-
Description: Cuming Microwave manufactures a range of epoxy and silicone-based rigid and castable absorbers, loaded with high magnetic loss carbonyl iron and ferrite fillers. The proper filler and loading level can produce a very lossy material in UHF, microwave or millimeter wave frequencies. Unlike
- Chemical / Polymer System Type: Epoxy, Silicone
- Compound Type: Casting Resin
- Features: EMI / RFI Shielding
- Material Type / Grade: Thermoset
-
Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 28.33 to 99.44 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.46
-
Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 8.89 to 37.78 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.9
-
-
Supplier: Epoxy Technology
Description: , telescope, spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.? More recently, solar cells require our UV
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 23.89 to 128 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.21
-
Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 33.89 to 106 µin/in-F
- Compound Type: Casting Resin
- Features: Biocompatible, Optical Grade
-
Supplier: Norplex-Micarta
Description: NP130B pre-preg is a combination of a woven glass fabric combined with a flame retardant epoxy resin system. It can be molded into a composite with all of the excellent physical and electrical properties of NEMA Grade FR-4, in the sheet form. NP130B is an electrical and mechanical pre-preg
- Chemical / Polymer System Type: Epoxy
- Compound Type: Molding Resin
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
-
Supplier: Georgia-Pacific Chemicals LLC
Description: GP® 7565 resin is used as a crosslinker for hydroxyl containing polymers such as epoxies, polyesters, vinyls and acrylics. GP 7565 resin provides outstanding chemical resistance. It can be emulsified into water-based epoxy resins. It is used where light colored coatings are
- Chemical / Polymer System Type: Epoxy, Phenolics (Melamine, Furan)
- Filler Material: Unfilled
- Industry: Industrial
- Material Type / Grade: Thermoset
-
Supplier: Norplex-Micarta
Description: NP510AB pre-preg is composed of woven glass fabric impregnated with a brominated epoxy resin (Tg = 130°C). It is designed to provide electrical insulation in high humidity environments. This pre-preg product offers consistent quality and good electrical properties. With proper cure
- Chemical / Polymer System Type: Epoxy
- Compound Type: Molding Resin
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
-
Supplier: Norplex-Micarta
Description: NP114B pre-preg is composed of an electrical grade of epoxy resin (Tg = 175°C) combined with an aramid paper substrate. This grade of pre-preg does not use halogen flame retardants to obtain its flame retardant characteristics. This is essential since it cannot contain bromine in its primary
- Chemical / Polymer System Type: Epoxy
- Compound Type: Molding Resin
- Filler Material: Aramid Fiber
- Material Type / Grade: Thermoset
-
Supplier: Norplex-Micarta
Description: NP511B pre-preg is composed of a high temperature electrical grade of epoxy resin (Tg = 170°C) combined with a woven glass substrate. This grade of pre-preg is not flame retardant. With a non-brominated resin system, the product offers high mechanical strength at temperatures up to
- Chemical / Polymer System Type: Epoxy
- Compound Type: Molding Resin
- Filler Material: Fiber Glass
- Material Type / Grade: Thermoset
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LTE is a recently developed epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, coating, sealing and casting. This new two component epoxy resin compound cures readily
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 19 to 22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.1
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 4.1
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30F is a new fast curing liquid epoxy resin compound for high perform-ance abrasion and chemical resistant seamless floors. This easy-to-use two component epoxy resin system offers a uniquely attractive combination of application and performance
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 12 µin/in-F
- Compound Type: Casting Resin
- Deflection Temperature (@ 264 psi, 1.8 MPa): 212 F
-
Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 27.78 to 94.44 µin/in-F
- Compound Type: Casting Resin
- Elongation: 5 %
-
Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30FL is a low viscosity, flexibilized, two component epoxy resin system for high performance potting, casting, encapsulation as well as bonding and sealing. It is formulated to cure at room temperature or more rapidly at elevated temperatures, with a four
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 12 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: 3.83
-
Supplier: ELANTAS North America LLC
Description: wire enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 41.67 to 139 µin/in-F
- Compound Type: Casting Resin
- Dielectric Constant: Up to 5.1
-
Supplier: ELANTAS North America LLC
Description: even the toughest requirements of the high-voltage rotating machine industry. ELAN-Volt® product series includes following chemistries: • Catalyzed epoxy • Anhydride cured epoxy • Monomer-based unsaturated polyester and polyesterimide • Nonvolatile unsaturated polyester and
- Chemical / Polymer System Type: Epoxy, Polyester (PET, PBT), Polyetherimide
- Industry: Aerospace, Electric Power
- Material Type / Grade: Thermoplastic
-
Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most
- Chemical / Polymer System Type: Epoxy
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Compound Type: Casting Resin
- Features: Thermally Conductive
-
Supplier: GS Polymers, Inc.
Description: Two part economical casting system
- Chemical / Polymer System Type: Epoxy
- Filler Material: Mineral
- Industry: Industrial
- Material Type / Grade: Thermoset
Find Suppliers by Category Top
Featured Products Top
-
sizes. Qualtek’s heat shrink tubing products are produced by cross-linking extruded polymer compounds which produces a shape memory effect and when heated can be recovered to its original shape. Some features of our heat shrink products include: Wide range of sizes (read more)
Browse Shrink Tubing Datasheets for Qualtek Electronics Corp. -
Reinforcement Kink Resistance Variable Flexibility Improved Hoop (Crush) Strength Increased Column Strength Improve Tensile Strength Improved Torque Response Withstand High Pressure Add Shape Memory (read more)
Browse Medical Tubing Datasheets for New England Tubing Technologies -
(MIL) specification shrink tubing with varying ratios, colors and sizes. Qualtek’s heat shrink tubing products are produced by cross-linking extruded polymer compounds which produces a shape memory effect and when heated can be recovered to its original shape. Some features of (read more)
Browse Shrink Tubing Datasheets for Qualtek Electronics Corp. -
materials including acrylates, methacrylates, epoxies, polyesters, nylon, ABS and other resin compounds. Easy dispersion within a polymer matrix. Prevention of soft polymer blocking in powder fusion processes. Active chemical surface facilitating strong chemical bonding (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc. -
polytetrafluoroethylene (PTFE) is sufficient for common analytes or if stainless steel or specialized polymers are needed for more reactive compounds. Researchers must also define if their work requires ultra-low levels, broader ranges, or flexible switching, since these needs will shape the system design (read more)
Browse Permeation Instruments Datasheets for Environics, Inc.
More Information Top
Indicates content that may require registration and/or purchase.
-
Applied Mechanics and Mechatronics Automation
Tailoring of Thermal Transition Temperature and Toughening of Shape Memory Epoxy Polymer H. Deng, J.P. Gao, X.F.
-
Shape memory polymers from benzoxazine-modified epoxy
[12] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperature of epoxy shape memory polymers Polymer 50 1852–6 [13] Prima D, Lesniewski M, Gall K, McDowell D L, Sanderson T and Campbell D 2007 Thermo-mechanical behavior of …
-
Synthesis and characterization of shape memory epoxy-anhydride system
2009) Facile tailoring of thermal transition temperatures of epoxy shape memory polymers .
-
http://repositories.lib.utexas.edu/bitstream/handle/2152/19972/sunday_report_20129.pdf?sequence=1
Chemistry Most epoxy shape memory polymer systems are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic- hydrogen which is reacted with at least one multifunctional cross linking reagent which contains at least three …
-
Shape memory polymers and their composites in aerospace applications: a review
17 39–52 [72] Hu J L 2007 Shape Memory Polymers and Textiles (Cambridge: Woodhead) [73] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 [74] Rousseau I A and Xie …
-
Thermomechanical and shape-memory properties of epoxy-based shape-memory polymer using diglycidyl ether of ethoxylated bisphenol-A
… R J J 2011 Shape memory epoxies based on networks with chemical and physical crosslinks Eur. Polym. J. 47 362–9 [5] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 .
-
The effects of carbon nanotubes on electroactive shape-memory behaviors of hydro-epoxy/carbon black composite
Syst. Struct. 21 677–83 [15] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 [16] Leng S J, Lan X, Liu Y J and Du S Y 2009 Electroactive thermoset …
-
Characterization of shape memory behaviour of CTBN-epoxy resin system
In the present work, 0, 5, 10 and 15 % CTBN-modified epoxy shape memory polymers were prepared and their shape memory performance was evaluated.
-
Thermo-mechanical property of shape memory polymer/carbon fibre composites
T. Xie and I. A. Rousseau: ‘Facile tailoring of thermal transition temperatures of epoxy shape memory polymers ’, Polymer, 2009, 50, 1852–1856.
-
Modeling attempt of shape memory performance of epoxy resin with experimental methods
Xie et al. [5] synthesized epoxy shape memory polymer (SMP) by either reducing the cross-link density or introducing flexible aliphatic epoxy chains to precisely tune the Tg of these polymers ranging from room temper- ature to 89 °C in order to …