Dbc Substrate

Description: DBC (Direct Bonded Copper) is comprised of an insulating layer of ceramic substrate such as Al2O3 (aluminum oxide) and AlN (aluminum nitride) and copper connections to ensure electrical conductivity at high temperatures. For maximum reliability and performance, modules must exhibit

• Features: Alumina / Aluminum Oxide, Specialty Ceramic
• Specialty Ceramic Type: Aluminum Nitride
• Applications: Battery / Fuel Cell, Construction & Building / Architectural, Electrical / HV Parts, Electronics / RF-Microwave
• Performance Features: Metallized / Silvered (Electrode, Mirror)

Description: traditional ceramic is alumina Al2O3. Alumina has excellent electrical insulation properties, as well as high chemical resistance and low thermal expansion. Alumina ceramic substrates can withstand high temperatures while retaining their strength and hardness. Alumina ceramic

• Features: Alumina / Aluminum Oxide
• Specialty Ceramic Type: Aluminum Nitride
• Shape / Form: Plate / Board (e.g., Fiberboard)

Description: AlN substrate possesses a wide range of superior physical properties, including high breakdown electric field strength, thermal conductivity, resistivity, and so forth. In fields like LED packaging, power modules, wafer bonding, power resistors, and metalized substrates (such as thin

• Density: 3.2499979488370605 to 3.349997885724355 g/cc
• Max Use / Curie Temperature: 1,200 C
• Dielectric Strength: 17,000,000 V/m
• Specialty Ceramic Type: Aluminum Nitride

Description: DBC ceramic substrate, short for Direct Bonded Copper Ceramic Substrate, is an advanced material composed of a ceramic substrate (typically Al2O3 or AlN) and copper, tightly joined together through a hypo-eutectic process. This unique combination of materials results in a

• Performance Features: Metallized / Silvered (Electrode, Mirror)
• Features: Other, Specialty / Other, Specialty Ceramic

Description: Direct Plated Copper (DPC) is a newest development in the field of Ceramic Substrate PCBs, its process is by magnetron sputtering technology to deposit a metal layer (Ti/Cu target) on the surface of the ceramic substrate which result in copper thickness' ranging from 10um to 130um, and

• Features: Other, Specialty / Other, Specialty Ceramic

Description: Thickness 0.15mm 0.25mm 0.5mm Aluminum Nitride Substrate The Advantage of Aluminum Nitride Substrate : 3X Ceramic Parts company use tape casting to produce high thermal conductivity aluminum nitride substrates . * High Thermal Conductivity ≥170 W/ m.k * Meet Variesties of

• Density: 3.3299978983468956 g/cc
• Thermal Conductivity: 170 W/m-K
• MOR / Flexural Strength: 58,014.7357428788 psi
• Dielectric Constant (Relative Permittivity): 8.8 #

Description: Product Overview With proven reliability in Electric Vehicle (EV) and rail traction applications, ALPHA Argomax 5022 Paste is specifically designed for low-pressure sintering die attachment on dried paste applied to copper-finished Direct Bonded Copper (DBC) substrates. It is

• Joining Process / Product Form: Paste

Description: Features Heavy copper connectors Excellent long-term stability Ideal suited for mounting on DBC / IMS substrate Max. solder temperature up to 350°C / 20 min. RoHS 2011/65/EU compliant Applications Current sensor for power hybrid applications High current applications for the automotive

• Resistance Range: 0.000525 to 0.003 ohms
• Tolerance: 1 to 5 +/- %
• Temperature Coefficient (TCR): 60 to 320 ±ppm/°C
• Power Rating: 13 watts

Description: about this technology, you can read here DBC and DPC have high thermal conductivity, as the copper foil is bonded or plated to the ceramic directly without any middle layer, However, DBC will have the problem of the microbubbles between the ceramic substrate and copper. FX PCB

• Thickness: 0.00984251968503937 to 0.014960629921259842 inches
• Electrical Resistivity: 10 ohm-cm
• Features: Specialty / Other

Description: Excellent long term stability High application temp. range - 55 to +170 °C Max. solder temp. up to 350 °C / 30 sec AEC-Q200 qualification Ideal suited for mounting on DBC / IMS substrate

• Resistance Range: 0.0002 to 0.005 ohms
• Tolerance: 1 to 5 +/- %
• Temperature Coefficient (TCR): 20 to 50 ±ppm/°C
• Power Rating: 3 to 12 watts

Description: device is manufactured using 0.25µm Power pHEMT process, including, via holes through the substrate and air bridges. It is available in chip form.

• Frequency Range: 8,500 to 11,500 MHz
• Maximum Gain: 27.5 dB
• Minimum Operating Voltage: 8 volts
• Maximum Operating Voltage: 8 volts

Description: or GaN-on-Si, including higher breakdown voltage, higher saturated-electron-drift velocity and higher thermal conductivity. This Ku Band MMIC is available in a 10-lead, 25-mm x 9.9-mm, metal/ceramic flanged package for optimal electrical and thermal performance. PAVE = 42 dBm, IM3 = -30 dBc,

Description: The MFBP-00164GSM1 surface-mount bandpass filter is an ideal solution for extremely small form factor, high rejection filtering. The MFBP-00164GSM1 features a 430-990MHz 1dBc passband and 0.9dB center frequency insertion loss. Its advanced glass substrate technology allows production of

• Frequency (Fc): 430 to 990 MHz
• Filter Type: Bandpass
• Features: Other
• Filter Technology: Passive Filter

Description: The MFBP-00163GSM1 surface-mount bandpass filter is an ideal solution for extremely small form factor, high rejection filtering. The MFBP-00163GSM1 features a 1.4-2.4GHz 1dBc passband and 1.2dB center frequency insertion loss. Its advanced glass substrate technology allows production of

• Frequency (Fc): 0 to 30,000 MHz
• Filter Type: Bandpass
• Features: Other
• Filter Technology: Passive Filter

Description: The MFBP-00161GSM1 surface-mount bandpass filter is an ideal solution for extremely small form factor, high rejection filtering. The MFBP-00161GSM1 features a 2.0-2.5GHz 1dBc passband and 1.9dB center frequency insertion loss. Its advanced glass substrate technology allows production of

• Frequency (Fc): 2,000 to 2,500 MHz
• Filter Type: Bandpass
• Features: Other
• Filter Technology: Passive Filter

Description: The MFLP-00045GSM2 surface-mount lowpass filter is an ideal solution for extremely small form factor, high rejection filtering. The MFLP-00045GSM2 features a 4.9 GHz 3 dBc cutoff and 25 dB passband return loss. Its advanced glass substrate technology allows production of smaller filter

• Frequency (Fc): 0 to 30,000 MHz
• Filter Type: Low Pass
• Features: Other
• Filter Technology: Passive Filter

Description: and ease of use. The paste has specifically been developed for large packages (or components) on gold- and silver-finished substrates (like DBC, Aluminum and Copper coolers). Argomax 2141® paste offers exceptional performance and is aligned with the Argomax range. High Thermal and