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Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit
- Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
- Material Type: Aluminum Nitride, Alumina / Aluminum Oxide, Specialty Ceramic
- Performance Features: Metallized / Silvered
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Description: substrates are also excellent in terms of electrical insulation, chemical resistance, and thermal expansion. Wintrustek now offers low-cost, quick-turn Direct Bonded Copper (DBC) products on Alumina (Al2O3) and Aluminum Nitride (AlN). Because of its high thermal conductivity, high
- Shape / Form: Plate / Board (e.g., Fiberboard)
- Specialty Ceramic Type: Aluminum Nitride
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Description: DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a
- Applications: Other
- Material Type: Specialty Ceramic
- Performance Features: Metallized / Silvered
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Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin
- Applications: Chemical / Materials Processing, Corrosion Protection, Electrical / HV Parts, Electronics / RF-Microwave, Refractory / High Temperature Materials
- Density: 3.25 to 3.35 g/cc
- Dielectric Strength: 1.70E7 V/m
- Material Type: Aluminum Nitride, Specialty Ceramic
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Description: Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness' ranging from 10um to 130um, and
- Applications: Other
- Material Type: Specialty Ceramic
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Supplier: 3X Ceramic Parts Company Limited
Description: Variesties of metallization applications : DPC , DBC , TPC , AMB , thick film printing . * Quality control from source . * Thinner Thickness products : Thickness like 0.15mm , 0.25mm, 0.5mm, 1mm , 2mm The Classification of AIN substrate : AIN substrate As Fired Type
- Dielectric Constant (Relative Permittivity): 8.8 #
- Material Type: Aluminum Nitride
- Shape / Form: Fabricated / Custom Shape
- Thermal Conductivity: 170 W/m-K
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Supplier: FX PCB Co., Ltd.
Description: here DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB is using the DPC technology for all
- Electrical Resistivity: 10 ohm-cm
- Materials of Construction: Specialty / Other
- Thickness: 0.0098 to 0.0150 inches
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Supplier: Richardson RFPD
Description: The CHA7215 is a monolithic three-stage GaAs high power amplifier designed for X band applications. The HPA provides typically 9W output power associated to 36% power added efficiency at 4dBc and a high robustness on mismatch load. This device is manufactured using 0.25 µm Power pHEMT
- Amplifier Type: Power Amplifier
- Frequency Range: 8500 to 11500 MHz
- Maximum Gain: 28.5 dB
- Output Power( P1dB): 39.5 dBm
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Supplier: MacDermid Alpha Electronics Solutions
Description: Dispensable paste for pressure sintering large components on gold/silver substrates, including DBC, aluminum, copper. Product Overview ALPHA Argomax 2048 Paste is a dispensable silver sintering paste developed for pressure sintering of large packages or components on gold- and
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Supplier: MacDermid Alpha Electronics Solutions
Description: dried paste applied to copper-finished DBC substrates. It is formulated with proprietary engineered silver particles to support reliable attachment to standard DBC without the need for gold or silver surface finishes.
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Supplier: Richardson RFPD
Description: X-band High Power Amplifier, GaAs Monolithic Microwave IC. The CHA7115 is a monolithic three-stage GaAs high power amplifier designed for X-band applications. The HPA provides typically 8W output power associated to 36% power added efficiency at 4dBc and a high robustness on mismatch load.
- Amplifier Type: Power Amplifier
- Frequency Range: 8500 to 11500 MHz
- Maximum Gain: 27.5 dB
- Maximum Operating Voltage: 8 volts
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Supplier: Isabellenhutte USA
Description: Features Heavy copper connectors Excellent long-term stability Ideal suited for mounting on DBC / IMS substrate Max. solder temperature up to 350°C / 20 min. RoHS 2011/65/EU compliant Applications
- Mounting / Packaging: Surface Mount (SMT / SMD), Other
- Operating Temperature: -65 to 170 C
- Power Rating: 13 watts
- Resistance Range: 5.25E-4 to 0.0030 ohms
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Supplier: Wolfspeed
Description: Wolfspeed’s CMPA1D1E025F is a gallium-nitride (GaN) high-electron-mobili ty transistor (HEMT)-based monolithic microwave integrated circuit (MMIC) on a silicon carbide substrate, using a 0.25-µm gate length fabrication process. GaN-on-SiC has superior properties compared to
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Supplier: Isabellenhutte USA
Description: Features Constant current up to 100 A (0.5 mOhm) 5 W power rating up to 130 °C Four terminal-configurati onon Excellent long-term stability Ideal suited for mounting on DBC / IMS substrate High application temperature
- Mounting / Packaging: Surface Mount (SMT / SMD), Other
- Operating Temperature: -65 to 170 C
- Power Rating: 5 to 10 watts
- Resistance Range: 3.00E-4 to 0.0030 ohms
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Supplier: Isabellenhutte USA
Description: Ohm) Copper connectors Excellent long term stability Ideal suited for mounting on DBC / IMS substrate Max. solder temperature up to 350 °C / 30 sec Mounting: Reflow-soldering AEC-Q200 qualification
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Operating Temperature: -55 to 170 C
- Power Rating: 1 to 2 watts
- Resistance Range: 0.0030 to 0.0250 ohms
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Supplier: Isabellenhutte USA
Description: .5 mOhm) Four terminal-configurati onon Excellent long term stability High application temp. range - 55 to +170 °C Max. solder temp. up to 350 °C / 30 sec AEC-Q200 qualification Ideal suited for mounting on DBC / IMS substrate
- Mounting / Packaging: Surface Mount (SMT / SMD), Other
- Operating Temperature: -65 to 170 C
- Power Rating: 3 to 12 watts
- Resistance Range: 2.00E-4 to 0.0050 ohms
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Supplier: RS Components, Ltd.
Description: ratings. SCR output for heavy industrial loads,Zero Voltage or instantaneous turn-on outputs,UL/CSA/VDE Approved, CE Compliant to EN60950-1,Improved SEMS screw and washer,Anti-rotation barriers,AC or DC control,Direct Bond Copper (DBC) substrate,EMC compliant to Level 3,Direct power
- Input (Pick-up) Voltage Range: 32 volts
- Load Voltage: 660 volts
- Mounting: Panel
- Operating Temperature: -40 F
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Supplier: RS Components, Ltd.
Description: ratings. SCR output for heavy industrial loads,Zero Voltage or instantaneous turn-on outputs,UL/CSA/VDE Approved, CE Compliant to EN60950-1,Improved SEMS screw and washer,Anti-rotation barriers,AC or DC control,Direct Bond Copper (DBC) substrate,EMC compliant to Level 3,Direct power
- Input (Pick-up) Voltage Range: 280 volts
- Load Voltage: 660 volts
- Mounting: Panel
- Operating Temperature: 176 F
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Supplier: RS Components, Ltd.
Description: ratings. SCR output for heavy industrial loads,Zero Voltage or instantaneous turn-on outputs,UL/CSA/VDE Approved, CE Compliant to EN60950-1,Improved SEMS screw and washer,Anti-rotation barriers,AC or DC control,Direct Bond Copper (DBC) substrate,EMC compliant to Level 3,Direct power
- Input (Pick-up) Voltage Range: 32 volts
- Load Voltage: 530 volts
- Mounting: Panel
- Turn-on Switching: Zero Switching, Other
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Supplier: RS Components, Ltd.
Description: ratings. SCR output for heavy industrial loads,Zero Voltage or instantaneous turn-on outputs,UL/CSA/VDE Approved, CE Compliant to EN60950-1,Improved SEMS screw and washer,Anti-rotation barriers,AC or DC control,Direct Bond Copper (DBC) substrate,EMC compliant to Level 3,Direct power
- Input (Pick-up) Voltage Range: 32 volts
- Load Voltage: 530 volts
- Mounting: Other
- Operating Temperature: -40 to 176 F
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Supplier: MacDermid Alpha Electronics Solutions
Description: offering flexibility and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers). Argomax 2141® paste offers exceptional performance and is aligned with the Argomax range
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thickness is still thinner than DBC ceramic PCB or FR4 boards. Using the thick film technology, Ceramic PCBs are manufactured through printing and a high-temperature sintering process, which can (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
. Metalized Ceramic Substrate Ceramic substrates can be metallized through various techniques, and several common methods include Direct Bonded Copper (DBC), Direct Plated Copper (DPC), and Active Metal Brazing (AMB). DBC Ceramic (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
-fired multi-layer ceramic substrates), HTCC (high temperature co-fired multi-layer ceramics), DBC (direct bonding copper substrates), DPC (direct copper plating substrates). HTCC belongs to the earlier development technology, but because of its high process temperature (1300-1600 C), the choice of (read more)
Browse Industrial Ceramic Materials Datasheets for 3X Ceramic Parts Company Limited -
conductive DBC substrate. Permanent power up to 20 W Constant currents up to 140 A Mounting: Reflow-, IR-soldering or bonding on substrate 4-terminal-connection technology Conductive DBC-/IMS-soldering assembly Nickel-plated/Au-plated bond (read more)
Browse Power Resistors Datasheets for Isabellenhutte USA -
. Versatile Applications: Supports electronics (LED, RF, IGBT modules), laser devices, thin/thick film substrates, and advanced packaging processes (DPC, DBC, AMB (read more)
Browse Industrial Ceramic Materials Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd. -
Post?processing Plating: Available nickel, gold, silver, or tin plating to enable brazing with copper, Kovar, stainless steel, etc. Applications: Power Electronics: Packaging for IGBT modules, DBC/AMB substrates (read more)
Browse Industrial Ceramic Materials Datasheets for Shenzhen Great Precision Ceramic CO., LTD.
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The Differences Between DBC and DPC Ceramic Substrates
For electronic packaging, ceramic substrates play a key role in connecting the internal and external heat dissipation channels, as well as both electrical interconnection and mechanical support. Ceramic substrates have the advantages of high thermal conductivity, good heat resistance, high
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Direct Bonded Copper Ceramic Substrates
DBC ceramic substrate, short for Direct Bonded Copper Ceramic substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a substrate with exceptional
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AMB Alumina Copper-Clad Plate
Compared with traditional DBC substrate, ceramic substrate prepared by AMB technology not only has higher thermal conductivity, better copper layer bonding, but also has the advantages of lower thermal resistance, higher reliability. Alumina base plate is the most cost-effective AMB ceramic base
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http://etd.auburn.edu/bitstream/handle/10415/473/LIU_YI_31.pdf?sequence=1
Direct Bond Copper ( DBC ) substrates have been used for power electronics for many years because of the following advantages: .
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Power Electronic Packaging
Chapter 7 discusses the material characterization for power packaging including the polyimide coating behavior on MOSFET die; die attach delamination characterization; EMC characterization; the mechanical and thermal behavior of ceramic and direct bond copper ( DBC ) substrates ; solder material characterization; lead frame material …
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Hybrid Solid- and Liquid-Cooling Solution for Isothermalization of Insulated Gate Bipolar Transistor Power Electronic Devices
However, these high heat flux cooling solutions, when applied on the back side of the direct-bonded copper ( DBC ) substrate and designed for thermal management of the entire IGBT module, cannot remove the nonuniform temperature distribution on the individual IGBT chips.
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Investigation of a Sic Module with a High Operating Temperature for Power Applications
The module was designed to have a temperature distribution of 200 ºC at the chip joint, 150 ºC at the DBC substrate joint and 65 ºC at the heatsink.
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Impact of joint materials on the reliability of double-side packaged SiC power devices during high temperature aging
In the present study, we use the SBB tech- nology andvacuum reflow process to bondtheAl electrodeof power devices to a direct bonded copper ( DBC ) substrate .
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High-Temperature High-Power Packaging Techniques for HEV Traction Applications
The most popular DBC substrate utilizes copper layers ranging from 0.2–0.4 mm in thickness in conjunction with AlN substrates.
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High-Temperature High-Power Packaging Techniques for HEV Traction Applications
The most popular DBC substrate utilizes copper layers ranging from 0.2–0.4 mm in thickness in conjunction with AlN substrates.
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Reliable and repeatable bonding technology for high temperature automotive power modules for electrified vehicles
Proof-of-concept fabrication was demonstrated using silicon die and conventional direct bonded copper ( DBC ) substrates , which are generally used for conventional power modules.
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A Novel Three-Dimensional Packaging Method for Al-Metalized SiC Power Devices
Al-metalized elec- trodes of a SiC power chip can be robustly assembled to a direct bonded copper ( DBC ) substrate with this method.
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Design trade-offs and reliability of power circuit substrates with respect to varying geometrical parameters of direct copper bonded Al2O3 and BeO
They are adhesion test, thermal cycle and thermal shock evaluation and bond integrity after solder and braze cycling of the DBC substrates .