Products & Services
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Supplier: Applied Diamond, Inc.
Description: Applied Diamond can build heat spreaders for the most extreme possibilities. As a material, diamond has no peer as a semiconductor medium. The unsurpassed thermal conductivity of diamond and its high electrical resistivity allow for better performance across virtually all
- Length: 1.5 to 30 mm
- Width: 1.5 to 30 mm
- Height: 0.10000000000000002 to 0.5 mm
- Material: Mixed Material
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Supplier: ToneCooling Technology Co., Ltd
Description: conductivity is slightly inferior to that of diamond copper. Diamond copper and diamond aluminum are currently the best heat dissipation materials in our company. Single crystal diamond and CVD diamond exhibit high thermal conductivity, but their thermal
- Length: 89.50000000000001 mm
- Width: 89.50000000000001 mm
- Height: 69 mm
- Fan Airflow: 41.4 SCFM
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Supplier: Molex Signal Tech Industrial Ltd.
Description: The highest power to size ratio resistive products utilizing CVD Diamond, the best thermal conductor available. Diamond by EMC Technology brand, is the best thermal conductor on earth. Features & Benefits Combined with a low dielectric constant, it is an excellent RF dielectric
- Mounting / Packaging: Surface Mount (SMT / SMD)
- Features: Tape Reel
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Supplier: Matexcel
Description: This product uses the high thermal conductivity and high emissivity of high-barrier graphene to transfer the heat from the surface of the high-temperature device into the coating, and radiate heat to the outside in the form of infrared rays, speeding up the heat exchange between
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Description: materials for heat sinks, die tabs and heat spreaders provide our customers with significant advantages over more conventional laminate or MMC materials. DiaCoolTM materials deliver a device-friendly coefficient of thermal expansion (CTE) and very high thermal conductivity that
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Supplier: Xoxide
Description: dissipation at the GPU level thanks to Swiftech's Diamond Pin Matrix and a better TIM joint, and less heat dumped into the liquid cooling loop coming from memory, and power MOSFETS since they remain air cooled. In addition, this combination provides a complete solution that is more
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Supplier: Matexcel
Description: Graphene Nanoplatelets: Average thickness - 7 nm 23 wt% Total graphene content Solvent: N-Butyl acetate Proprietary dispersant (2%) Application: An additive to polymers, graphene-based composites Thermally conductive compounds Inks and coatings Heat sinks Electromagnetic Interference
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Supplier: Rehrig Pacific Company
Description: the container to hold liquids for other purposes.Capacity: 6.0 Gallons (23.3 liters) Features: Made with durable, washable, 100% recyclable, high density poly-ethylene (HDPE) resin Attractive open-diamond design Drop front gives easy access under sinks Smooth interior and beveled edges
- Container Type: Bin
- Application: Shipping
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Supplier: San Jose Delta Associates, Inc.
Description: wide range of industrial applications. Thermal Management of Electronic Devices The unique combination of being both an excellent electrical insulator and thermal conductor makes BN very useful as a heat sink in high power electronic applications. Its properties compare favorably with
- Density: 1.9000000000000001 to 2.9000000000000004 g/cc
- Max Use / Curie Temperature: 850 to 2,000 C
- Thermal Conductivity: 11 to 130 W/m-K
- Coeff. of Thermal Expansion (CTE): 0.7 to 7.2 µm/m-C
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Supplier: Solar Atmospheres, Inc.
Description: Vacuum brazing services consist of metal joining processes used to permanently join metal parts. The vacuum brazing services process involves the use of a filler metal that is melted under vacuum and drawn in to the joint by capillary action. The base metal does not melt during the vacuum brazing
- Applications / Industry: Aerospace / Avionics, Heat Sinks / Thermal Management, Honeycomb Structures, Medical Devices / Health Care, Process Equipment (Heat Exchangers, Tanks, etc.), Specialty / Other, Tubing Assembly / System
- Services: Brazing
- Materials: Carbide / Hardmetal, Carbon (Graphite, Diamond, etc.), Ceramics / Ceramic-to-Metal, Copper / Copper Alloy, Dissimilar Materials, Refractory Metal, Steel - Carbon / Alloy, Steel - Stainless, Titanium Alloy
- Additional Services: Design Assistance, High Volume Production, Low to Mid Volume Production, Testing and Inspection
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Description: devices. The thermal conductivity of aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200℃.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat sinks &
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Description: devices. The thermal conductivity of aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200℃.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat sinks &
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Description: aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200℃.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat sinks & heat spreaders Substrates for
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Description: devices. The thermal conductivity of aluminum nitride is more than 170W/(mk), it has good thermal shock resistance, and can be used in a high temperature environment of 2200℃.. Therefore, aluminum nitride ceramic products are an ideal choice for many industries, such as: Heat sinks &
- Thermal Conductivity: 170 W/m-K
- Coeff. of Thermal Expansion (CTE): 4 to 6 µm/m-C
- Specialty Ceramic Type: Aluminum Nitride
- Applications: Electrical / HV Parts
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Supplier: Molex Signal Tech Industrial Ltd.
Description: frequency high reliability wire bondable chip terminations and CTX SMT Series of high frequency surface mount chip terminations are optimized to combine high frequency, and power in a small package Features & Benefits Choose from a variety of metallization finishes for easy mounting to a heat
- Resistance Range: 3 to 400 ohms
- Power Rating: 0.05 to 800 watts
- Standards and Certifications: RoHS Compliant
- Mounting / Packaging: Surface Mount (SMT / SMD), Tab Terminals
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Featured Products Top
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Our Diamond Copper and Tungsten Copper Alloys provide cutting-edge solutions for thermal management in high-performance industries. Diamond (read more)
Browse Heat Sinks Datasheets for ToneCooling Technology Co., Ltd
Conduct Research Top
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Managing Heat Transfer With Potting Compounds
heat build-up in an electronic assembly. Epoxies, urethanes and silicones are used to bond heat sinks, encapsulate power supplies and individual components and protect motors from overheating. Thermal conductivity (k) is the property of a material that indicates its ability to conduct heat. Air
More Information Top
Indicates content that may require registration and/or purchase.
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Advanced Materials for Thermal Management of Electronic Packaging
Figure 6.6 shows some application examples of Al–diamond composites for thermal management, including GaAs laser diode or power electronic modules (IGBT) mounted on Al–diamond heat spreader, Ni/Au metalized Al–diamond substrate, Al– diamond heat sink , and Al–diamond insert in heat sink case.
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Effect of junction temperature on the large-signal properties of a 94 GHz silicon based double-drift region impact avalanche transit time device
Fre- quency chirping due to temperature transients in pulsed mode and corresponding chirping bandwidths are also studied for the 94 GHz DDR Si IMPATT device on semi-infinite copper and type-IIA diamond heat sinks separately. .
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Application of Diamond in High Technology
The use of diamond heat sinks in electronics began 20 years before active diamond components found application.
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Applications Of Diamond In Optics
The successful use of diamond as a heat sink for microwave diodes was reported some twenty years ago 26 and in the period since then diamond heat sinks have, amongst other things, made possible the first room temperature semiconductor diode lasers.
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Applications of diamond made by chemical-vapor deposition semiconductor laser submounts
Garmire and Tavis'9 show that it is possible to operate large arrays coherently to high optical output levels using diamond heat sinks .
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Recent experimental results from GaAs TUNNETT diodes above 100 GHz
TUNNETF diodes on diamond heat sinks .
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Thermal resistance at metal/diamond interfaces in relation to the mounting of microwave diodes
Therefore, high-power devices require the best possible thermal design, and in practice many attempts to achieve this have involved the use of type IIa diamond heat sinks .
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Submillimeter-Wave InP Gunn Devices
Likewise, devices on diamond heat sinks whose graded doping profile, as shown in Fig. 2(b), was designed for fundamental-mode operation at -band (75–110 GHz) frequencies, also generated the highest RF power levels from any Gunn device.