-
Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Device: Passive Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 16 mm
- Length: 60 mm
-
Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1403449-FUJITSU 38040631 - CPU Heat Sink Manufacturer: Fujitsu Electronics America, Inc.
-
Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Device: Active Heat Sink
- Heat Sink Fin Style: Straight Fin
- Height: 14 mm
- Length: 60 mm
-
-
Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1403464-FUJITSU A3C40174495 - CPU Heat Sink Manufacturer: Fujitsu Electronics America, Inc.
-
Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1386507-CISCO UCSB-HS-M5-R - CPU Heat Sink for UCS B-Series M5 CPU socket (Rear) Manufacturer: CISCO
-
Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1386519-CISCO UCSB-HS-M5-F - CPU Heat Sink for UCS B-Series M5 CPU socket (Front) Manufacturer: CISCO
-
Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon® 2.60GHz CPU Socket : 603/604 Solution : 60 x 60 x 10mm fan, Copper Heatsink, 1U server solution
- Device: Active Heat Sink
- Fan Airflow: 24.1 SCFM
- Fan Noise: 37.9 dB
- Fan Speed: 5300 rpm
-
Supplier: Dynatron Corp.
Description: CPU Support : AMD® Opteron? 6000 Series CPU Socket : G34 Solution : Copper heatsink with Aluminum 70x70x15mm blower for 1U Server solution.
- Device: Active Heat Sink
- Fan Airflow: 12.83 SCFM
- Fan Noise: 54.4 dB
- Fan Speed: 6000 rpm
-
Supplier: Dynatron Corp.
Description: CPU Support : Intel® P4 3.2GHz CPU Socket : 478 Solution : 60 x 60 x 15mm blower, Copper Heatsink, 1U solution
- Device: Active Heat Sink
- Fan Airflow: 7.4 SCFM
- Fan Noise: 49.8 dB
- Fan Speed: 6000 rpm
-
Supplier: Dynatron Corp.
Description: CPU Support : Intel® Desktop Board DG45FC CPU Socket : 775 Solution : 80 x 80 x 15mm blower with PWM function, Copper Heatisnk 1U server solution
- Device: Active Heat Sink
- Fan Airflow: 15 SCFM
- Fan Noise: 49.8 dB
- Fan Speed: 5000 rpm
-
Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Aluminum Top Mount
- Device: Passive Heat Sink
- Material: Aluminum
- Thermal Resistance: 31 °C / W
-
Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built
-
Supplier: SECO
Description: Q7 - Q7-B03 Heat Sink (PASSIVE) for Atom E39xx CPUs Packaged
- Device: Passive Heat Sink
-
Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® PentiumIII (FC-PGA2) / 866MHz.
- Device: Active Heat Sink
- Fan Noise: 31 dB
- Fan Speed: 3900 rpm
- Fan Voltage: 12 VDC
-
Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® Pentium4 (Socket478) / 3.06GHz.
- Device: Active Heat Sink
- Fan Noise: 45 dB
- Fan Speed: 5400 rpm
- Fan Voltage: 12 VDC
-
Supplier: ToneCooling Technology Co., Ltd
Description: Optimize Your Cooling with Coolserver’s High-Efficiency Heat Sink Solutions CPU coolserver P9 The CPU coolserver is a key component of the computer, ensuring stable operation of the CPU.A popular cooling module is widely praised for its innovative design, efficient
- Fan Airflow: 50.3 SCFM
- Fan Noise: 49.6 dB
- Fan Speed: 9000 rpm
- Fan Voltage: 12 VDC
-
Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Material: Copper, Other Materials
-
Supplier: ToneCooling Technology Co., Ltd
Description: . Electronic product Applications: Heat sinks are essential in electronics, cooling CPUs, GPUs, and power components to prevent overheating and ensure stable performance in computers, smartphones, and other devices. Automotive Applications: Heat sinks in
-
Supplier: Corsair Memory
Description: You’ve invested a lot into your Intel or AMD CPU. Now’s the time to protect it and make it run better. Excessive heat is the deadly enemy of high-performance silicon, and the Air Series A50 CPU cooler can extend the lifetime of your CPU by quietly and efficiently drawing
-
Supplier: Radwell International
Description: SUPER MICRO, 1U PASSIVE CPU HS FOR X11 PURLEY, NARROW RETENTION MECHANISM, NCNR REQUIRED. FREE 2 YEAR RADWELL WARRANTY
-
Supplier: Utmel Electronic Limited
Description: HEATSINK CPU 40.6MM SQ H=.525"
- Material: Aluminum
-
Supplier: FX PCB Co., Ltd.
Description: Heat sink PCBs are a typical part of computers. Computers require a heat sink for the CPU. The CPU generates a lot of heat as a result of electrical activity. The chipset might suffer harm as a result. A heat sink contributes to
-
Supplier: Xoxide
Description: Think your case can handle a V8? If you think your machine is up for the challenge, the Cooler Master V8 CPU Cooler is ready to perform, boasting enough horsepower to easily hold it's own against any high-performance CPU...even under the most critical heat conditions. A high-end
-
Supplier: RS Components, Ltd.
Description: ModMyPi Raspberry Pi Heatsink Kit consists of two aluminium heatsinks that are suitable for Raspberry Pi boards. The heatsinks has a thermal adhesive tape to help clamp and secure each heatsink down by creating a perfect heat-transfer bond. Heat sinks are available in various
- Length: 10 to 14 mm
- Material: Aluminum
- Mounting: Other
- Thermal Resistance: 25 °C / W
-
Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, CIRCUIT BOARD, MOUNTED HEAT SINK, BLACK HOUSING. FREE 2 YEAR RADWELL WARRANTY
-
Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers Heat Sink Narrow For LGA2011
-
Supplier: Computer Network Accessories, Inc.
Description: Intel P4 Socket 775 (Prescott FMB2 Solution) 3.8GHz ball bearing CPU cooler fan. Fan dimensions: 92mm x 92mm x 25mm Heat sink material: Copper Supports CPU speeds up to: 3.8GHz Fan speed: 2,600 +/- 10% RPM Noise level: <22.5 dBA
-
Supplier: ODG (Origin Data Global)
Description: NETWORK HEAT SINK KIT FORCED AIR
-
Supplier: Advantech
Description: . Tailored for harsh environments, the MIC-6314 has a native ruggedized convection cooled heat sink adaptable to various chassis environments; with the alternated optional air cooled heat sink, additional I/O is provided on the front panel. An onboard soldered, industrial
- Operating System: LynxOS®
- Technology: VPX
-
Supplier: ODG (Origin Data Global)
Description: HEATSINK CPU W/ADHESIVE 1.01"SQ
-
Description: standards. ?Applications? ? CPUs and GPUs ? Power Supply Units (PSUs) ? LED Modules ? Engine Control Units (ECUs) ? Gaming Consoles and Laptops
- Chemical / Polymer System Type: Starch
- Features: Thermal / Heat Conductive
- Industry: Electronics
- Thermal Conductivity: 1 W/m-K
-
Description: be precisely controlled for thickness and shape using automated equipment. ? Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. ?Applications? ? CPUs and GPUs ? Power Supply Units (PSUs) ? LED Modules ? Engine Control Units (ECUs) ? Gaming Consoles and Laptops
- Compound Type: Thermal Compound / Heat Conductive
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
- Thermal Conductivity: 5 W/m-K
-
Supplier: Acromag, Inc.
Description: displays. Better power efficiency reduces heat and allows smaller, lighter designs with more portability. Cutting-edge technology features programmable power limits, allowing the user to “dial-down” the maximum power consumption of the CPU in systems where power is a concern
- Capacity: 4000 to 16000 MB
- Features: Watchdog Timer
- Form Factor: COM Express Basic
- Memory Type: DDR3
-
Supplier: Custom Thermoelectric
Description: All copper water block Liquid exchanger (compact mini heat sink) to rapidly remove heat from the hot side of peltier TECs, TEGs, CPUs or any device that needs rapid efficient heat removal. Most efficient method of removing heat from a thermoelectric TEC.
- Primary Exchanger Material: Copper
-
Supplier: Matexcel
Description: comes into contact with the skin, it should be cleaned with alcohol and hand sanitizer in time Application: 1. High power LED radiator 2. CPU cooler 3. Metal film for heat dissipation 4. Metal heat sink 5. Electrical cooling shell Usage: 1. Substrate
Find Suppliers by Category Top
Featured Products Top
-
Cooling: Maintains low temperatures for smooth and reliable chip operation Ensure your electronic components stay cool and perform at their best with our compact black heat sinks. Ideal for enhancing the efficiency of your DIY and professional projects. Order now for top-notch thermal management! (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
The Birch Stream liquid cooling plate features an advanced liquid cooling circulation system, paired with a large pure copper base and high-density cooling fins. It rapidly dissipates heat generated by the CPU, effectively lowering CPU temperatures and ensuring system stability, preventing (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
For efficient cooling of your electronic CPU, amplifier boards, and routing components, opt for our custom aluminum heat sink. The integrated thermal paste and aluminum block ensure superior heat dissipation, protecting your devices from overheating. Whether you need a specific size, shape, or configuration, our heat sink can be tailored to your unique requirements. Trust our customizable solution for long-lasting thermal management. (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
During this period of increasing demand in high performance asked by multi-task operation, there are more and more customers adopting AMD EPYC™ Embedded 3000 Processors that bring exceptional reliability, availability and serviceability benefiting the “Zen” CPU architecture (read more)
Browse Heat Sinks Datasheets for Rego Electronics Inc. -
High-Performance Aluminum Heat Sink for Effective Thermal Management Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
Rego Cooler Information- Part Number : RG3223 Solution : 2U & Up Server CPU Socket : 1155 / 1156 / 1150 Outline Dimension : 90.75 x 89.50 x 65.25mm Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded Fan : 60 x 60 x 25 mm, Two (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for Dongguan Sheen Electronic Technology Co., Ltd. -
) Outline Dimension : 60 x 60 x 33mm Heat Sink : Extruded AL6063+C1100, ø60 x 22.6mm Fan : 50 x 50 x 10 mm, dual ball bearing Connector Type : 3 way / 4 way (PWM Control) Thermal Resistance (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Outline Dimension : 60 x 60 x 28mm Heat Sink : Extruded AL6063, ø60 x 17.6mm Fan : 50 x 50 x 10 mm, dual ball bearing Connector Type : 3 way / 4 way (PWM Control) Thermal Resistance : 0.77 ?/W RG1100-EAC-EF5173 (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
Heat Sink : Skived AL6063, 60 x 58 x 14mm Fan : 52 x 52 x 15 mm, Dual Ball Bearing, provided by Sanyo Denki, Japan Connector Type : 3 way / 4 way (PWM Control) Thermal Resistance : 0.76 ?/W RG1100B-SAL-SD5173 RG1100B-SAL-SD5174 Outline Dimension : 60 x 60 x 33mm Heat (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Identification of minimum air flow design for a desktop computer using CFD modeling
Innovative design is needed to direct sufficient air flow to the CPU heat sink .
-
Full Wave Solution for Intel CPU With a Heat Sink for EMC Investigations
B. Intel P4 CPU Heat Sink Model .
-
Investigation of CPU Thermal Solution Designs for BTX Desktop System
The geometry of CPU heat sink is inclined to affect the downstream airflow distribution.
-
Experimental and CFD analysis of heat sinks with base plate for CPU cooling
The CPU heat sink with base plate is attached to the CPU together with a fan.
-
Thermal analysis of CPU with CCC and copper base plate heat sinks using CFD
The CPU heat sink with base plate is attached to the CPU in conjunction with a fan.
-
Thermal design of a desktop computer system using CFD analysis
A ducted 80 x 60 mm CPU heat sink is able to meet the CPU tempera- ture specification.
-
Thermal solution development for high-end server systems
Solutions included a new CPU heat sink design and air flow optimization at the board and cabinet level.
-
In situ temperature measurement of a notebook computer - a case study in health and usage monitoring of electronics
Location of RTD temperature sensor on CPU heat sink base.
-
Remote heat sink concept for high power heat rejection
CPU heat sink thermal resistance, K/W.
-
a good cpu heat sink? - Techist - All Things Tech
a good cpu heat sink ?