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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 2M2M is Dimethoxydimethylsil ane of high purity. Special features high purity low metal content low chloride content low methanol content Application SEMICOSIL® 2M2M was developed for the semiconductor industry, e.g. as precursor for low dielectric constant interlayer
- Chemical / Polymer System Type: Specialty / Other
- Industry: Industrial
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Supplier: ASTM International
Description: This specification covers the basic properties of thermoset molding plastic compounds and the test methods used to establish the properties. The plastic compounds shall be a resin, cellulose-filled or mineral/glass-filled phenolic, melamine, polyester, diallyl iso-phthalate,
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Supplier: Polyplastics USA, Inc.
Description: dielectric constant due to frequency or temperature. These characteristics make it an excellent insulative material. • Weld strength is high, and superior secondary processability (screws, insertion, etc.) is exhibited.
- Chemical / Polymer System Type: Polysulphide
- Coeff. of Thermal Expansion (CTE): 11.11 to 22.22 µin/in-F
- Deflection Temperature (@ 264 psi, 1.8 MPa): 500 F
- Dielectric Constant: 4
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Supplier: ASTM International
Description: , 2, 3, and 0; Grades 1, 2, and 0; and Grades 1, 2, and 0; respectively. The molding or extrusion material shall be of uniform composition and so compounded as to conform to the requirements of this classification system. The properties shall be determined in accordance with the
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Whether you are looking for Constant Wattage (stable resistance over a wide temperature range), or desire Self-Regulating behavior (change with temp), Cri-plastMP Electrically Conductive Compounds are formulated to meet your static dissipative/conductive, ATEX requirements in multiple (read more)
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closed-cell polyurethane foam does not absorb water, ensuring signal performance. Standard densities are available in 3, 4 and 6 pounds per cubic foot, and other densities can be provided to meet specific dielectric constant and loss tangent requirements. These foams’ electrical properties have (read more)
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compounds allow for 800V+, higher PDIV, flexibility and lower dielectric constant. Follow us on: (read more)
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production of the finished product. Our Ability Fluoropolymer parts molding and machining(PTFE, M-PTFE, PTFE Compound, PCTFE, PVDF, etc). Fluoropolymer semi-finished product extrusion, compression molding (read more)
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stable at a wide range of frequencies and temperatures. While available densities range from 3 to 40 pounds per cubic foot, densities and formulations can be tailored to a customer’s needs and specific dielectric constant and loss tangent requirements. LAST-A-FOAM® (read more)
Browse Foams and Foam Materials Datasheets for General Plastics Manufacturing Co. -
friction with long flex life Very low dielectric constant and dissipation factor Supports demanding fluid control and electrical insulation applications (read more)
Browse Fabricated Plastic Parts and Semi-Finished Shapes Datasheets for Shenzhen Dechengwang Technology Co., Ltd -
Non-flammability Chemically resistant – all normal solvents, acids, and bases Excellent weatherability Low dielectric constant and low dissipation factor Excellent insulating properties Low dynamic coefficient of friction Non (read more)
Browse Fabricated Plastic Parts and Semi-Finished Shapes Datasheets for Shenzhen Dechengwang Technology Co., Ltd -
properties. We provide precision machined and molded PTFE solutions: Enhanced Material Options: Standard PTFE or compounds with (read more)
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PTFE Insulation Components are designed for applications requiring outstanding electrical insulation, thermal resistance, and long-term reliability. With superior dielectric properties, particularly at radar and microwave frequencies, PTFE is widely used as a (read more)
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of the finished product. Our Ability: Fluoropolymer parts molding and machining(PTFE, M-PTFE, PTFE Compound, PCTFE, PVDF, etc (read more)
Browse CNC Machining Services Datasheets for Shenzhen Dechengwang Technology Co., Ltd
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Indicates content that may require registration and/or purchase.
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Embedded passives in organic substrate for RF module and assembly characterization
Our goal is to measure various molding compound dielectric constant (Dk) and loss tangent (DF) properties to arrive at best material consistent with other attributes (MSL reliability).
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Characterization of transfer molding effects on RF performance of power amplifier module
Our goal is to measure various molding compound dielectric constant (Dk) and loss tangent (DF) properties to arrive at hest material consistent with other attributes (MSL reliability).
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The package bandwidth limitation of high speed broadband products
The wires were surrounded by mold compound having dielectric constant 4.2.
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An Appraisal of High Temperature Humidity Stress Tests for Assessing Plastic Encapsulated Semiconductor Components
…to moisture altering the dielectric constant of the plastic, and thereby changing the stray capacitance introduced by the plastic and the leadframe, was eliminated by a subsidiary experiment in which the dielectric constant of the moulding compound was monitored as a…
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Electrical modeling of quad flat no-lead packages for high-frequency IC applications
The dielectric constant of the molding compound is 3.7.
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Lead-on-chip technology for high performance packaging
This number also assumed aworst case relative dielectric constant for the mold compound at 5.0.
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High-performance large-inductance embedded inductors in thin array plastic packaging (TAPP) for RF system-in-package applications
The improvement of the self-resonance frequency is a result of the reduced turn-to-turn coupling capacitance enabled by the smaller dielectric constant of the molding compound .
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Bandwidth and gain enhancement of antenna in package
Both are surrounded by a mold compound with a dielectric constant of εr,mold=3.2.
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Evaluation of wirebond and flip-chip interconnects of a leadless plastic package for RF applications
A mold compound with a dielectric constant .
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A comparison of electrical performance between a wire bonded and a flip chip CSP package
surrounded by mold compound with a dielectric constant of .