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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Length: 60 mm
- Width: 60 mm
- Height: 16 mm
- Device: Passive Heat Sink
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader
- Mounting: Adhesive / Tape
- Material: Copper
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat sink skiving Heat sink skiving is a big deal in the electronics industry.
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: Xoxide
Description: cools your CPU, but also drives air to your surrounding components helping to cool items such as your RAM, MOSFETS, chipset heat sink, and even the back of your graphics card! The Extreme-X CPU Cooler from Enzotech enters the cooling market like a storm, devastating
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Supplier: ToneCooling Technology Co., Ltd
Description: applications. ToneCooling provides expert insights on a […] This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: ToneCooling Technology Co., Ltd
Description: This active TC-LGA4189 CPU cooler is designed for reliable cooling of Intel Xeon processors on rectangular motherboards within 2U server environments. It combines a copper base with aluminum fins, heat pipes, and a high-speed PWM fan to ensure efficient thermal management. Key
- Width: 78 mm
- Height: 64.5 mm
- Fan Airflow: 34.74 SCFM
- Fan Speed: 2,100 to 8,000 rpm
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Supplier: ToneCooling Technology Co., Ltd
Description: This active TC-LGA4189 CPU cooler is designed for Intel Xeon processors on rectangular motherboards in 2U server environments and above. It delivers maximum cooling performance with a copper base, aluminum fins, heat pipes, and a high-speed PWM fan for systems requiring
- Length: 113 mm
- Width: 79 mm
- Height: 64.5 mm
- Fan Airflow: 62 SCFM
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon® 2.60GHz CPU Socket : 603/604 Solution : 60 x 60 x 10mm fan, Copper Heatsink, 1U server solution
- Length: 89.30000000000001 mm
- Width: 62 mm
- Height: 25 mm
- Weight: 334 g
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built
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Supplier: Xoxide
Description: Slip Stream 120mm case fan. Incredibly easy to install, the Scythe Ninja 2 boasts a tool-free design that allows the user to set-up their CPU cooler with very little hassle. One of the most impressive features of the Scythe "NINJA 2" 6 Heat Pipes CPU Cooler is its Advanced Wave
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Supplier: Xoxide
Description: restriction. The CPU-370 contains a copper cold plate with brass top. As with all Koolance products, nickel plating is added to improve corrosion resistance. Two universal steel mounting brackets are included for mainstream Intel and AMD processors. The CPU-370 has standard G
- Device: Cold Plate
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Supplier: Rego Electronics Inc.
Description: Solution : 2U&Up Server CPU Socket : 1155/1156/1150 Outline Dimension : 90.75 x 89.50 x 65.25mm Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki Connector Type : 4
- Length: 90.75000000000001 mm
- Width: 89.50000000000001 mm
- Height: 65.25 mm
- Device: Active Heat Sink
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Material: Copper
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Features: Other Materials
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® 775-land LGA Package.
- Length: 72.10000000000001 mm
- Width: 72.10000000000001 mm
- Height: 62.6 mm
- Weight: 575.0000000000001 g
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Supplier: Rego Electronics Inc.
Description: precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 90 x 90 x 27 mm Heat Sink : Copper Stacked Fins with Vapor Chamber Base Thermal Resistance : 0.207 ℃/W @ 30 CFM Weight : 435 g
- Length: 90 mm
- Width: 90 mm
- Height: 27 mm
- Weight: 435 g
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Supplier: Corsair Memory
Description: You’ve invested a lot into your Intel or AMD CPU. Now’s the time to protect it and make it run better. Excessive heat is the deadly enemy of high-performance silicon, and the Air Series A50 CPU cooler can extend the lifetime of your CPU by quietly and efficiently drawing
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Supplier: Rego Electronics Inc.
Description: These high performance coolers solve tough cooling issue at high CPU TDP at 95 watts in 1U chassis. Contact us now for more information! Rego Cooler Information: Part number : RG3123 Application : Industrial PC with 1U Chassis CPU Socket : 1155/1156/1150 Outline Dimension :
- Length: 92.10000000000001 mm
- Width: 90.3 mm
- Height: 30.7 mm
- Thermal Resistance: 0.27 °C / W
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Supplier: Corsair Memory
Description: significantly outperforms your CPU’s stock heatsink, but does it quietly. The Corsair Air Series A70 High-Performance CPU Cooler uses advanced thermal engineering technology to deliver superior air cooling performance: four 8mm copper heatpipes directly contact your CPU,
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Supplier: Corsair Memory
Description: modern CPU sockets. The Hydro Series H100: Go long. Want even more? Featuring a full 240mm radiator and two 120mm fans, the Corsair Hydro Series H100 extreme performance liquid CPU cooler is designed to deliver cooling performance that meets the needs of even the most demanding
- Device: Cold Plate, Liquid Cooler/Cold Plate
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
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Supplier: Computer Network Accessories, Inc.
Description: Intel P4 Socket 775 (Prescott FMB2 Solution) 3.8GHz ball bearing CPU cooler fan. Fan dimensions: 92mm x 92mm x 25mm Heat sink material: Copper Supports CPU speeds up to: 3.8GHz Fan speed: 2,600 +/- 10% RPM Noise level: <22.5 dBA
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Supplier: Custom Thermoelectric
Description: All copper water block Liquid exchanger (compact mini heat sink) to rapidly remove heat from the hot side of peltier TECs, TEGs, CPUs or any device that needs rapid efficient heat removal. Most efficient method of removing heat from a thermoelectric
- Primary Material: Copper
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Supplier: RS Components, Ltd.
Description: Heat pipe 12mm OD, 300mm, 50W, sintered
- Length: 300.00000000000006 mm
- Width: 12 mm
- Material: Copper
- Features: Other Materials
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Supplier: USUSTK LIMITED
Description: Application: Telecommunication Equipment
- Material: Aluminum, Copper
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Supplier: USUSTK LIMITED
Description: Application: Telecommunication Equipment
- Material: Aluminum, Copper
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Supplier: USUSTK LIMITED
Description: Application: Telecommunications
- Material: Copper
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Supplier: Newark, An Avnet Company
Description: HEAT SINK; Thermal Resistance:15°C/W; Packages Cooled:TO-252; External Width - Metric:22.86mm; External Height - Metric:10.01mm; External Length - Metric:8mm; External Diameter - Metric:-; Heat Sink Material:Copper; Product Range:- RoHS Compliant: Yes
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Supplier: Boyd
Description: For high volume production, Aavid zipper fins are the most cost efficient method for high fin density heat sinks. These fins are made from a stamped material, typically aluminum or copper, and are folded into shape with interlocking grooves. The fins are then typically soldered,
- Material: Aluminum, Copper
- Features: Other
- Device: Passive Heat Sink
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Supplier: Cooliance
Description: Custom heat pipes Cooliance offers a wide range of heat pipes. The path, length and width of heat pipes vary from application to application so most heat pipes are custom designed. Cooliance can integrate heat pipes with remote cool plates or heat
- Material: Aluminum, Copper
- Heat sink Fin Style:: Heat Pipes
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: HEAT SINK, COPPER, SMD; Thermal Resistance:-; Packages Cooled:TO-263; External Width - Metric:25.4mm; External Height - Metric:19.38mm; External Length - Metric:11.43mm; External Diameter - Metric:-; Heat Sink Material:Copper RoHS Compliant: Yes
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Thermal Resistance: 0.68 °C / W
- Material: Copper, Mixed Material
- Features: Other, Other Materials
- Device: Passive Heat Sink
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Length: 114.29993827803334 mm
- Width: 152.39991770404444 mm
- Height: 19.049989713005555 mm
- Weight: 805.0000000000001 g
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Supplier: Boyd
Description: of a custom heat sink, or utilized in a thermal system such as a heat exchanger. Benefits/Features Materials of Construction: Aluminum-Carbon Steel Alloys Copper Cupro Nickel Inconel Nickel Alloys Stainless Steel Design Configuration: Custom Flat Crested Lanced and Offset
- Height: 0.76 to 50.800000000000004 mm
- Material: Aluminum, Copper, Mixed Material
- Heat sink Fin Style:: Folded Fin
- Features: Other Materials
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Supplier: Airflow/Y.S. Tech, Inc.
Description: CAD modeling, contact analysis, spring pressure, and interface materials. Style Options for Custom Heat Sinks Castings Pin fin heatsinks Skived fin heatsinks High aspect ratio heatsinks Extrusion Thermal modules Material Options for Custom Heat Sinks Aluminum heat
- Length: 19 to 482 mm
- Material: Aluminum, Copper
- Device: Passive Heat Sink
- Heat sink Fin Style:: Straight Fin
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High-Performance Aluminum Heat Sink for Effective Thermal Management. Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling efficiency for electronics, automotive systems, industrial machinery, and LED lighting. Efficient Heat Dissipation: Engineered to transfer heat away from sensitive components, maintaining ideal operating temperatures... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Rego Cooler Information-. Part Number : RG3223. Solution : 2U & Up Server. CPU Socket : 1155 / 1156 / 1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded. Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki. Connector Type : 4 ways (PWM Function). Thermal Resistance : 0.18 ?/W ( TDP(max) : 150 Watts ). Noise Level : 44 d B(A). Storage Temperature : - 30? ~ + 70?. Operating Temperature : - 10... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Advantages of the Birch Stream Liquid Cooling Plate: Efficient Heat Dissipation, Stable Operation: The Birch Stream liquid cooling plate features an advanced liquid cooling circulation system, paired with a large pure copper base and high-density cooling fins. It rapidly dissipates heat generated by the CPU, effectively lowering CPU temperatures and ensuring system stability, preventing performance throttling or crashes caused by overheating. Quiet Operation, Immersive Experience: Compared... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
27.5mm. Noise Level : 59 dB(A). Connector Type : 2543-4P. Thermal Resistance : 0.39 C/W. Weight : 330 g. Part Number : RG3114(Z). Solution : Rugged Computer with 1U Chassis. CPU Socket : 1155 /1156 /1150. Outline Dimension : 90 x 90 x 22.5mm. Noise Level : 46 dB(A). Connector Type : 2543-4P. Thermal Resistance : 0.45 C/W. Weight : 310 g. Part number : RG3223. Solution : 2U &Up Server. CPU Socket : 1155/1156/1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
The NVIDIA GPU H800 single-width liquid cooling plate is designed to deliver efficient heat dissipation in high-performance computing environments, ensuring systems operate at peak efficiency. Key features include: High Thermal Conductivity: Quickly transfers heat from the GPU/CPU to the coolant for optimal heat dissipation. Customizable Options: Available in multiple sizes and configurations to fit various CPUs and GPUs for broad compatibility. Precision Crafting: Built with high accuracy... (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
2510-4P. Thermal Resistance : 0.268 ?/W. Weight : 480 g. Socket R LGA 2011 Coolers_RG4111-P. Outline Dimension : 106 x 70 x 25.5 mm. Heat Sink : Skived C1100. Thermal Resistance : 0.238 ?/W @ 25 CFM. Weight : 550 g. Socket R LGA 2011 Coolers_RG4112-P. Outline Dimension : 104 x 70 x 25 mm. Heat Sink : Forged AL6063 fins with C1100 Base. Thermal Resistance : 0.25 ?/W @ 800LFM. Weight : 350 g. Socket R LGA 2011 Coolers_RG4120. Outline Dimension : 92.1 x 90 x 28.2 mm. Heat Sink : Copper Stacked... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc.
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An air-breathing, portable thermoelectric power generator based on a microfabricated silicon combustor
…700K of 373 W/mK) on top of a titanium block (27.5 x 27.5 x 12.2 mm3, with a thermal conductivity at 700K of 10 W/mK), both of which are attached to a water-cooled copper CPU heat sink (Thermaltake).
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Techist - All Things Tech - Should i buy this
what about a Zalman CNPS9500 LED Copper CPU Heat Sink 92MM Fan 1350-2600RPM 18-27.5DBA W/ Blue LED .
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The Thesis Committee for Hyunji Lim
To dissipate heat accumulated in the hot plate of the Peltier cooler, a CPU heat sink ( copper , 82 (L) x 65 (W) x 37.5 (H) mm) was interfaced to the hot plate of the Peltier cooler.
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Mechatronics, Applied Mechanics and Energy Engineering
Aiming at the heat flux is 0.56 W/mm2 of Intel i7-996X CPU , a copper heat sink with microchannels were designed, the type of microchannel involve the microchannel with wave wall and the microchannel with dimples, as shown in Fig. 1.
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Socket thermal modeling and test correlation with learning on board temperature prediction
Thermal performance of the copper -aluminum 2U combo CPU heat sink is represented and modeled by a copper base only model with effective heat transfer coefficients (HTC) that matches the thermal resistance of 0.177 °C/W at 26 CFM (0.0123 m3…
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Vantec CCK-6035D
I just removed the standard AMD stock fan that came with my CPU with a Vantec 6035D copper heat sink with the Delta 6800 rpm fan.
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CPU Temp Confusion
Using AMD approved copper heat sink which came with the CPU .
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Oopsy daisy. P4 waster.
The CPU is fused to the copper heat sink .
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Vantec CCK-6035D HSF
I just removed the standard AMD stock fan that came with my CPU with a Vantec 6035D copper heat sink with the Delta 6800 rpm fan.
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Design and control of a novel thermo-tactile multimodal display
In addition, a second copper heat spreader with the same CPU heat sink was connected in series with the first as it can be seen in Fig. 3.