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Supplier: Applied Diamond, Inc.
Description: Applied Diamond can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually
- Device: Passive Heat Sink
- Height: 0.1000 to 0.5000 mm
- Length: 1.5 to 30 mm
- Material: Mixed Material, Other Materials
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Supplier: Smiths Interconnect
Description: Handling up to 150 Watts CVD Diamond Substrates Tuned Versions Available Solderable or Bondable Gold Terminals Integrated Heat Sink; Tab Launch Surface Mount Available; Tape and Reel Packaging Available High Reliability Versions Available
- Packing Method: Tape Reel
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Supplier: RS Components, Ltd.
Description: Mounting = Horizontal Colour = Black Package Type = TO-3 Special Features = High Fin Count Enhances Efficiency, Low Cost Diamond Shaped Basket Heat Sink With Straight Fins
- Height: 31.75 mm
- Length: 35.55 mm
- Mounting: Other
- Thermal Resistance: 7.8 °C / W
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy TO-3 diamond shaped heatsinks. Designed to fit through hole discrete semiconductors with a TO-3 package type. For Use With = TO-3 Length = 50.8mm Width = 44.45mm Height = 9.53mm Dimensions = 50.8 x 44.45 x 9.53mm Thermal Resistance = 7°C/W Mounting = Horizontal Colour = Black
- Height: 9.53 mm
- Length: 50.8 mm
- Mounting: Other
- Thermal Resistance: 7 °C / W
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Supplier: RS Components, Ltd.
Description: Colour = Black Package Type = TO-3 Special Features = Square Basket Heat Sink Featuring a Slanted Fin Design for Increased Air Turbulence and Four Integrated Mounting Holes Application = Through Hole Discrete Semiconductors
- Height: 31.75 mm
- Length: 45.97 mm
- Thermal Resistance: 5 °C / W
- Width: 45.97 mm
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy low profile heatsinks for use with TO-66 package through hole discrete semiconductors. For Use With = TO-66 Length = 26.42mm Width = 39.37mm Height = 25.4mm Dimensions = 26.42 x 39.37 x 25.4mm Colour = Black Package Type = TO-66 Special Features = Low Cost Diamond Shaped
- Height: 25.4 mm
- Length: 26.42 mm
- Width: 39.37 mm
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Description: composite materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials. DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal
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Supplier: Xoxide
Description: users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete
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Supplier: ASME
Description: ................ .................... ..........31 Don't tell a circuit designer which board layout gives the worst thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat
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Supplier: ASME Standards and Certification
Description: ................ .................... ..........31 Don't tell a circuit designer which board layout gives the worst thermal performance. He or she will choose it as the only one that will work electrically. Lesson: Introduction to CFD (computational fluid dynamics). Chapter 6: When Is a Heat
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Supplier: Solar Atmospheres, Inc.
Description: Vacuum brazing services consist of metal joining processes used to permanently join metal parts. The vacuum brazing services process involves the use of a filler metal that is melted under vacuum and drawn in to the joint by capillary action. The base metal does not melt during the vacuum brazing
- Additional Services: Design Assistance, High Volume Production, Low to Mid Volume Production, Testing and Inspection
- Dissimilar Materials: Yes
- Industry Served: Aerospace / Avionics, Heat Sinks / Thermal Management, Honeycomb Structures, Medical Devices / Health Care, Process Equipment (Heat Exchangers, Tanks, etc.), Tubing Assembly / System, Specialty / Other
- Location: North America, United States Only, Southwest US Only
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Supplier: Rehrig Pacific Company
Description: 't allow the container to hold liquids for other purposes.Capacity: 6.0 Gallons (23.3 liters) Features: Made with durable, washable, 100% recyclable, high density poly-ethylene (HDPE) resin Attractive open-diamond design Drop front gives easy access under sinks
- Application: Shipping
- Type: Bin
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Supplier: San Jose Delta Associates, Inc.
Description: tough problems in a wide range of industrial applications. Thermal Management of Electronic Devices The unique combination of being both an excellent electrical insulator and thermal conductor makes BN very useful as a heat sink in high power electronic applications. Its
- Applications: Dielectric / Electrical Insulation, Refractory / High Temperature Materials, Thermal Insulation / Fire Proofing, Wear Parts / Tooling
- Coeff. of Thermal Expansion (CTE): -0.7000 to 7.2 µm/m-C
- Compressive / Crushing Strength: 3626 to 45968 psi
- Density: 1.9 to 2.9 g/cc
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Supplier: Smiths Interconnect
Description: finishes for easy mounting to a heat sink or directly to the printed circuit board. Typical finishes include: Lead-free, RoHS compliant plating (silver or gold), solder finish with SN63 or solder fused finish with SN63 depending upon package type. Select from bulk, tape & reel, or
- Packing Method: Tape Reel
- Power Rating: 0.0500 to 800 watts
- Resistance Range: 3 to 400 ohms
- Standard and Compliances: RoHS Compliant
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Featured Products Top
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DiaCool is easily adaptable to customer specific designs and is a cost-effective solution to increase the long-term reliability of power, RF, laser, and any applications where thermal management is vital to long term reliability. Our DiaCool copper diamond composite materials for high (read more)
Browse Heat Sinks Datasheets for Qnnect, formerly Hermetic Solutions Group -
provides "diamond like" thermal conduction without the "diamond" price • Understand why Pyroid® HT material solutions are ideal for high-volume production and provide economic value at the device assembly level • Learn how to optimize heat sinks and spreaders with the (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
solutions in battling against thermal heat in electronic circuits & devices. • A thermal management solution providing "diamond like" thermal conduction without the "diamond" price • Pyroid® HT materials are ideal for high-volume production & providing value at the device (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. This “ diamond like” conduction without the “diamond” (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
PYROID®HT Pyrolytic Graphite Thermal Management Material Heat Sink Application The high thermal conductivity of Pyroid HT (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
management material solution that provides "diamond like" thermal conduction without the "diamond" price • Understand why Pyroid® HT material solutions are ideal for high-volume production and provide economic value at the device assembly level • Learn how to optimize heat sinks and (read more)
Browse Heat Sinks Datasheets for MINTEQ® International Inc, Pyrogenics Group -
transparency) Electrical (semiconductor properties) Thermal (highest heat conductivity) Some typical industrial application examples are machining and cutting tools, window material for transmitting infrared and microwave radiation, and heat sinks for lasers and transistors (read more)
Browse Vacuum Pumps and Vacuum Generators Datasheets for Leybold USA Inc. -
conduction without the "diamond" price -Understand why Pyroid® HT material solutions are ideal for high-volume production and provide economic value at the device assembly level -Learn how to optimize heat sinks and spreaders with the Pyroid® HT software modeling tool (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
derivative of our material branded as Pyroid® HT Pyrolytic Graphite material that offers heat spreaders and sink thermal conductivity up to 4 times (1700 W/m°K) that of copper at only a quarter of the weight. This “ diamond like” conduction without the “diamond” (read more)
Browse Carbon, Graphite, and Diamond Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group -
management material solution that provides "diamond like" thermal conduction without the "diamond" price • Understand why Pyroid® HT material solutions are ideal for high-volume production and provide economic value at the device assembly level • Learn how to optimize heat sinks and (read more)
Browse Thermal Compounds and Thermal Interface Materials Datasheets for MINTEQ® International Inc, Pyrogenics Group
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air
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Advanced Materials for Thermal Management of Electronic Packaging
Figure 6.6 shows some application examples of Al–diamond composites for thermal management, including GaAs laser diode or power electronic modules (IGBT) mounted on Al–diamond heat spreader, Ni/Au metalized Al–diamond substrate, Al– diamond heat sink , and Al–diamond insert in heat sink case.
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Effect of junction temperature on the large-signal properties of a 94 GHz silicon based double-drift region impact avalanche transit time device
Fre- quency chirping due to temperature transients in pulsed mode and corresponding chirping bandwidths are also studied for the 94 GHz DDR Si IMPATT device on semi-infinite copper and type-IIA diamond heat sinks separately. .
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Application of Diamond in High Technology
The use of diamond heat sinks in electronics began 20 years before active diamond components found application.
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Applications Of Diamond In Optics
The successful use of diamond as a heat sink for microwave diodes was reported some twenty years ago 26 and in the period since then diamond heat sinks have, amongst other things, made possible the first room temperature semiconductor diode lasers.
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Applications of diamond made by chemical-vapor deposition semiconductor laser submounts
Garmire and Tavis'9 show that it is possible to operate large arrays coherently to high optical output levels using diamond heat sinks .
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Recent experimental results from GaAs TUNNETT diodes above 100 GHz
TUNNETF diodes on diamond heat sinks .
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Thermal resistance at metal/diamond interfaces in relation to the mounting of microwave diodes
Therefore, high-power devices require the best possible thermal design, and in practice many attempts to achieve this have involved the use of type IIa diamond heat sinks .
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Submillimeter-Wave InP Gunn Devices
Likewise, devices on diamond heat sinks whose graded doping profile, as shown in Fig. 2(b), was designed for fundamental-mode operation at -band (75–110 GHz) frequencies, also generated the highest RF power levels from any Gunn device.