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Supplier: Win Source Electronics
Description: Category: Heatsink Win Source Part Number: 1403449-FUJITSU 38040631 - CPU Heat Sink Manufacturer: Fujitsu Electronics America, Inc.
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Supplier: DigiKey
Description: Heat Sink Assorted (BGA, LGA, CPU, ASIC...) Copper Heat Spreader
- Mounting: Adhesive / Tape
- Material: Copper
- Device: Passive Heat Sink
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Supplier: Win Source Electronics
Description: Category: CPU Win Source Part Number: 1415957-IBM 44V8326 - IBM POWER7 CPU HEAT SINK Manufacturer: IBM
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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 60 x 60 x 16 mm / Skived AL6063 60 x 58 x 14 mm Fan : 50 x 50 x 10mm / 52 x 52 x 15 mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Length: 60 mm
- Width: 58.00000000000001 mm
- Height: 14.000000000000002 mm
- Device: Active Heat Sink
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Supplier: Rego Electronics Inc.
Description: Heat Sink : Forged AL1070 fins with C1100 Base, 60 x 60 x 16 mm Fan : 50 x 50 x 10mm / 50 x 50 x 20 mm, Two Ball Bearing Connector Type : 3 ways / 4 ways Screw & Back Plate : rPGA Socket CPU / BGA Package CPU
- Length: 60 mm
- Width: 60 mm
- Height: 16 mm
- Device: Passive Heat Sink
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: ToneCooling Technology Co., Ltd
Description: heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on Choosing the right heat provides key insights for engineers and […] Introduction — Heat
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Supplier: SECO
Description: Q7 - Q7-B03 Heat Sink (PASSIVE) for Atom E39xx CPUs Packaged
- Device: Passive Heat Sink
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Active Heat Sink
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Supplier: FX PCB Co., Ltd.
Description: problem with the dissipation of heat loss from processors. There are various ways to connect a heat sink to the heat source. A separate metal heat sink must be made to fabricate a heat sink PCB. Then, producers will affix this heat
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Supplier: SECO
Description: the suitable environmental temperature. The heat spreader is not intended to be a guaranteed standalone cooling system, but should be used only as a supplemental means of transferring heat to another dissipation system (i.e. heat sinks, fans, heat pipes etc). It is
- Device: Passive Heat Sink
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Supplier: Newark, An Avnet Company
Description: Heat Sink, CPU, PGA, 1.6 C/W, 20 mm, 43 mm, 43.1 mm RoHS Compliant: Yes
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Supplier: ToneCooling Technology Co., Ltd
Description: applications. ToneCooling provides expert insights on a […] This comprehensive guide covers how are heat sinks solutions for industrial and OEM applications. ToneCooling provides expert insights on how […] What Is Choosing Heat Sink Computers Cpu? This guide on
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: ODG (Origin Data Global)
Description: HEATSINK CPU W/ADHESIVE 1.01"SQ
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Supplier: Radwell International
Description: SUPER MICRO, 1U PASSIVE CPU HS FOR X11 PURLEY, NARROW RETENTION MECHANISM, NCNR REQUIRED. FREE 2 YEAR RADWELL WARRANTY
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Supplier: Xoxide
Description: Enhance your cooling performance with the Thermalright AXP-140 Low Profile High Performance Heat Sink. This low profile CPU cooler incorporates a unique down draft style of air cooling that makes it perfectly ideal for an HTPC case. This innovative down draft air flow is built
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Supplier: Xoxide
Description: Slip Stream 120mm case fan. Incredibly easy to install, the Scythe Ninja 2 boasts a tool-free design that allows the user to set-up their CPU cooler with very little hassle. One of the most impressive features of the Scythe "NINJA 2" 6 Heat Pipes CPU Cooler is its Advanced Wave
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Supplier: Dynatron Corp.
Description: CPU Support : Intel® Xeon® 2.60GHz CPU Socket : 603/604 Solution : 60 x 60 x 10mm fan, Copper Heatsink, 1U server solution
- Length: 89.30000000000001 mm
- Width: 62 mm
- Height: 25 mm
- Weight: 334 g
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Supplier: Xoxide
Description: Following in the popular CPU-360 style, the CPU-370 contains improvements to the internal core, unlocking performance beyond all previous Koolance blocks. An advanced microfin cold plate (0.25mm fins, 0.30mm channels), o-ring sealed impingement plate, and an optimized flow path
- Device: Cold Plate
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Supplier: Win Source Electronics
Description: Category: Hard Drives Win Source Part Number: 1386266-CISCO UCS-HS-E3-M4-F - CPU Heat Sink for Intel E3 1 Socket - Front Accessible Manufacturer: CISCO
- Device Type: Solid State Disk
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Description: Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED Modules ◆ Engine Control Units (ECUs) ◆ Gaming Consoles and Laptops
- Use Temperature: -58 to 302 F
- Thermal Conductivity: 5 W/m-K
- Dielectric Constant (Relative Permittivity): 7.5
- Industry: Electronics
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Supplier: Rego Electronics Inc.
Description: REGO offers a full range of cooler solutions for various Intel® desktop CPU families which supports sockets LGA 775, 115x, 1366 & 2011, etc. Their products are well designed in thermal performance based on our professional manufacturing know how. REGO also has the sophisticated equipment
- Length: 88 mm
- Width: 88 mm
- Height: 51.599999999999994 mm
- Weight: 325 g
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Supplier: ToneCooling Technology Co., Ltd
Description: These rely on heat sinks and natural convection for cooling, suitable for lower TDP CPUs and environments with good airflow. Active Coolers: Utilize fans to force air through the heat sink, providing more effective cooling for higher TDP CPUs. Liquid
- Device: Active Heat Sink, Passive Heat Sink
- Material: Aluminum, Copper
- Features: Other Materials
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Supplier: Xoxide
Description: / Celeron D AMD: Socket AM2 / 754 / 939 / 940 / Athlon 64 / FX / X2 / Opteron / Sempron Specifications: Model: XT-1264 Fan speed: XT-1264 Dimension: 120mm (L) x 74mm (W) x 150mm (H) Heat Sink: Material: Aluminum Alloy Base: Copper (Heat-pipe Touch Chip) Heat-Pipe: Φ 6 x
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Supplier: Sanyo Denki America, Inc.
Description: CPU cooler for Intel® PentiumIII (FC-PGA2) / 866MHz.
- Length: 68.00000000000001 mm
- Width: 67.30000000000001 mm
- Height: 45 mm
- Weight: 180 g
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Supplier: TONGYU Technology Co., Ltd.
Description: Name: CPU Liquid Cooler Item No.: TY-C03 Material: C1100 Appearance: No oxidation, inner and outer surfaces clean, no impurities Parameters: 200PSIto detect leak Application: PC Liquid cooling, CPU heatsink, water cooling, thermoelectric cooling system Custom Design: Available
- Material: Copper
- Device: Liquid Cooler/Cold Plate, Thermo-Electric Cooler
- Features: Other Materials
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Supplier: Rego Electronics Inc.
Description: precisely measure its performance. We are here to provide customized thermal solutions according to your specifications. Outline Dimension : 87.6 x 81.0 x 27 mm Heat Sink : Skived C1100, 83 x 81 x 12 mm Blower : 80 x 80 x 15 mm, Two Ball Bearing, 6000 RPM, Noise Level : 55.8 dB(A)
- Length: 87.6 mm
- Width: 81 mm
- Height: 27 mm
- Weight: 380 g
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Description: low as 0.05 mm. ◆ High-temperature resistance up to 150℃, with excellent dry-out resistance and no overflow. ◆ No preheating required before use. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED
- Use Temperature: 302 F
- Thermal Conductivity: 4 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: Corsair Memory
Description: You’ve invested a lot into your Intel or AMD CPU. Now’s the time to protect it and make it run better. Excessive heat is the deadly enemy of high-performance silicon, and the Air Series A50 CPU cooler can extend the lifetime of your CPU by quietly and efficiently drawing
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Description: low as 0.05 mm. ◆ High-temperature resistance up to 150℃, with excellent dry-out resistance and no overflow. ◆ No preheating required before use. ◆ Complies with RoHS, Halogen-Free, and REACH environmental and safety standards. 【Applications】 ◆ CPUs and GPUs ◆ Power Supply Units (PSUs) ◆ LED
- Use Temperature: 302 F
- Thermal Conductivity: 1 W/m-K
- Industry: Electronics
- Features: Grease / Paste, Thermal / Heat Conductive
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Supplier: VAST STOCK CO., LIMITED
Description: CPU & Chip Coolers (TF)CPU Cooler.Fan+Heat Sink(new).5V.2P.40*30.6*15mm.for MINI-MAY
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Supplier: Corsair Memory
Description: significantly outperforms your CPU’s stock heatsink, but does it quietly. The Corsair Air Series A70 High-Performance CPU Cooler uses advanced thermal engineering technology to deliver superior air cooling performance: four 8mm copper heatpipes directly contact your CPU, and the
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Supplier: Radwell International
Description: DISCONTINUED BY MANUFACTURER, CIRCUIT BOARD, MOUNTED HEAT SINK, BLACK HOUSING. FREE 2 YEAR RADWELL WARRANTY
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Supplier: ToneCooling Technology Co., Ltd
Description: high-performance heat sink designed specifically for LGA 7529 CPUs. Heat Sink Design and Materials Given the 350W power consumption of TC-LGA 7529 processors, an effective cooling solution is crucial. The heat sink features a copper base, aluminum
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Supplier: Corsair Memory
Description: modern CPU sockets. The Hydro Series H100: Go long. Want even more? Featuring a full 240mm radiator and two 120mm fans, the Corsair Hydro Series H100 extreme performance liquid CPU cooler is designed to deliver cooling performance that meets the needs of even the most demanding
- Device: Cold Plate, Liquid Cooler/Cold Plate
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Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
High-Performance Aluminum Heat Sink for Effective Thermal Management. Aluminum heat sinks are designed to effectively dissipate heat from critical components, ensuring optimal performance across various applications. With exceptional thermal conductivity, they enhance cooling efficiency for electronics, automotive systems, industrial machinery, and LED lighting. Efficient Heat Dissipation: Engineered to transfer heat away from sensitive components, maintaining ideal operating temperatures... (read more)
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Efficient Cooling for High-Performance GPUs. High-performance computing, AI, and data analytics push GPUs like the NVIDIA A100 to their thermal limits. Without effective cooling, thermal throttling can reduce performance and shorten hardware lifespan. A custom aluminum heat sink is engineered to address these challenges, ensuring your GPU operates reliably at peak workloads. Key Features: Precision Fit: Custom-engineered to match the exact dimensions and mounting points of the A100 GPU... (read more)
Browse CPU Coolers Datasheets for ToneCooling Technology Co., Ltd -
Rego Cooler Information-. Part Number : RG3223. Solution : 2U & Up Server. CPU Socket : 1155 / 1156 / 1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm, Copper Base & Aluminum Fins with Heatpipes embedded. Fan : 60 x 60 x 25 mm, Two Ball Bearing, Manufacturer : Sanyo Denki. Connector Type : 4 ways (PWM Function). Thermal Resistance : 0.18 ?/W ( TDP(max) : 150 Watts ). Noise Level : 44 d B(A). Storage Temperature : - 30? ~ + 70?. Operating Temperature : - 10... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
High-performance CPUs and GPUs generate significant heat, and effective cooling depends on more than just the heatsink. Thermal paste plays a key role by filling the tiny air gaps between the chip and the heat sink, helping heat move out of the component more efficiently. This formula is designed for stable, long-term thermal contact under continuous operation. It conforms well to uneven surfaces, supports reliable heat transfer during repeated thermal cycling, and helps maintain consistent... (read more)
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Advantages of the Birch Stream Liquid Cooling Plate: Efficient Heat Dissipation, Stable Operation: The Birch Stream liquid cooling plate features an advanced liquid cooling circulation system, paired with a large pure copper base and high-density cooling fins. It rapidly dissipates heat generated by the CPU, effectively lowering CPU temperatures and ensuring system stability, preventing performance throttling or crashes caused by overheating. Quiet Operation, Immersive Experience: Compared... (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd -
by an expansive breadth of I/O interconnect options. - Rego Cooler Specification. RG1100B-EAC(H23)-EF5173-28 ( Three positions connector ). RG1100B-EAC(H23)-EF5174-28 ( Four positions connector - PWM Control ). Outline Dimension : 60 x 60 x 33mm. Heat Sink : Extruded AL6063+C1100, o60 x 22.6mm. Fan : 50 x 50 x 10 mm, dual ball bearing. Connector Type : 3 way / 4 way (PWM Control). Thermal Resistance : 0.61 C/W. RG1100B-EAC(H23)-AD5273-28 ( Three positions connector ). RG1100B-EAC(H23)-AD5274-28... (read more)
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Coolserver provides flexible cooling products engineered for data centers, high-performance computing, and industrial server environments. These solutions ensure efficient heat removal, stable operation, and prolonged component life. Tailored Heat Sinks: Maximize heat dissipation for reliable server operation. Liquid Cooling Systems: Deliver superior cooling for high-demand computing setups. Custom Thermal Solutions: Designed to meet complex and specialized cooling requirements. Thermal... (read more)
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27.5mm. Noise Level : 59 dB(A). Connector Type : 2543-4P. Thermal Resistance : 0.39 C/W. Weight : 330 g. Part Number : RG3114(Z). Solution : Rugged Computer with 1U Chassis. CPU Socket : 1155 /1156 /1150. Outline Dimension : 90 x 90 x 22.5mm. Noise Level : 46 dB(A). Connector Type : 2543-4P. Thermal Resistance : 0.45 C/W. Weight : 310 g. Part number : RG3223. Solution : 2U &Up Server. CPU Socket : 1155/1156/1150. Outline Dimension : 90.75 x 89.50 x 65.25mm. Heat Sink : 78.0 x 62.5 x 61.6mm... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc. -
. In addition, these coolers are very good for dissipating heat. Its thermal resistance reaches 0.74 to 0.76 ?/W. We are proud to announce these high performance coolers solve tough cooling issues at high CPU TDP at 47 watts. Contact us now for more information!!!. Rego Cooler Specification -. RG1100B-SAL-SD5173. RG1100B-SAL-SD5174. Outline Dimension : 60 x 60 x 33mm. Heat Sink : Skived AL6063, 60 x 58 x 14mm. Fan : 52 x 52 x 15 mm, Dual Ball Bearing, provided by Sanyo Denki, Japan. Connector Type : 3... (read more)
Browse CPU Coolers Datasheets for Rego Electronics Inc.
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