Aerospace Applications: FSW liquid cold plates in aerospace applications manage extreme temperatures, ensuring reliable performance and safety of components in spacecraft, satellites, and aircraft systems. Medical equipment Applications: CPU and GPU liquid cold
- Weight: 6,000 g
- Material: Aluminum
- Device: Liquid Cooler/Cold Plate
- Features: Other Materials
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Supplier: Boyd
Description: Liquid Cold plates are a critical component of a liquid cooled system. Aavid's liquid cold plate technology is the broadest range designed and manufactured in the industry. Our global capabilities enable us to develop and produce more efficient and compact cooling for
- Technology: Plate
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Description: LCP-21 Cascade Cold Plate Description: Low Temperature Cascade Voltages: 24 VDC Requirement: One of the following liquid chillers: TLC-900, TLC-1400, RLC-900, RLC-1800, RLC-1400 OR coolant flow Applications: Laboratory or industrial environments, drugs and industrial chemicals. Process
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Supplier: Solid State Cooling Systems
Description: This liquid cold plate has a high efficiency, plate-fin design, and interior can be Teflon®-coated for corrosion resistance.
- Primary Material: Aluminum
- Application / Industry: Electronics / Power Supply Cooling
- Connection Options: NPT
- Technology: Plate
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Supplier: Boyd
Description: Low profile and lightweight alternative to typical extended surface cold plates for more cost sensitive applications. Typically CAB brazed for higher volume production.
- Device: Liquid Cooler/Cold Plate
- Heat sink Fin Style:: Stamped Metal
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Supplier: Boyd
Description: Aavid, Thermal Division of Boyd Corporation’s tube liquid cold plates feature copper or stainless steel tubing pressed into aluminum plates. Tube cold plates feature a joint free continuous tube mechanically interlocked into an extruded aluminum plate. These
- Length: 152.4 to 304.8 mm
- Width: 88.9 to 127 mm
- Weight: 400 to 900 g
- Material: Aluminum
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Supplier: Boyd
Description: Flat Tube Liquid Cold Plates utilizing aluminum multi-port extrusion (MPE) tubing are compact thermal management solutions that offer extremely low thermal resistance. These extrusions utilize thin external walls which minimize thermal resistance between the cold plate
- Weight: 50 g
- Material: Aluminum
- Device: Liquid Cooler/Cold Plate
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Supplier: Richardson RFPD
Description: STANDARD LIQUID COLD PLATE
- Device: Liquid Cooler/Cold Plate
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Supplier: ToneCooling Technology Co., Ltd
Description: loads Aerospace Applications: FSW liquid cold plates in aerospace applications manage extreme temperatures, ensuring reliable performance and safety of components in spacecraft, satellites, and aircraft systems. Medical equipment Applications: CPU and GPU liquid cold
- Material: Aluminum, Copper
- Features: Other Materials
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface –
- Primary Material: Aluminum
- Application / Industry: Electronics / Power Supply Cooling
- Connection Options: NPT
- Technology: Plate
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: low-pressure drop, all at a low price! Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patent and patent-pending design allows for efficient heat transfer at a low cost. Uniform thermal resistance over entire surface –
- Primary Material: Aluminum
- Application / Industry: Electronics / Power Supply Cooling
- Connection Options: NPT
- Technology: Plate
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Supplier: ToneCooling Technology Co., Ltd
Description: loads Aerospace Applications: FSW liquid cold plates in aerospace applications manage extreme temperatures, ensuring reliable performance and safety of components in spacecraft, satellites, and aircraft systems. Medical equipment Applications: CPU and GPU liquid cold
- Material: Aluminum
- Device: Liquid Cooler/Cold Plate
- Features: Other Materials
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Description: CCP-22 Cascade Cold Plate Description: Low Temperature Cascade Voltages: 24 VDC Requirement: AHP-1200CPV for Cascades Part Number: 9-35EB-1-CAS Applications: Laboratory or industrial environments, drugs and industrial chemicals. Process testing. Quality control. Includes: Internal RTD
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Supplier: ToneCooling Technology Co., Ltd
Description: Cold Plate Brands High? This guide on Top 5 liquid cold provides key insights for engineers and […]
- Material: Aluminum
- Features: Other Materials
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: Liquid Cold Plate Item No.: TY-L02 Material: C1220 Size: 6.35*T0.75*R10.0/R25.4 Appearance: Bending place no creases, inner and outer surface clean, no impurities Parameters: Flat< 13%, pressure >3Mpa Application: Liquid cooling, water cooling, thermoelectric cooling system
- Type: Copper, Brass or Bronze Alloy (UNS C)
- Features: Fabricated (Casting / Forging), Non-ferrous - Any Type, Other, Specialty / Other Alloy
- Shape / Form: Semi-finished Shape / Mill Stock
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Supplier: USUSTK LIMITED
Description: Application: High-power Laser Equipment
- Material: Aluminum, Copper
- Device: Liquid Cooler/Cold Plate
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Supplier: Solid State Cooling Systems
Description: Low thermal resistance: designed for < 1 gpm coolant flow. Ideal for use with thermoelectric modules, power semiconductors and other direct cooling applications. Patented and patent-pending designs allows for efficient heat transfer at low cost. Uniform thermal resistance over entire surface – no
- Primary Material: Aluminum
- Application / Industry: Electronics / Power Supply Cooling
- Connection Options: NPT
- Technology: Plate
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: Custom Liquid Cold Plate Item No.: TY-L07 Material: C1220 Size: D9.53*T1.25*R12.7 Appearance: Bending place no creases, inner and outer surface clean, no impurities Parameters: Flat< 13%, pressure>3Mpa Application: Liquid cooling, water cooling, thermoelectric cooling system
- Overall Width / OD: 0.375197053 inch
- Type: Copper, Brass or Bronze Alloy (UNS C)
- Features: Fabricated (Casting / Forging), Non-ferrous - Any Type, Other, Specialty / Other Alloy
- Shape / Form: Semi-finished Shape / Mill Stock
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: Copper Liquid Cold Plate Item No.: TY-L10 Material: TPM2/6061 Size: 280×101.6x10mm Appearance: Bending place no creases, inner and outer surface clean, no impurities Parameters: Flat< 13%, pressure >3Mpa Application: Liquid cooling, water cooling, thermal cooling system, thermal
- Type: Aluminum / Aluminum Alloy (UNS A), Copper, Brass or Bronze Alloy (UNS C)
- Features: Copper Alloy (Brass, Bronze), Fabricated (Casting / Forging), Non-ferrous - Any Type, Other, Specialty / Other Alloy
- Shape / Form: Semi-finished Shape / Mill Stock
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power semiconductor
- Length: 114.29993827803334 mm
- Width: 152.39991770404444 mm
- Height: 19.049989713005555 mm
- Weight: 805.0000000000001 g
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Supplier: USUSTK LIMITED
Description: Manufactured with high-precision CNC skiving technology, achieving a fin thickness of 0.06 mm and a fin pitch of 0.1 mm. This extreme structure design increases the heat dissipation surface area by up to 300% compared to traditional cold plates.
- Material: Copper
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE; Thermal Resistance:0.005°C/W; Packages Cooled:-; External Width - Metric:127mm; External Height - Metric:17.53mm; External Length - Metric:381mm; External Diameter - Metric:-; Heat Sink Material:Aluminium RoHS Compliant: Yes
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Supplier: Aitech Defense Systems, Inc.
Description: Harsh Mechanical, Climatic, Chemical and Electrical Stresses Environmentally Sealed Compact and Lightweight with Five (5) Standard VME Slots Internally Conduction-Cooled; Externally Cold Plate Cooled Fully Sealed Faraday Cage and Complete EMI/RFI Power Line Filtering Customized Front
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Supplier: Accuris
Description: Rugged Small Form Factor - Cooled via Conduction to Cold Plate
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Supplier: Newark, An Avnet Company
Description: Liquid Cold Plates for Rectifiers and Power Diodes RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 4-PASS, 12 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:305mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Newark, An Avnet Company
Description: LIQUID COLD PLATE, 6-PASS, 6 INCH; Thermal Resistance:-; Packages Cooled:-; External Width - Metric:-; External Height - Metric:-; External Length - Metric:152mm; External Diameter - Metric:-; Heat Sink Material:Aluminium, Copper RoHS Compliant: Yes
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Supplier: Accuris
Description: HOLDER, ELECTRICAL CARD, WEDGE RETAINERS, 7 BODY, FOR COLD PLATE APPLICATIONS, GENERAL REQUIREMENTS FOR
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Supplier: Accuris
Description: HOLDER, ELECTRICAL CARD, CARD GUIDE-RETAINER, LEVER ACTUATED, METAL, FOR COLD PLATE MOUNTING
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Supplier: Accuris
Description: HOLDER, ELECTRICAL CARD, WEDGE RETAINERS, 3 PIECE, FOR COLD PLATE APPLICATIONS, GENERAL REQUIREMENTS FOR
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Supplier: LAPP
Description: SKINTOP® COLD strain relief cable glands are designed for areas where mechanical stability and cold resistance are critical. Typical applications include cold storage facilities, offshore areas, and plant engineering.
- Opening Diameter: 0.039 to 1.773 inch
- Pressure Rating: 72.51885 to 145.0377 psi
- Temperature Range: -94 to 212 F
- Material: Brass, Nylon / Polyamide
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Supplier: SAE International
Description: This specification covers one type of copper in the form of sheet, strip, and plate.
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Supplier: SAE International
Description: This specification covers one type of copper in the form of sheet, strip, and plate.
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Supplier: Hoover Steel, Inc.
Description: Cold Rolled Sheet All inquiries are welcome! Inquire for Abrasion Resistant (AR) Plates Shearing and bending services available.
- Gauge Thickness: 18 Gauge
- Type: Carbon Steel (UNS G)
- Processing, Temper & Finish: Cold Finished / Rolled / Drawn
- Applications: Construction & Building / Architectural
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Description: High yield strength steel plates and wide flats for cold forming -- Part 1: Delivery conditions for thermomechanically-rolled steels
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Advanced thermal systems require high-performance cooling solutions that efficiently manage heat loads while meeting strict space, reliability, and production requirements. Engineers often face challenges in optimizing cold plate structures, material selection, coolant flow paths, and (read more)
Browse Heat Exchangers Datasheets for ToneCooling Technology Co., Ltd -
The USUSTK Skived Cold Plate (MLCP) is designed for liquid cooling of data-center servers, high-density computing systems and industrial edge-computing equipment. Manufactured using aluminum and copper materials, the cold plate combines precision skiving with CNC machining. The skiving (read more)
Browse CPU Coolers Datasheets for USUSTK LIMITED -
Optimized Thermal Management for High-Power Applications Cold plate technology addresses critical pain points in electronic systems—overheating, reduced efficiency, and (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
Tone Cooling manufactures liquid cold plates using advanced Friction Stir Welding (FSW) technology to provide efficient and reliable thermal management solutions for high-power applications. By combining optimized coolant channel designs with high (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
The FSW (Friction Stir Welded) liquid cold plate is engineered for high-performance thermal management, providing efficient heat dissipation for high-power electronic (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
losses and energy inefficiencies. Our Cu-Gr cold plates combine 800 W/m·K thermal conductivity, low CTE (4×10-6/°C), and biomimetic fractal coolant channels, enabling sub-second annealing (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
The USUSTK Copper Tube Cold Plate is designed for thermal management in high-power laser systems, photonics equipment and industrial optoelectronic applications. The cold plate combines a CNC-machined AL6063 aluminum base with embedded C1020 copper tubing. The copper tube is arranged (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
The USUSTK Copper Pin-Fin Liquid Cold Plate is designed for thermal management of IGBT and SiC power modules used in electric vehicles, electric drive systems, inverters and other high-power electronic equipment. Manufactured from T2 copper or C11000 copper, the cold (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED -
The USUSTK C1020 Copper CPU Cold Plate is designed for liquid cooling of high-power processors used in AI servers, data centers and high-performance computing systems. Manufactured from C1020 oxygen-free copper, the cold plate combines high-precision CNC machining with precision skiving (read more)
Browse CPU Coolers Datasheets for USUSTK LIMITED -
The USUSTK C1020 Copper Cold Plate is designed for liquid cooling in data-center servers and high-density computing equipment. Manufactured from C1020 oxygen-free copper, the cold plate combines precision skiving with CNC machining. The skived heat-transfer structure increases the (read more)
Browse Heat Sinks Datasheets for USUSTK LIMITED
Conduct Research Top
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Selecting A Cold Plate Technology
To select the best cold plate for your application, you need to know the cooling fluid flow rate, the fluid inlet temperature, the heat load of the devices attached to the cold plate, and the maximum desired cold plate surface temperature, Tmax. From these you can determine the maximum allowable
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Designing Custom Cold Plates
Liquid-cooled cold plates offer superior cooling for high power electronic devices, and can be purchased as standard products or can be custom designed. A custom cold plate is needed when there is a special shape or interface requirement or an extreme performance requirement. An extreme performance
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Liquid Cold Plate Selector Tool
For help selecting a standard liquid cold plate
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Assessing the Quality of a Tubed Cold Plate
As many applications move from air cooling to liquid cooling, tubed cold plates are often the technology of choice. Their growing presence begs the question "What are the significant criteria for selecting a high quality tubed cold plate?" Most machine shops are able to produce a tubed cold plate
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Cold Plate Manufacturing Cost Drivers
Cold plate prices can vary quite a bit; understanding why can help you cut costs and still obtain the performance you need to properly cool your application. The two biggest cost drivers in cold plate manufacturing are thermal performance requirements and annual demand, which generally thermal
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Sizing a Heat Exchanger for Cold Plate Applications
In many liquid cooling loops, the heat that is picked up by a cold plate is rejected to the ambient air via a heat exchanger. Figure 1 shows a typical liquid cooling loop, consisting of a cold plate (CP), pump, and heat exchanger (HX) connected by hoses or tubing. Since the components are part
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Coatings for Custom Heat Exchangers and Cold Plates
Custom heat exchangers and cold plates are often coated for corrosion protection or for cosmetic purposes. Chemical conversion coating, anodization, e-coating, and painting are four coating options that will help to minimize corrosion and/or result in a more attractive component. One of the most
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Aluminum Corrosion Resistance for Cold Plates and Plate-Fin Heat Exchangers
Aluminum cold plates and plate-fin heat exchangers are commonly used for liquid cooling in military and aerospace applications because of their light weight and high performance. There are many factors to consider when designing these cold plates and heat exchangers: thermal performance, size
More Information Top
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ENCYCLOPEDIA OF THERMAL PACKAGING - SET 1: THERMAL PACKAGING TECHNIQUES (A 6-VOLUME SET)
…Packaging Techniques ISBN 978-981-4313-78-0 (A 6-Volume Set) Vol. 1: Microchannel Heat Sinks for Electronics Cooling by Suresh V Garimella & Tannaz Harirchian (Purdue University, USA) Vol. 2: Air- and Liquid-Cooled Cold Plates by Allan Kraus (Kraus…
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Thermal Management for LED Applications
Conductive environment is realized by different cold plate structures.
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Proceedings of the International Conference on Research and Innovations in Mechanical Engineering
A circuit board with a specific geometry and chip arrangement will be cooled using a liquid-cooled cold plate .
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Neural mechanisms of early motor control in the vocal behavior of juvenile songbirds
P- and n-type semiconductors can be cleverly alternated between two plates (Fig. la), so that heat is pumped from one plate (the cold plate ) and into another (the hot plate) as current flows back and forth through the device.
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The design and performance of twenty barrel hydrogen pellet injector for Alcator C-MOD
…3.2.3) Radiation 60 3.2.4) Refrigerator Equilibrium Temperature and Heat Load 62 3.3) Temperature Profiles 62 3.3.1) Contact Resistance and Refrigerator to Barrel Temperature Gradients 62 3.3.2) Barrel Cold Plate Isotherms 65 3.3…
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Cooling Techniques for Electronic Equipment 2nd Edition
2.2 Dip-Brazed Boxes with Integral Cold Plates I 22 .
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Experimental and Analytical Characterization of Copper Fin Patterns for Heat Sinks in Liquid Cooling Loops for Motor Drives
Air-cooled aluminum heat sinks and even liquid-cooled aluminum cold plates were once widely used (1), but as some military and commercial applications have arrived at multi-megawatt requirements, liquid cooling using copper cold plates has become more common In an…
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Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices
In this paper, a hybrid solid- and liquid- cooling system design, which combines cold plate liquid cooling and TE solid-state cooling, is proposed for thermal management of a 10×10 mm IGBT chip.
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