Products & Services
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Supplier: RS Components, Ltd.
Description: This pen is filled with an etch resist ink and simplifies the marking of clad boards. Allow ink to dry for 15 min. After etching, the ink may be removed with Cleaning Fluid or PCB scrub block Type = Etch Resist Ink Pen
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Supplier: Ushio America, Inc.
Description: This ultraviolet irradiation device is used for photoresist curing in LSI manufacturing lines. Equipped with a super high-pressure UV lamp and an excimer lamp, this system is used for various applications such as enhancing plasma resistance during dry etching, photoresist outgassing
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Supplier: Nilfisk Industrial Vacuums
Description: Designed for the unique cleaning requirements of the semiconductor industry, the Nilfisk SS Vapor Industrial Vacuum captures toxic gases such as arsine, phosphine, and chlorinated solvents released during the cleaning of process equipment such as molecular beam epitaxy chambers, ion
- Airflow: 87 SCFM
- Applications: Cleanroom, General Cleaning, Toxic Media
- Capacity: 3.25 gallons
- Features: HEPA / ULPA Filter
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Supplier: Impreglon, Inc.
Description: most metals, alloys and metallic compounds, and to a wide range of substrate materials. Two of the most common PVD methods are "Sputtering" and "Cathodic Arc Deposition." Impreglon provides both sputtered and arc deposited films. Accessory Equipment: Cleaning Line Complimenting our
- Functional / Performance: Abrasion Resistant, Antireflective, Chemical Resistant, Conductive, Corrosion / Rust Preventive, Friction Reducing / Low Friction, Heat Resistant / High Temperature, Mold Release / Nonstick, Oil & Grease Resistant, Reflective, Protective, Waterproof / Water Repellant, Wear / Erosion Resistant
- Hard Coating / Treatment: Yes
- Industry: Aerospace, Automotive, Electronics, Energy / Utilities, Food & Beverage, Government, Machine Tools, Medical / Healthcare, OEM / Industrial
- Material / Substrate Capabilities: Aluminum, Ceramic, Copper / Copper Alloys, Metal, Nickel / Nickel Alloys, Precious Metals, Stainless Steel, Steel / Steel Alloys, Titanium
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Supplier: FX PCB Co., Ltd.
Description: Different kinds of LED and Lamps 2. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, pre-amplifiers, power amplifiers, etc. 3. Power supply: Switching regulators, DC/AC converters, SW regulators, etc. 4. Communication electronic equipment: The
- Materials of Construction: Aluminum Foil / Cladding, Copper Foil / Cladding, Specialty / Other
- Thickness: 0.0197 to 0.1969 inches
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Supplier: FX PCB Co., Ltd.
Description: over before developing. Acid/Alkaline Etching The goal is to keep the necessary amount of electricity in while removing any excess. As a result, you will etch, strip, dry, and then check the board. You must always pay attention to the circuit width and space when acid
- Location: United States Only, East Asia / Pacific Only
- Supplier Capability: PCB Assembly
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Processes As layer counts increase, innerlayers become thinner and more flexible. Scrubbing techniques such as brushing or pumice blasting can stretch the layer. Aggressive mechanical systems create scratches in the surface that lead to dry film lifting and open circuits after etching. As a (read more)
Browse Cleaning Agents and Surface Treatments Datasheets for MacDermid Alpha Electronics Solutions -
particle contamination. Its low erosion rate reduces process tool cost of ownership. Perlast G65HP is ideal for use in wet and dry semiconductor processes including: Plasma Etching Ash/Resist Stripping LPCVD, HDPCVD, PECVD, SACVD, ALD Cleaning PVD Perlast G65HP can be molded into O-rings, seals, NW/KF fittings and custom components to suit any application. (read more)
Browse Rubber and Elastomer Molding Services Datasheets for Precision Polymer Engineering Ltd. -
It has great advantages to use silicon carbide as the material of precision structural parts for IC key equipment such as lithography machine. However, traditional ceramic preparation processes such as grouting and dry pressing are difficult to achieve the preparation of complex components such (read more)
Browse Silicon Carbide and Silicon Carbide Ceramics Datasheets for 3X Ceramic Parts Company Limited -
are key to reducing process contamination, significantly increasing yield and reducing operational downtime. Perlast® Helios G7HA has been developed for use in wet and dry semiconductor processes, including etching, stripping and cleaning. The new material is expected to be moulded into (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd. -
resistance to aggressive oxygen, chlorine and fluorine-based plasmas. Together with outstanding thermal and mechanical resistance qualities and similarly low particle generation to Perlast® G65HP, Perlast® G67G is ideally suited to wet and dry etching, stripping, cleaning and PVD processes. (read more)
Browse O-rings Datasheets for Precision Polymer Engineering Ltd.
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Fabrication of GaAs Devices
Fabrication of GaAs Devices. Focusing on all aspects of GaAs processing that deal with GaAs free surfaces and interfaces between GaAs and metal contacts or dielectrics, this detailed text offers pragmatic advice on cleaning and passivation, wet and dry etching and photolithography.
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
technology. Mitsubishi preps electrochemical etching process Mitsubishi Electric Corp. has developed a single-step, hydrofluoric acid electrochemical etching process that can achieve an aspect ratio greater than 60:1 at potentially a tenth of the cost of conventional deep dry etching. Mentor overhauls
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Lasers in manufacturing and packaging
is one of many laser capabilities. Source: Epilog Laser. The marking of metal parts is common in the manufacturing realm. There, it has traditionally been accomplished through chemical etching - an involved process requiring an investment of time and resources. Generally, there are five steps
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Dry Etching Technology for Semiconductors
55 4 Dry Etching Equipment .........................................................................
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Concurrent engineering and the underlying structure of the design problem
This study looks at the development of three products (room air conditioners, cellular phones, and dry etching equipment ) to evaluate how well three contingency models characterize the underlying structure of the design problem and thus predict the operationalization of concurrent engineering.
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34.1: Advanced Four‐Mask Process Architecture for the a‐Si TFT Array Manufacturing Method
Moreover, this all-in-one dry etching process is totally compatible with current dry etching equipment and process condition because total amount of dry-etched Mo alloy in TFT channel is relatively negligible to that of data bus-line etching step.
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http://dspace.mit.edu/bitstream/handle/1721.1/46118/39134645-MIT.pdf?sequence=2
dry etching equipment and chemistries to provide the background for the choice of the .
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Study of Potential Cost Reductions Resulting from Super-Large-Scale Manufacturing of PV Modules: Final Subcontract Report, 7 August 2003--30 September 2004
Included below is a table showing the improvement in dry etch equipment as the display industry has progressed.
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http://repository.kulib.kyoto-u.ac.jp/dspace/bitstream/2433/126817/2/D_Oba_Masatoshi.pdf
In order to realize a dry etching technology of high-aspect ratio products, not only the performance of dry etching equipment but the following technologies are required.
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Low cost polymer MEMS mirrors fabricated by photolithography and wet etching processes
In the former type mirror, the mirror device was fabricated without expensive dry etching equipment such as RIE, and the device can be fabricated only by the sputtering, photolithography and wet etching processes.
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Improvement in ability of wafer-formed cleaning material "Cleaning Wafer" to remove small particles
In this paper, we report on design of cleaning layer in CLEANING WAFER and the effect of CLEANING WAFER application to the dry etching equipment .
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Advanced Ceramic Technologies & Products
Ceramic electro- static chucks were commercialized in the 1990s for use as stages in dry etching equipment such as high density plasma– chemical vapor deposition (HDP–CVD) (Note 17.14) equip- ment and physical vapor deposition (PVD) (Note 17.15) equipment.
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Federal Register > Friday, July 15, 2005 > [70 FR 41094] December 2004 Wassenaar Arrangement Plenary Agreement Implementation: Categories 1, 2, 3, 4, 5 Part I ...
(a) Revising the dimensions parameter for anisotropic plasma dry etching equipment with cassette-to-cassette operation and load-locks from "0.3 μm or less" to 180 nm or less" in 3B001.c.1.a; .