CPU Heat Sinks

Description: Category: Heatsink Win Source Part Number: 1403449-FUJITSU 38040631 - CPU Heat Sink Manufacturer: Fujitsu Electronics America, Inc.

Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader

• Mounting: Adhesive / Tape
• Material: Copper
• Device: Passive Heat Sink

Description: Category: CPU Win Source Part Number: 1415957-IBM 44V8326 - IBM POWER7 CPU HEAT SINK Manufacturer: IBM

Description: Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU

• Length: 60 mm
• Width: 58.00000000000001 mm
• Height: 14.000000000000002 mm
• Device: Active Heat Sink

Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU

• Length: 60 mm
• Width: 60 mm
• Height: 16 mm
• Device: Passive Heat Sink

Description: heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat

Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is

• Device: Passive Heat Sink

Description: Q7 - Q7-B03 Heat Sink (PASSIVE) for Atom E39xx CPUs Packaged

• Device: Passive Heat Sink

Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is

• Device: Active Heat Sink

Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is

• Device: Passive Heat Sink

Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat

Description: Heat Sink, CPU, PGA, 1.6 C/W, 20 mm, 43 mm, 43.1 mm RoHS Compliant: Yes

Description: applications. ToneCooling provides expert insights on a […] This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on

• Length: 89.50000000000001 mm
• Width: 89.50000000000001 mm
• Height: 69 mm
• Fan Airflow: 41.4 SCFM

Description: HEATSINK CPU W/ADHESIVE 1.01"SQ

Description: SUPER MICRO, 1U PASSIVE CPU HS FOR X11 PURLEY, NARROW RETENTION MECHANISM, NCNR REQUIRED. FREE 2 YEAR RADWELL WARRANTY

Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built

Description: Slip Stream 120mm case fan. Incredibly easy to install, the Scythe Ninja 2 boasts a tool-free design that allows the user to set-up their CPU cooler with very little hassle. One of the most impressive features of the Scythe "NINJA 2" 6 Heat Pipes CPU Cooler is its Advanced Wave

Description: Following in the popular CPU-360 style, the CPU-370 contains improvements to the internal core, unlocking performance beyond all previous Koolance blocks. An advanced microfin cold plate (0.25mm fins, 0.30mm channels), o-ring sealed impingement plate, and an optimized flow path

• Device: Cold Plate

Description: CPU Support : Intel® Sandy Bridge Romley-EP/EX Processors up to TDP 160 Watts Overclocking CPU Socket : 2011 (Square Type, 80 x 80mm mounting pitch) Solution : Low-noise Ø92x25 PWM fan, HCC(Heatpipe Contact CPU) technology heatpipe CPU cooler with pre-printed Shin-Etsu

• Length: 91 mm
• Width: 91 mm
• Height: 110 mm
• Weight: 530 g

Description: Category: Hard Drives Win Source Part Number: 1386266-CISCO UCS-HS-E3-M4-F - CPU Heat Sink for Intel E3 1 Socket - Front Accessible Manufacturer: CISCO

• Device Type: Solid State Disk

Description: Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED Modules ◆ Engine Control Units (ECUs) ◆ Gaming Consoles and Laptops

• Use Temperature: -58 to 302 F
• Thermal Conductivity: 5 W/m-K
• Dielectric Constant (Relative Permittivity): 7.5
• Industry: Electronics

Description: REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment

• Length: 88 mm
• Width: 88 mm
• Height: 51.599999999999994 mm
• Weight: 325 g

Description: These rely on heat sinks and natural convection for cooling, suitable for lower TDP CPUs and environments with good airflow. Active Coolers: Utilize fans to force air through the heat sink, providing more effective cooling for higher TDP CPUs. Liquid

• Device: Active Heat Sink, Passive Heat Sink
• Material: Aluminum, Copper
• Features: Other Materials

Description: / Celeron D AMD: Socket AM2 / 754 / 939 / 940 / Athlon 64 / FX / X2 / Opteron / Sempron Specifications: Model: XT-1264 Fan speed: XT-1264 Dimension: 120mm (L) x 74mm (W) x 150mm (H) Heat Sink: Material: Aluminum Alloy Base: Copper (Heat-pipe Touch Chip) Heat-Pipe: Φ 6 x

Description: CPU cooler for Intel® PentiumIII (FC-PGA2) / 800MHz.

• Length: 64 mm
• Width: 50.800000000000004 mm
• Height: 31 mm
• Weight: 110 g

Description: precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 87.6 x 81.0 x 27 mm Heat Sink : Skived C1100, 83 x 81 x 12 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise Level : 55.8 dB(A)

• Length: 87.6 mm
• Width: 81 mm
• Height: 27 mm
• Weight: 380 g

Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available

• Material: Copper
• Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
• Features: Other Materials

Description: You’ve invested a lot into your Intel or AMD CPU. Now’s the time to protect it and make it run better. Excessive heat is the deadly enemy of high-performance silicon, and the Air Series A50 CPU cooler can extend the lifetime of your CPU by quietly and efficiently drawing

Description: low as 0.05 mm. ◆ High-temperature resistance up to 150℃, with excellent dry-out resistance and no overflow. ◆ No preheating required before use. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED

• Use Temperature: 302 F
• Thermal Conductivity: 1 W/m-K
• Industry: Electronics
• Features: Grease / Paste, Thermal / Heat Conductive

Description: low as 0.05 mm. ◆ High-temperature resistance up to 150℃, with excellent dry-out resistance and no overflow. ◆ No preheating required before use. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED

• Use Temperature: 302 F
• Thermal Conductivity: 4 W/m-K
• Industry: Electronics
• Features: Grease / Paste, Thermal / Heat Conductive

Description: CPU & Chip Coolers (TF)CPU Cooler.Fan+Heat Sink(new).5V.2P.40*30.6*15mm.for MINI-MAY

Description: significantly outperforms your CPU’s stock heatsink, but does it quietly. The Corsair Air Series A70 High-Performance CPU Cooler uses advanced thermal engineering technology to deliver superior air cooling performance: four 8mm copper heatpipes directly contact your CPU, and the

Description: DISCONTINUED BY MANUFACTURER, CIRCUIT BOARD, MOUNTED HEAT SINK, BLACK HOUSING. FREE 2 YEAR RADWELL WARRANTY

Description: high-performance heat sink designed specifically for LGA 7529 CPUs. Heat Sink Design and Materials Given the 350W power consumption of TC-LGA 7529 processors, an effective cooling solution is crucial. The heat sink features a copper base, aluminum

Description: modern CPU sockets. The Hydro Series H100: Go long. Want even more? Featuring a full 240mm radiator and two 120mm fans, the Corsair Hydro Series H100 extreme performance liquid CPU cooler is designed to deliver cooling performance that meets the needs of even the most demanding

• Device: Cold Plate, Liquid Cooler/Cold Plate