Specialty / Other Plating and Anodizing Equipment
from ECSI Fibrotools
IKo ™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4 ” wafers with just 1 gallon of solution. Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates. [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The Slim version of IKo ™ CLASSIC ™ is designed to fit a fume hood. With the footprint of 17 ″ x 28 ″ it enables fitting up to 3 modules in a fume hood for multiple simultaneous operating sites within a single electroplating Station. The power supply is located in prefered... [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The IKo ™ STATION ™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8 ″ odd shape substrates and wafers. Easily retrofitted to a... [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
from ECSI Fibrotools
The original. The IKo ™ CLASSIC ™ is a practical benchtop tool with the smallest footprint for up to 8 ″ wafers on the market. It ’s designed simply to electroplate high-resolution interconnects and fine metallic features on wafers and substrates. Contamination Resistant. [See More]
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer