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Help with Plating and Anodizing Equipment specifications:

Process / Technology
           
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   Anodizing       Anodization is an electrolytic process that produces a non-porous fully hydrated aluminum oxide on aluminum parts.  As processed aluminum typically has a partially hydrated aluminum oxide layer with open porosity.  Closing up the porosity seals up the aluminum metal from corrosive surface conditions. 
   Electrochemical Deposition (ECD)       Electrochemical deposition (ECD) equipment is utilized in semiconductor fabrication for the formation copper interconnects. ECD copper deposition is an important step in the damascene process. The vias or trenches are lined with a barrier layer of TiN or other dielectric barrier material.  Next, a seed layer of copper is deposited with PVD and then a thicker copper interconnect layer is formed with electrochemical deposition. 
   Electroless Plating       Electroless plating or autocatalytic deposition uses a chemical plating solution (e.g., electroless nickel) without an applied electrical potential to deposit metal on a surface using an electrochemical reaction. Electroless nickel,  nickel-phosphorous and nickel/boron have many useful corrosion and tribocorrosion applications. Unlike the electrolytic processes, they produce a deposit with completely uniform coverage. In the case of Ni P, deposits around 25 to 50 microns thick with a hardness of about 500Hv is obtained, but thermal ageing at temperatures around 400°C can develop hardness values in excess of 1000Hv. 
   Electroplating       Electroplating process applies a metal electrodeposition, electroplate or metallic coating to the surface of a part or a selective region of part. Electroplating uses an electrolyte, a chemical plating solution (e.g., copper sulfate to produce copper plate) and an applied electrical potential to deposition metal on a surface using an electrochemical reaction. 
   Mechanical Plating       In the mechanical plating process, fine metal particles are cold welded onto a part's surface through the impact energy from glass beads. The glass beads obtain their impact energy from a rotating open-ended oblique barrel.  One advantage of mechanical plating over wet electroplating processes is the development of a coating without the introduction of hydrogen embrittlement. Mechanical plating deposits are slightly porous and have matte surface finish.  
   Specialty / Other       Other unlisted, specialized, or proprietary plating process or technology. 
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   Brush / Selective?       Selective or brush plating processes apply an electroplate coating to a portion of a part's surface using a brush or porous wicking material.  Brush electroplating units consist of portable units, which allow plating and selection plating of components or surfaces too large for a bath electroplating process. Brush electroplating is also useful for small batches or test samples. Parts can also be selectively anodized or mechanically plate using masks to shield the surface from the anodizing bath or mechanical peening media. 
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Application / Industry
           
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   Cleanroom / Critical Processing       Machines used to coat surfaces of critical parts such as wafers, storage discs or other electronic components, biotechnology devices or pharmaceutical equipment parts. The smallest amount of remaining contaminants on the surface can result in a defect causing the scrapping of the products. Equipment designed to deposit coatings for electronic components applications such as printed circuit board (PCB, PWB), flexible circuits, silicon wafers, semiconductors or IC chips, IC packages and reel-to-reel connectors or lead frames.  For example, the equipment may apply a dielectric conformal coating to insulate and protect the PCB or flexible circuit. Other PCB coating equipment can selectively apply conductive metal pastes or solders to form circuitry or aid in forming soldered connections. Thick film and thin film circuits are also formed using coating techniques.  For example, the equipment may apply a photoresist resins as part of the photolithography process.  Spin coaters are typically used to apply photoresist. Dopants (SOG type) and dielectric layers are often applied to wafers using spin coating techniques. Other PCB coating equipment can selectively apply conductive metal pastes or solders to form circuitry or aid in forming soldered connections.  Wafer level metallization and thin film circuits or interconnect are also formed using PVD, CVD and ECD coating techniques. 
   Electrical / Electronic Parts (Connectors, Pins, etc.)       Finishing equipment and process is designed to handle electrical and electronic parts such as connectors, contacts, pins, sockets, lead frames, and electronic packaging components 
   Mechanical Parts (Fasteners, Hardware, etc.)       Finishing equipment and process is designed to handle mechanical parts such as fasteners (Nuts, bolts, screws, pins), stampings, impellers, rotors, bearing parts, pulleys, gears, splines, pump housings, motor enclosures and shafts. 
   Medical Devices       Finishing equipment and process is designed to handle medical devices and parts. 
   Plastic Film / Flexible Circuits       Finishing equipment and process is designed to handle plastic film and flexible circuit materials. 
   Printed Circuit Boards (PCB)       Finishing equipment and process is designed to handle printed circuit boards such through hole plating, via filling and blind via filling. 
   Semiconductor / Wafer       Finishing equipment and process is designed to handle semiconductor wafers and packaged IC chips. 
   Solar / Photovoltaic       Finishing equipment and process is designed to handle solar or photovoltaic materials and components. 
   Solder / Braze Deposition       Finishing equipment and process is designed to handle the deposition of solder materials.  
   Tab / Finger Plating       Finishing equipment and process is designed to handle the plating of tabs, finger contacts or edge connectors on printed circuit boards. 
   Specialty / Other       Other unlisted, specialized, or proprietary application or industry 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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Equipment / System Type
           
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   Automated System       Automated finishing systems provide the sensing, monitoring and control components and systems to perform the finishing operation without extensive operator interventions, manual adjustments and/or material handling. 
   Batch - Barrel / Tumbler       Batch processes are used to process loose parts. Parts are loaded into a barrel, rotary tumbler or tumbler belt for presentation to the plating or anodizing bath.  Different surfaces are exposed to the process chemicals as the parts tumble.  Large parts processed in groups may be damaged through impacts with other parts, so rack systems are typically recommended where the large part is mounted on a hook. 
   Batch - Vibratory / Ultrasonic       Batch processes are used to process loose parts. Parts are loaded into a vibratory barrel or tank for presentation to the plating or anodizing bath. The ultrasonic or vibratory action provide movement of the part so different surfaces are exposed to the process chemicals as the parts jumble around in the bath.  Large parts processed in groups may be damaged through impacts with other parts, so rack systems are typically recommended where the large part is mounted on a hook. 
   Continuous Web - Reel to Reel       Reel to reel or roll to roll plating systems are used to continuous plate or anodize web or sheet materials such as metals and alloys in sheet, foil, tube, wire or strip forms; flexible printed circuit substrate materials; lead frame, connectors, and other flexible substrates in continuous wound form. The reel or roll of material is unwound and fed into the plater or anodizing system. Some system provides options for strip or selective plating portions of the material; e.g., the connectors on a lead frame reel. 
   Hoist / Conveyor System       Conveyor or hoist material handling system.  Chain-on-edge, belt, roller, overhead monorail and power & free conveyors are commonly used to handle and move parts through a coating system. Also, gantry or sidearm hoist system for loading and unloading parts or racks in a finishing system.  Racks are frames for holding and suspending parts in the cleaning, coating or plating process.  The rack prevents delicate parts from contacting or masking each other during the finishing process. 
   Laboratory / Pilot System       Laboratory or pilot scale systems are used to develop plating processes and for very short runs of small components. Laboratory systems can be floor mounted or even smaller benchtop units. Pilot scale systems are typically floor mounted. 
   Portable / Repair Kit       Portable plating kits or repair kits consist of a power supply, brush or selective plating equipment, masking and process chemicals for finishing or refinishing surfaces on large equipment in the field. Touch-up repairs kits are useful when the component is too large to easily move economically or too cumbersome or costly to remove from an assembly or process system (e.g., valves welded in place in piping system). 
   Rack / Hook System       The parts to be plated are hooked onto racks or frames, which keep the part separated and provide a conductive path to the power supply. The alloys used to form the rack 
   Tank / Tank Line       Tanks are used in plating or painting immersion or dip coating processes.  Plastic or metal tanks are utilized depending on the specific process chemistry. 
   Specialty / Other       Other unlisted, specialized, or proprietary equipment or system type. 
   Search Logic:      All products with ANY of the selected attributes will be returned as matches. Leaving all boxes unchecked will not limit the search criteria for this question; products with all attribute options will be returned as matches.
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