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Supplier: ASTM International
Description: resistance; dielectric breakdown; dielectric constant; dielectric strength; dissipation factor; surface resistance; comparative track index; volume resistance; and water extract conductance. Tests for combustion qualification shall also be performed to determine the flame
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 2M2M is Dimethoxydimethylsilane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer
- Industry: Industrial
- Features: Molding Resin, Specialty / Other
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Supplier: Polyplastics USA, Inc.
Description: component surface mount technologies. • Ionic impurities are low, and application is possible in applications where strict electrical properties are demanded. • Little change in volume resistivity is shown over time, and there is almost no change in dielectric constant due to frequency
- Deflection Temperature (@ 264 psi, 1.8 MPa): 518 F
- Coeff. of Thermal Expansion (CTE): 5.555555555555555 to 16.666666666666668 µin/in-F
- Tensile Strength (Break): 22,480.7101003655 psi
- Elongation: 1.2 %
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Supplier: ASTM International
Description: conditioning; zero strength time; test conditions; deformation under load; melting point; dissipation factor and dielectric constant; and specific gravity.
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More Information Top
Indicates content that may require registration and/or purchase.
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Embedded passives in organic substrate for RF module and assembly characterization
Our goal is to measure various molding compound dielectric constant (Dk) and loss tangent (DF) properties to arrive at best material consistent with other attributes (MSL reliability).
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Characterization of transfer molding effects on RF performance of power amplifier module
Our goal is to measure various molding compound dielectric constant (Dk) and loss tangent (DF) properties to arrive at hest material consistent with other attributes (MSL reliability).
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The package bandwidth limitation of high speed broadband products
The wires were surrounded by mold compound having dielectric constant 4.2.
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An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components
…to moisture altering the dielectric constant of the plastic, and thereby changing the stray capacitance introduced by the plastic and the leadframe, was eliminated by a subsidiary experiment in which the dielectric constant of the moulding compound was monitored as a…
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Electrical modeling of quad flat no-lead packages for high-frequency IC applications
The dielectric constant of the molding compound is 3.7.
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Lead-on-chip technology for high performance packaging
This number also assumed aworst case relative dielectric constant for the mold compound at 5.0.
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High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications
The improvement of the self-resonance frequency is a result of the reduced turn-to-turn coupling capacitance enabled by the smaller dielectric constant of the molding compound .
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Bandwidth and gain enhancement of antenna in package
Both are surrounded by a mold compound with a dielectric constant of εr,mold=3.2.
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Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications
A mold compound with a dielectric constant .
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A comparison of electrical performance between a wire bonded and a flip chip CSP package
surrounded by mold compound with a dielectric constant of .