Specialty / Other Plating and Anodizing Equipment
from Daitron Co., Ltd.
Using an internally developed method, this system ionizes volatile particles under high vacuum. The smooth fine film quality has been proven in many applications over many years. [See More]
- Process / Technology: Ion Plating
from Daitron Co., Ltd.
Ion Plating equipment of new method which achieves kinds of coating (thick film oxidized film, carbonized film, etc.) with PVD technology, previously only achievable with CVD method. Performs ionization effectively by impact between evaporating particle and thermal electron on evaporation source. [See More]
- Process / Technology: Ion Plating
- Application / Industry: Semiconductor / Wafer; Precision metal mold or parts of semiconductor manufacturing equipment
from Daitron Co., Ltd.
Using an internally developed PIG plasma source, this system can form smooth DLC film at high speed. It is mostly used for surface processing of automotive parts, whose applications are expected to expand in the future. [See More]
- Process / Technology: Penning Ionization Gauge (PIG) plasma source
- Application / Industry: Surface processing of automotive parts
from ECSI Fibrotools
IKo ™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4 ” wafers with just 1 gallon of solution. Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates. [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The Slim version of IKo ™ CLASSIC ™ is designed to fit a fume hood. With the footprint of 17 ″ x 28 ″ it enables fitting up to 3 modules in a fume hood for multiple simultaneous operating sites within a single electroplating Station. The power supply is located in prefered... [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The IKo ™ STATION ™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8 ″ odd shape substrates and wafers. Easily retrofitted to a... [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The original. The IKo ™ CLASSIC ™ is a practical benchtop tool with the smallest footprint for up to 8 ″ wafers on the market. It ’s designed simply to electroplate high-resolution interconnects and fine metallic features on wafers and substrates. Contamination Resistant. [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer