Products/Services for Crankshaft Grinding Chucks
-
Chucks - (402 companies)...electrostatic chucks) are designed for semiconductor-manufacturing equipment. Gear chucks are designed to hold gears during machining. Grinding chucks used in grinding equipment. Lathe chucks are designed for use with lathes or turning centers...TypeApplicationChuck Geometry -
Grinders and Grinding Machines - (992 companies)...and polishers are suitable for offhand grinding or finishing. Crankshaft. Centerless Creep Feed. Cylindrical / External (OD). Disc Grinder. Hobbing / Gear. Inner Diameter (ID) / Internal. Jig Grinder. Metallographic Prep. Polisher-Grinder. Precision... -
Tool Grinders and Sharpeners - (44 companies)Tool grinders and sharpening machines are specialized for tool, die, punch, cutter, blade and drill point sharpening, grinding, honing, finishing, resharpening, refinishing or regrinding. Tool grinders and sharpening machines are versatile...
-
Metal Spinning Services - (104 companies)...a positive-pressure process where a rotating tool (lathe) or roller shapes a spinning sheet metal workpiece such as a pipe, camshaft, or crankshaft. Spinning is accomplished by affixing a preform or blank to a mandrel or chuck on the rotating member... -
Polishing and Buffing Machines - (327 companies)...finishing polishing machines and buffing machines are abrasive grinders or grinding wheel face-grinders. Buffers and buffing machines are used to improve a surface 's brightness or finish. Buffers drive either non-woven abrasive pads or buffing pads... -
Magnetic Chucks - (36 companies)Magnetic chucks use the magnetic force from a permanent magnet, electromagnet or electro-permanent magnet to achieve chucking or holding action. They are only suitable for workpieces made of magnetic materials such as steel or iron. How to Select...
-
Chuck Jaws - (81 companies)Chuck jaws are inserts that fit into a chuck and grip the workpiece. There are three types of chuck jaws: base jaws, hard jaws, and soft jaws. Chuck jaws are inserts that fit into a chuck and grip the workpiece. Types of Chuck Jaws. There are three...
-
Hand Drills - (178 companies)Drills are hand-held tools with rotating drill bits used to fabricate holes in multiple materials. They are widely used in construction, carpentry, metalworking, assembly, and maintenance. Most drills used today are powered, and use a chuck to grip...
-
Grinding Wheels - (508 companies)Image Credit: Norton Abrasives. Grinding wheels are used for metal removal, dimensioning, and finishing. They consist of an integral shank, pin, shaft, or mandrel that drives a mounted wheel or blades. Types of Grinding Wheels. There are many types...
-
Wafer Chucks - (22 companies)Wafer chucks are used to handle semiconductor wafers during wafer processing applications. Common work clamping technologies include vacuum and electrostatic. Wafer chucks handle or hold wafers or substrates during wafer processing applications...
Product News
-
Fountyl Technologies Pte. Ltd.
High-Performance Porous Ceramic Chuck Semiconductor and precision manufacturing demand stable, flat, and contamination-free wafer handling, yet standard chucks often struggle with uniform adsorption, wear, and thermal stress. Inaccurate handling can reduce yield and affect product quality. The Porous Ceramic Chuck offers advanced material performance and reliable operation: Strong Permeability: Uniform air and water flow ensures stable wafer adsorption without sliding. High Strength & Wear Resistance: Maintains shape during... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
High-Precision Porous Ceramic Chuck Durable and Precise Porous Ceramic Chuck for Semiconductor Processing. Uniform permeability and strong adsorption ensure silicon wafers are firmly held without slipping during grinding, improving process stability. Dense, uniform micro-porous ceramic structure resists silicon dust buildup, simplifying cleaning and maintenance. High mechanical strength and excellent thermal shock resistance prevent deformation and edge damage, ensuring consistent wafer flatness. Long service life with easy... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Suntech Applied Materials (Hefei) Co.,Ltd
High-Porosity Ceramic Vacuum Chuck . * Prevents static damage to sensitive wafers. Customizable Configuration. * Tailored size and shape options. * Adjustable porosity and pore size. * Base material options: alumina or silicon carbide. Typical Applications. * Wafer heating and transfer. * Grinding and cutting processes. * Laser machining. * Screen printing. * Precision cleaning systems. The porous ceramic vacuum chuck improves process stability, reduces contamination risks, and enhances overall manufacturing efficiency. Visit our... (read more)Browse Chucks Datasheets for Suntech Applied Materials (Hefei) Co.,Ltd -
Fountyl Technologies Pte. Ltd.
High-Vacuum Porous Ceramic Chucks for Wafer Vacuum handling of fragile, ultra-thin wafers requires uniform contact force to eliminate stress concentrations. These specialized porous ceramic chucks are micro-engineered to deliver high-performance workholding with advanced material properties. Technical Characteristics: Uniform Pore Distribution: Pore sizes ranging from 2 to 10 microns ensure consistent vacuum pressure across the entire wafer surface. Micron-Level Flatness: Sub-micron surface grinding prevents wafer dimpling and scratching... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
High-Precision Porous Ceramic Wafer Vacuum Chucks As semiconductor nodes shrink, wafer flatness during processing becomes critical. Our high-precision porous ceramic vacuum chucks (Chucks) are specifically designed to meet the rigorous demands of 300mm (12-inch) wafer thinning, dicing, and inspection. Utilizing advanced Alumina (Al?O?) and Silicon Carbide (SiC) material technology, these chucks offer a uniform microstructure with controlled pore sizes (typically 2 to 10 mm). This eliminates the localized stress concentrations and micro-dimples... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
Advanced Electrostatic Wafer Chuck Semiconductor fabrication faces critical challenges such as inconsistent wafer clamping, thermal non-uniformity, and compatibility issues with diverse materials like silicon, sapphire, and silicon carbide. Engineers often struggle with process instability, high defect rates, and costly equipment adjustments in ion implantation, etching, and thin-film deposition processes. Our electrostatic chucks deliver high-density, durable, and customizable solutions that address these challenges: Polymer... (read more)Browse Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Xiamen Unipretec Ceramic Technology Co., Ltd.
Precision Ceramic Wafer Chuck In advanced semiconductor production, unstable wafer positioning, thermal distortion, and contamination risks can directly impact yield, process repeatability, and device reliability --especially during lithography, plasma processing, and bonding steps. Manufactured from high-performance ceramics including Alumina (Al2O3), Silicon Carbide (SiC), and Silicon Nitride (Si3N4), this wafer chuck provides: High thermal stability to maintain flatness and dimensional accuracy under elevated... (read more)Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Fountyl Technologies Pte. Ltd.
Semiconductor Electrostatic Chucks These state-of-the-art Semiconductor Electrostatic Chucks (ESCs) deliver exceptional clamping uniformity and stability. Engineered with high-purity ceramic materials (AlN/Al2O3), they provide reliable performance across ultra-high vacuum and high-temperature manufacturing environments. Key Technical Features. Multi-Zone Thermal Control: Advanced multi-zone cooling profiles achieve precise temperature uniformity across the entire wafer surface. Rapid Chucking & Dechucking: Optimized transient... (read more)Browse Oxide Ceramics Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
High-Precision Ceramic Wafer Chucks High-purity alumina and aluminum nitride ceramic chucks, including porous ceramic chucks and electrostatic chucks (E-Chucks), provide high-precision positioning, uniform holding force, excellent thermal management, and outstanding plasma corrosion resistance. They are widely used in critical semiconductor manufacturing processes such as photolithography, etching, thin-film deposition, and chemical mechanical polishing (CMP). Non-destructive Uniform Clamping: Uniform vacuum adsorption... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd. -
Fountyl Technologies Pte. Ltd.
Stable Wafer Pin SiC Chuck Solving Wafer Handling Challenges. In semiconductor manufacturing, precise handling and fixation of wafers are critical. Engineers often face challenges like wafer slippage, contamination, deformation under high temperatures, and material wear. The Wafer Pin Silicon Carbide (SiC) Chuck addresses these challenges with a high-performance material and advanced design, ensuring wafers remain stable, clean, and accurately positioned during processing. Key Advantages and Applications. High... (read more)Browse Wafer Chucks Datasheets for Fountyl Technologies Pte. Ltd.
More Information
Indicates content that may require registration and/or purchase.
-
Force characteristics in continuous path controlled crankpin grinding
WALSH, et al[2, 14−15] , presented a force model based on the unique geometric characteristics of the crankshaft , grinding parameters and machine system for eccentric chuck crankpin grinding which can be regarded as conventional cylindrical plunge grinding.
-
Engineering Decisions for Manufacturing Systems
The crankshaft is held in place by offsetting chucks to align the crankshafts pins with main axes for conventional grinding [1].
-
WNGlosses (finlayson-gwc2014.zip\CICWN-1.0.zip)
… outerwear_N|3 tailor_V|6 hanger_N|2 transmission_line_N|4 spider_web_N|4 coca_plant_N|1 powerfully_R|5 rosette_N|24 rocking_horse_N|1 flimsy_J|4 garret_N|1 racing_car_N|3 jester_N|4 cocktail_N|26 casserole_N|6 opium_N|14 crotch_N|2 drunk_J|14 coffee_ grounds _N|2 kitchen_appliance_N|9 brewing_N|10 roasted_J|34 … … antique_J|4 exhibit_N|12 complex_N|21 higher_education_N|5 chuck _N|3 coal_mine_N|9 achromatic_lens_N|1 perfumed_J|4 … … rocker_N|4 outer_space_N|13 glue_V|3 lift_N|22 crankshaft _N|5 likelihood_N|10 neckwear_N|2 slipknot_N|4 …
-
Machine tools, machine types, and scope of application
… 354, 376 bevel gear loops 48, 376 wedging press, 56, 86 wedge rod feeds 206 Kienzle formula … Kommissionieren, 545 compact bearings 360, 439 console method of construction 187, 171, 181 console milling machine, 17 continuous profile grinding 372, 365 continuous rolling grinding, coordinate chassis, head … … press, 48, 56, 63, 64, 79, 83, 86 crankshaft 393, 386 crankshaft-rotation …
-
Process chain precision forges
Because of the function geometry of the crankshaft , it isn't possible to polish connection rod or stroke bearing in the same Aufspannung that with standard abrasive method. Basically, the eccentric feeds can be used thereto.
-
ZASMHBA0002151
Chuck for supplementary support (c) ° includes tailstock center such as bull nose type for bores, back centers for parts susceptible to deflection, and center rest to leave the other end free for face or external grinding . … having nonidentical axes for the part or the section being ground, such as crankpin sections of crankshafts .
-
Cutting Tool Engineering December 2010: Adjustable Grinding
… effect fast changeover, Myers said the Landis LT1 swivel head grinder can combine operations into one chucking . The grinder is for single machine/single setup grinding of complete camshafts and small crankshafts , as well as general-purpose grinding of concentric diameters, eccentrics, profiles, tapers and chamfers, he added.
-
Precise alignment method of the large-scale crankshaft during non-circular grinding
An in-line inspection system using machine vision is developed to differentiate sub-micron level roughness change of the crank- shaft surface to eliminate manual inspection in a mass produc- tion process [9]. The influence of system stiffness on out-of-roundness of crankpin grinding with an eccentric chuck is studied experi- mentally [10].
-
Kinematic Analysis of Face Grinding Process at Lapping Machines
• Analysis of the Grinding Mechanism with Wheel Head Oscillating Type CNC Crankshaft Pin Grinder p.163 • Investigation on the Dressing Shape of Vacuum Chuck in Wafer Rotation Grinding p.171 .
-
Reliability Prediction of Centerless Grinding Machine
• Analysis of the Grinding Mechanism with Wheel Head Oscillating Type CNC Crankshaft Pin Grinder p.163 • Investigation on the Dressing Shape of Vacuum Chuck in Wafer Rotation Grinding p.171 .
