Products & Services
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Supplier: Applied Diamond, Inc.
Description: Applied Diamond can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually
- Device: Passive Heat Sink
- Height: 0.1000 to 0.5000 mm
- Length: 1.5 to 30 mm
- Material: Mixed Material, Other Materials
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Supplier: ToneCooling Technology Co., Ltd
Description: thermal conductivity is slightly inferior to that of diamond copper. Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their
- Fan Airflow: 41.4 SCFM
- Fan Noise: 47.67 dB
- Fan Speed: 6800 rpm
- Fan Voltage: 12 VDC
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Supplier: Molex Signal Tech Industrial Ltd.
Description: Handling up to 150 Watts CVD Diamond Substrates Tuned Versions Available Solderable or Bondable Gold Terminals Integrated Heat Sink; Tab Launch Surface Mount Available; Tape and Reel Packaging Available High Reliability Versions Available
- Mounting / Packaging: Surface Mount (SMT / SMD)
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Supplier: RS Components, Ltd.
Description: Mounting = Horizontal Colour = Black Package Type = TO-3 Special Features = High Fin Count Enhances Efficiency, Low Cost Diamond Shaped Basket Heat Sink With Straight Fins
- Height: 31.75 mm
- Length: 35.55 mm
- Mounting: Other
- Thermal Resistance: 7.8 °C / W
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Supplier: RS Components, Ltd.
Description: Aavid Thermalloy TO-3 diamond shaped heatsinks. Designed to fit through hole discrete semiconductors with a TO-3 package type. For Use With = TO-3 Length = 50.8mm Width = 44.45mm Height = 9.53mm Dimensions = 50.8 x 44.45 x 9.53mm Thermal Resistance = 7°C/W Mounting = Horizontal Colour = Black
- Height: 9.53 mm
- Length: 50.8 mm
- Mounting: Other
- Thermal Resistance: 7 °C / W
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Supplier: RS Components, Ltd.
Description: Colour = Black Package Type = TO-3 Application = Through Hole Discrete Semiconductors Special Features = Square Basket Heat Sink Features Straight Fins and 0.090 Thick Aluminum for Increased Cooling Capacity
- Height: 31.75 mm
- Length: 45.21 mm
- Thermal Resistance: 6 °C / W
- Width: 45.21 mm
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Supplier: RS Components, Ltd.
Description: Colour = Black Package Type = TO-3 Special Features = Square Basket Heat Sink Featuring a Slanted Fin Design for Increased Air Turbulence and Four Integrated Mounting Holes Application = Through Hole Discrete Semiconductors
- Height: 31.75 mm
- Length: 45.97 mm
- Thermal Resistance: 5 °C / W
- Width: 45.97 mm
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Supplier: Matexcel
Description: comes into contact with the skin, it should be cleaned with alcohol and hand sanitizer in time Application: 1. High power LED radiator 2. CPU cooler 3. Metal film for heat dissipation 4. Metal heat sink 5. Electrical cooling shell Usage: 1. Substrate
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Description: composite materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials. DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal
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Supplier: Xoxide
Description: users: improved thermal dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete
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Supplier: Matexcel
Description: Graphene Nanoplatelets: Average thickness - 7 nm 23 wt% Total graphene content Solvent: N-Butyl acetate Proprietary dispersant (2%) Application: An additive to polymers, graphene-based composites Thermally conductive compounds Inks and coatings Heat sinks Electromagnetic Interference
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Supplier: Solar Atmospheres, Inc.
Description: Vacuum brazing services consist of metal joining processes used to permanently join metal parts. The vacuum brazing services process involves the use of a filler metal that is melted under vacuum and drawn in to the joint by capillary action. The base metal does not melt during the vacuum brazing
- Additional Services: Design Assistance, High Volume Production, Low to Mid Volume Production, Testing and Inspection
- Dissimilar Materials: Yes
- Industry Served: Aerospace / Avionics, Heat Sinks / Thermal Management, Honeycomb Structures, Medical Devices / Health Care, Process Equipment (Heat Exchangers, Tanks, etc.), Tubing Assembly / System, Specialty / Other
- Location: North America, United States Only, Southwest US Only
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Supplier: Rehrig Pacific Company
Description: 't allow the container to hold liquids for other purposes.Capacity: 6.0 Gallons (23.3 liters) Features: Made with durable, washable, 100% recyclable, high density poly-ethylene (HDPE) resin Attractive open-diamond design Drop front gives easy access under sinks
- Application: Shipping
- Type: Bin
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Supplier: San Jose Delta Associates, Inc.
Description: tough problems in a wide range of industrial applications. Thermal Management of Electronic Devices The unique combination of being both an excellent electrical insulator and thermal conductor makes BN very useful as a heat sink in high power electronic applications. Its
- Applications: Dielectric / Electrical Insulation, Refractory / High Temperature Materials, Thermal Insulation / Fire Proofing, Wear Parts / Tooling
- Coeff. of Thermal Expansion (CTE): -0.7000 to 7.2 µm/m-C
- Compressive / Crushing Strength: 3626 to 45968 psi
- Density: 1.9 to 2.9 g/cc
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Description: , such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: industries, such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: , such as: Heat sinks & heat spreaders Substrates for electronic packages Substrates & insulators for microelectronic devices & opto electronic devices Laser heat management components Electrical insulators Molten metal fixtures
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Description: devices. The thermal conductivity of aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200?.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat sinks
- Applications: Electrical / HV Parts
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Material Type: Aluminum Nitride, Specialty Ceramic
- Thermal Conductivity: 170 W/m-K
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Supplier: Molex Signal Tech Industrial Ltd.
Description: finishes for easy mounting to a heat sink or directly to the printed circuit board. Typical finishes include: Lead-free, RoHS compliant plating (silver or gold), solder finish with SN63 or solder fused finish with SN63 depending upon package type. Select from bulk, tape & reel, or
- Mounting / Packaging: Surface Mount (SMT / SMD), Tab Terminals
- Power Rating: 0.0500 to 800 watts
- Resistance Range: 3 to 400 ohms
- Standard and Compliances: RoHS Compliant
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Featured Products Top
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Our Diamond Copper and Tungsten Copper Alloys provide cutting-edge solutions for thermal management in high-performance industries. Diamond (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air
More Information Top
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Advanced Materials for Thermal Management of Electronic Packaging
Figure 6.6 shows some application examples of Al–diamond composites for thermal management, including GaAs laser diode or power electronic modules (IGBT) mounted on Al–diamond heat spreader, Ni/Au metalized Al–diamond substrate, Al– diamond heat sink , and Al–diamond insert in heat sink case.
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Effect of junction temperature on the large-signal properties of a 94 GHz silicon based double-drift region impact avalanche transit time device
Fre- quency chirping due to temperature transients in pulsed mode and corresponding chirping bandwidths are also studied for the 94 GHz DDR Si IMPATT device on semi-infinite copper and type-IIA diamond heat sinks separately. .
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Application of Diamond in High Technology
The use of diamond heat sinks in electronics began 20 years before active diamond components found application.
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Applications Of Diamond In Optics
The successful use of diamond as a heat sink for microwave diodes was reported some twenty years ago 26 and in the period since then diamond heat sinks have, amongst other things, made possible the first room temperature semiconductor diode lasers.
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Applications of diamond made by chemical-vapor deposition semiconductor laser submounts
Garmire and Tavis'9 show that it is possible to operate large arrays coherently to high optical output levels using diamond heat sinks .
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Recent experimental results from GaAs TUNNETT diodes above 100 GHz
TUNNETF diodes on diamond heat sinks .
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Thermal resistance at metal/diamond interfaces in relation to the mounting of microwave diodes
Therefore, high-power devices require the best possible thermal design, and in practice many attempts to achieve this have involved the use of type IIa diamond heat sinks .
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Submillimeter-Wave InP Gunn Devices
Likewise, devices on diamond heat sinks whose graded doping profile, as shown in Fig. 2(b), was designed for fundamental-mode operation at -band (75–110 GHz) frequencies, also generated the highest RF power levels from any Gunn device.