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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 16 mm
- Length: 60 mm
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon® 2.60GHz CPU Socket : 603/604 Solution : 60 x 60 x 10mm fan, Copper Heatsink, 1U server solution
- Device: Active Heat Sink
- Fan Airflow: 24.1 SCFM
- Fan Noise: 37.9 dB
- Fan Speed: 5300 rpm
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Supplier: Dynatron Corp.
Description: CPU Support : AMD® Opteron? 6000 Series CPU Socket : G34 Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution.
- Device: Active Heat Sink
- Fan Airflow: 12.83 SCFM
- Fan Noise: 54.4 dB
- Fan Speed: 6000 rpm
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® P4 3.2GHz CPU Socket : 478 Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U solution
- Device: Active Heat Sink
- Fan Airflow: 7.4 SCFM
- Fan Noise: 49.8 dB
- Fan Speed: 6000 rpm
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Desktop Board DG45FC CPU Socket : 775 Solution : 80 x 80 x 15mm blower with PWM function, Copper Heatisnk 1U server solution
- Device: Active Heat Sink
- Fan Airflow: 15 SCFM
- Fan Noise: 49.8 dB
- Fan Speed: 5000 rpm
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader
- Device: Passive Heat Sink
- Material: Copper
- Mounting: Adhesive / Tape
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built
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Supplier: ToneCooling Technology Co., Ltd
Description: Custom Heat Sink Solutions from Coolserver for Electronics Cooling CPU coolserver B6 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient
- Fan Airflow: 41.4 SCFM
- Fan Noise: 47.67 dB
- Fan Speed: 6800 rpm
- Fan Voltage: 12 VDC
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® Pentium4 (Socket478).
- Device: Active Heat Sink
- Fan Noise: 44 dB
- Fan Speed: 5200 rpm
- Fan Voltage: 12 VDC
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Material: Copper, Other Materials
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Supplier: Rego Electronics Inc.
Description: needed to precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 90 x 90 x 27 mm Heat Sink : Copper Stacked Fins with Vapor Chamber Base Thermal Resistance : 0.207 ?/W @ 30 CFM Weight : 435 g
- Device: Passive Heat Sink
- Height: 27 mm
- Length: 90 mm
- Weight: 435 g
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Supplier: ToneCooling Technology Co., Ltd
Description: . Electronic product Applications: Heat sinks are essential in electronics, cooling CPUs, GPUs, and power components to prevent overheating and ensure stable performance in computers, smartphones, and other devices. Automotive Applications: Heat sinks in
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Supplier: Corsair Memory
Description: of the Air Series A50 makes it dramatically outperform your CPU’s stock heatsink: three 8mm copper heatpipes directly contact your CPU and instantly pull heat up into the aluminum cooling fins. A 120mm fan, mounted on rubber studs to reduce noise and vibration, quietly
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Supplier: Xoxide
Description: -X means it not only cools your CPU, but also drives air to your surrounding components helping to cool items such as your RAM, MOSFETS, chipset heat sink, and even the back of your graphics card! The Extreme-X CPU Cooler from Enzotech enters the cooling market like a
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Supplier: FX PCB Co., Ltd.
Description: conductivity, including copper and aluminum. Heat is distributed throughout the heat sink Natural conduction will allow heat to move from a high-temperature environment to a low-temperature one through the heat sink as it traverses the thermal
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Supplier: Computer Network Accessories, Inc.
Description: Intel P4 Socket 775 (Prescott FMB2 Solution) 3.8GHz ball bearing CPU cooler fan. Fan dimensions: 92mm x 92mm x 25mm Heat sink material: Copper Supports CPU speeds up to: 3.8GHz Fan speed: 2,600 +/- 10% RPM Noise level: <22.5 dBA
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Supplier: Custom Thermoelectric
Description: All copper water block Liquid exchanger (compact mini heat sink) to rapidly remove heat from the hot side of peltier TECs, TEGs, CPUs or any device that needs rapid efficient heat removal. Most efficient method of removing heat from a thermoelectric
- Primary Exchanger Material: Copper
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers Standard passive cooling solution for COM Express Basic Type 7 module conga-B7AC with integrated copper plate, 15mm fins and 20mm overall heat sink height. Intended for modules with TDP up to 17W * Cu = copper plate * B = Bore hole standoffs
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Supplier: Boyd
Description: which provides greater design flexibility. Instead, each fin is cut separately using the same tool which allows for lower tooling costs. Additionally skived heat sinks can be constructed of aluminum or copper allowing for full, one-piece copper solutions for high
- Device: Passive Heat Sink
- Heat Sink Fin Style: Other
- Height: 10 to 60 mm
- Length: 150 to 200 mm
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Supplier: Mi-Tech Metals
Description: Small space, big capacity. Mi-Tech developers designed our copper tungsten composites to be used extensively in thermal mounting plates, chip carriers, flanges, and frames for high-powered electronic devices. With the thermal advantages of copper with the very low expansion
- Device: Passive Heat Sink
- Material: Copper, Mixed Material, Other Materials
- Mounting: Other
- Thermal Resistance: 0.5490 °C / W
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Supplier: Cooliance
Description: require more efficient thermal transfer. Our advanced copper embedding process allows us to insert a copper spreader plate as part of the forging process. These heat sinks provide exceptional performance at a cost effective price. Cooliance's heat pipe technology
- Device: Passive Heat Sink
- Material: Aluminum, Copper
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Supplier: Ohmite Manufacturing Co.
Description: The Ohmite CP4 series Liquid Coldplates are designed for Ohmite heatsinkable type resistors, such as TAP600, TAP800, TA1K0, TA2K0, and various SOT-227 resistor packages. The CP4 series also provides maximum heat removal for SCRs, rectifiers, diodes, thyristors, and other high-power
- Device: Cold Plate
- Height: 19.05 mm
- Length: 114 mm
- Material: Aluminum, Copper
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Supplier: RS Components, Ltd.
Description: Copper heat pipes. Working fluid: de-ionised water. Sintered wick structure. Low thermal resistance provides effective heat transfer Length = 300mm Dimensions = 8 x 300mm Diameter = 8mm Series = SF Material = Copper
- Length: 300 mm
- Material: Copper
- Width: 8 mm
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Supplier: Airflow/Y.S. Tech, Inc.
Description: modules Material Options for Custom Heat Sinks Aluminum heat sink Copper heat sink Size Options for Custom Heat Sinks 19-57mm Heatsinks 69-120mm Heatsinks 122-174mm Heatsinks 186-250mm Heatsinks 271-482mm Heatsinks
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Length: 19 to 482 mm
- Material: Aluminum, Copper
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Cooling: Maintains low temperatures for smooth and reliable chip operation Ensure your electronic components stay cool and perform at their best with our compact black heat sinks. Ideal for enhancing the efficiency of your DIY and professional projects. Order now for top-notch thermal management! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Electronic devices often face overheating issues that can reduce performance, shorten lifespan, and increase maintenance costs. Our high-efficiency copper heat sink is engineered to tackle these challenges, providing reliable thermal dissipation even in space (read more)
Browse Heat Pipes Datasheets for ToneCooling Technology Co., Ltd -
impact overall performance. Tone Cooling Copper Heat Sinks are engineered for applications requiring efficient heat transfer and stable thermal performance. Compared with conventional aluminum solutions, copper offers superior thermal conductivity, helping (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
?Performance Validation ? 25% better thermal transfer than JEDEC standard heatsinks (tested @ 15W/in² heat flux) ? 5000+ hr salt spray certified for industrial environments (ASTM B117) ? -40°C to 150°C operational range with <3% thermal resistance (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Forging is a manufacturing process involving metal shaping by localized compressive forces. Rego's Precision Forge Technology is capable to produce both aluminum and copper heat sinks. These sinks are processed with high pressure, below temperatures of 300°C. Under this circumstance, forged (read more)
Browse Heat Sinks Datasheets for Rego Electronics Inc. -
For efficient cooling of your electronic CPU, amplifier boards, and routing components, opt for our custom aluminum heat sink. The integrated thermal paste and aluminum block ensure superior heat dissipation, protecting your devices from overheating. Whether you need a specific size, shape, or configuration, our heat sink can be tailored to your unique requirements. Trust our customizable solution for long-lasting thermal management. (read more)
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Copper heat sinks for high-power electronics requiring maximum thermal conductivity (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Our custom heat sinks provide superior thermal performance and precise heat management for a wide range of applications. Engineered for efficient cooling, these heat sinks are ideal for electronics that demand high thermal control and reliability. Key features include (read more)
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Rego Cooler Information- Part Number : RG3223 Solution : 2U & Up Server CPU Socket : 1155 / 1156 / 1150 Outline Dimension : 90.75 x 89.50 x 65.25mm Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded Fan : 60 x 60 x 25 mm, Two (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc.
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An air-breathing, portable thermoelectric power generator based on a microfabricated silicon combustor
…700K of 373 W/mK) on top of a titanium block (27.5 x 27.5 x 12.2 mm3, with a thermal conductivity at 700K of 10 W/mK), both of which are attached to a water-cooled copper CPU heat sink (Thermaltake).
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Techist - All Things Tech - Should i buy this
what about a Zalman CNPS9500 LED Copper CPU Heat Sink 92MM Fan 1350-2600RPM 18-27.5DBA W/ Blue LED .
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The Thesis Committee for Hyunji Lim
To dissipate heat accumulated in the hot plate of the Peltier cooler, a CPU heat sink ( copper , 82 (L) x 65 (W) x 37.5 (H) mm) was interfaced to the hot plate of the Peltier cooler.
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Mechatronics, Applied Mechanics and Energy Engineering
Aiming at the heat flux is 0.56 W/mm2 of Intel i7-996X CPU , a copper heat sink with microchannels were designed, the type of microchannel involve the microchannel with wave wall and the microchannel with dimples, as shown in Fig. 1.
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Socket thermal modeling and test correlation with learning on board temperature prediction
Thermal performance of the copper -aluminum 2U combo CPU heat sink is represented and modeled by a copper base only model with effective heat transfer coefficients (HTC) that matches the thermal resistance of 0.177 °C/W at 26 CFM (0.0123 m3…
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Vantec CCK-6035D
I just removed the standard AMD stock fan that came with my CPU with a Vantec 6035D copper heat sink with the Delta 6800 rpm fan.
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CPU Temp Confusion
Using AMD approved copper heat sink which came with the CPU .
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Oopsy daisy. P4 waster.
The CPU is fused to the copper heat sink .
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Vantec CCK-6035D HSF
I just removed the standard AMD stock fan that came with my CPU with a Vantec 6035D copper heat sink with the Delta 6800 rpm fan.
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Design and control of a novel thermo-tactile multimodal display
In addition, a second copper heat spreader with the same CPU heat sink was connected in series with the first as it can be seen in Fig. 3.