Electroless Nickel Immersion Gold Plating

Description: TechniPad ENEPIG provides a very stable true electroless palladium for gold wire bonding capability and better wear resistance for multiple contacts.

• Chemical / Process: Gold Plating, Nickel Plating - Hard, Other
• Electroless: Yes

Description: ENIG process designed for Pb-free reflow temperatures. Excellent solder joint strength. Equiaxal nickel grain structure.

• Chemical / Process: Gold Plating, Nickel Plating - Hard

Description: Specification for Electroless Nickel/Electroless Palladium Immersion Gold (ENEPIG) Plating for Printed Boards

Description: Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards

Description: Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Circuit Boards

Description: Performance Specification for Electroless Nickel/Immersion Gold (ENIG) Plating for Printed Boards

Description: Replenishable PGC based immersion gold chemistry. It will deposit 2-4 microinches of gold on electroless nickel in 10 minutes. Techni IM Gold AT 6000 has a high tolerance for metallic contamination, yielding a longer bath life which lowers operating cost.

• Chemical / Process: Gold Plating

Description: Immersion gold electrolyte for ENIG Gobright® TLA-77 is a special neutral immersion gold electrolyte. It is suitable for ENIG plating on PCB and ceramic substrates. The gold concentration in the electrolyte is just 0.4 g/l. This means a dramatically cost

Description: , both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: 1/2-hard Brass 360 per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] min. Au per MIL-G-45204 over 100µ [2.54µ] Ni per SAE AMS-QQ-N-290B OPERATING TEMPERATURE: 221°F [105°C] max. MOUNTING

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 2.54 mm
• Military Standards: Other
• Mounting: Through-hole

Description: consigned ICs, consult factory GENERAL SPECIFICATIONS ADAPTER BODY: 0.062 [1.58] thick FR-406 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 2.54 mm
• Current Rating: 1 amps
• Mounting: Through-hole

Description: Electroless nickel - immersion gold Electroless nickel – immersion gold (ENIG) is a flat, solderable, metallic finish on printed circuit boards and ceramic substrates. It serves to protect the copper from oxidation and ensures solderability and

Description: Immersion silver and semi-autocatalytic gold plating Umicores´ silver and gold plating process (ISIG) provides customers a high performance nickel-free coating which meets most of the common assembly requirements like multiple solderability and bondability

Description: SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides finished with ENIG (Immersion Au over electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ [0.25µ] Au per MIL

• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 0.4000 to 0.6000 mm
• Military Standards: Other
• Mounting: Through-hole

Description: GENERAL SPECIFICATIONS BOARD MATERIAL: 0.062 [1.58] thick FR-4 or IS410 per IPC 4101C/26 with 1-oz. Cu traces, both sides PADS: finished with ENIG (Immersion Au over Electroless Ni) PINS: Brass 360 1/2-hard per UNS C36000, ASTM B16/B16M PIN PLATING: 10µ

• Contact / Pin Type: Straight Pins
• Contact Plating: Gold Plating, Nickel Plating
• Contacts Pitch: 0.3000 to 0.6000 mm
• Military Standards: Other

Description: Quality industrial plating and metal finishing services including: nickel, chromium, zinc, cadmium, silver, gold and tin. Electroless nickel, black chrome, hard chrome, black nickel. Expertise includes specialized masking operations and selective

• Location: North America, United States Only, Northeast US Only
• Material / Substrate Capabilities: Aluminum, Ceramic, Copper / Copper Alloys, Iron / Cast Iron, Metal, Nickel / Nickel Alloys, Precious Metals, Plastic / Polymer, Stainless Steel, Steel / Steel Alloys, Titanium
• Recoating: Black Oxide, Chemical Finish / Conversion, Dip / Immersion Coating, Dry Lubricant Coating, Phosphate Coating, Plating / Electroplating, Other
• Refinishing / Surface Treatment: Abrasive / Blasting, Anodizing, Buffing / Polishing, Deburring / Deflashing, Electropolishing, Mass Finishing (Tumbling / Vibratory), Oxygen Cleaning, Passivation, Peening, Pickling / Chemical Deburring, Sanding / Grinding

Description: ENIG Series Miniature multipliers featuring Electroless Immersion Nickel Gold (ENIG) plating for improved solderability and ease of installation. Voltage multipliers are AC to DC conversion devices that produce a high potential DC voltage from a lower voltage, AC

• AC Input Voltage (V_p-p): 800 volts
• DC Output Voltage: 2000 volts
• Input Frequency: 10 to 100 kHz
• Number of Stages: 6

Description: challenges of selective plating of printed circuit board features. The TechniPad SMT System incorporates a mid-phosphorous electroless nickel (8–10% w/w) with a replenishable, non-porous immersion gold and a low phosphorus electroless palladium. The