Batch - Vibratory / Ultrasonic Plating and Anodizing Equipment
from ECSI Fibrotools
IKo ™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4 ” wafers with just 1 gallon of solution. Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates. [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Basket sizes: 90 mm and 160 mm in diameter. Basket material in PP or PVDF. Manually variable frequency and amplitude controls. Manual transport from bath to bath – using standard feature handle. Maximal cathodic current = 25 Amp. Weight = 12lbs with basket [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic
- Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
- Process / Technology: Electroplating
from Metalor Technologies USA Corporation
Our plating processes are developped in strong partnership with our affiliate Mitomo Semicon Engineering Co., plating equipment manufacturer. This enables us to provide a comprehensive service, including the production of precious metal plating solutions and ancillary products as well as the most... [See More]
- Machinery Type: Barrel, tumbler or tumble belt; Batch - Vibratory / Ultrasonic; Continuous (Web, Reel , Roll); Rack / Hook
- Application / Industry: Electrical / Electronic Parts (Connectors, Pins, etc.); Semiconductor / Wafer; Tab / Finger Plating
- Process / Technology: Electroplating; Electroless
from ECSI Fibrotools
The Slim version of IKo ™ CLASSIC ™ is designed to fit a fume hood. With the footprint of 17 ″ x 28 ″ it enables fitting up to 3 modules in a fume hood for multiple simultaneous operating sites within a single electroplating Station. The power supply is located in prefered... [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Basket sizes: 90mm to 200 mm in diameter. Basket material in PP or PVDF. Transport from bath to bath – the vibration unit has to be fixed with a frame to the customer transport hoist. Can be used in an automatic line or transported with a manual hoist. Maximal cathodic current = 100 Amp. [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic
- Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
- Process / Technology: Electroplating
from ECSI Fibrotools
The IKo ™ STATION ™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8 ″ odd shape substrates and wafers. Easily retrofitted to a... [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
- Application / Industry: Medical Devices; Semiconductor / Wafer
- Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
from Technic, Inc.
Basket sizes: 160 mm to 360 mm in diameter. Basket material in PP or PVDF. Transport from bath to bath – the vibration unit has to be fixed with a frame to the customer transport hoist. Can be used in an automatic line or transported with a manual hoist. Maximal cathodic current = 350 Amp. [See More]
- Machinery Type: Batch - Vibratory / Ultrasonic
- Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
- Process / Technology: Electroplating