Batch - Vibratory / Ultrasonic Plating and Anodizing Equipment

7 Results
Plating Equipment
from Metalor Technologies USA Corporation

Our plating processes are developped in strong partnership with our affiliate Mitomo Semicon Engineering Co., plating equipment manufacturer. This enables us to provide a comprehensive service, including the production of precious metal plating solutions and ancillary products as well as the most... [See More]

  • Machinery Type: Barrel, tumbler or tumble belt; Batch - Vibratory / Ultrasonic; Continuous (Web, Reel , Roll); Rack / Hook
  • Application / Industry: Electrical / Electronic Parts (Connectors, Pins, etc.); Semiconductor / Wafer; Tab / Finger Plating
  • Process / Technology: Electroplating; Electroless
Vibratory Plating Unit -- Vibarrel 100
from Technic, Inc.

Basket sizes: 90 mm and 160 mm in diameter. Basket material in PP or PVDF. Manually variable frequency and amplitude controls. Manual transport from bath to bath – using standard feature handle. Maximal cathodic current = 25 Amp. Weight = 12lbs with basket [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic
  • Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
  • Process / Technology: Electroplating
Benchtop Electroplating Machines -- IKo Jr.
from ECSI Fibrotools

IKo ™ Jr. is a practical benchtop tool with the smallest footprint on the market capable of efficiently electroplating 4 ” wafers with just 1 gallon of solution. Designed for fast electroplating of high-resolution interconnects and fine metallic features on wafers and substrates. [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
  • Application / Industry: Medical Devices; Semiconductor / Wafer
  • Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
Vibratory Plating Unit -- Vibarrel 201
from Technic, Inc.

Basket sizes: 90mm to 200 mm in diameter. Basket material in PP or PVDF. Transport from bath to bath – the vibration unit has to be fixed with a frame to the customer transport hoist. Can be used in an automatic line or transported with a manual hoist. Maximal cathodic current = 100 Amp. [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic
  • Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
  • Process / Technology: Electroplating
Benchtop Electroplating Machines -- IKo Slim
from ECSI Fibrotools

The Slim version of IKo ™ CLASSIC ™ is designed to fit a fume hood. With the footprint of 17 ″ x 28 ″ it enables fitting up to 3 modules in a fume hood for multiple simultaneous operating sites within a single electroplating Station. The power supply is located in prefered... [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
  • Application / Industry: Medical Devices; Semiconductor / Wafer
  • Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)
Vibratory Plating Unit -- Vibarrel 301
from Technic, Inc.

Basket sizes: 160 mm to 360 mm in diameter. Basket material in PP or PVDF. Transport from bath to bath – the vibration unit has to be fixed with a frame to the customer transport hoist. Can be used in an automatic line or transported with a manual hoist. Maximal cathodic current = 350 Amp. [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic
  • Application / Industry: Mechanical Parts (Fasteners, Hardware, etc.)
  • Process / Technology: Electroplating
Benchtop Electroplating Machines -- IKo Station
from ECSI Fibrotools

The IKo ™ STATION ™ is a self-contained, complete plating system for MEMS and NANO fabrication – wafer installation, cleaning, activation, DI rinsing and electroplating – ideal for a wide range, 2 cm2 to 8 ″ odd shape substrates and wafers. Easily retrofitted to a... [See More]

  • Machinery Type: Batch - Vibratory / Ultrasonic; Laboratory / Pilot System
  • Application / Industry: Medical Devices; Semiconductor / Wafer
  • Process / Technology: Electroplating; Electrochemical Depostion (ECD); Nano Wire (NW), Seedless Electroplating (SL), Magnetic field (MG)