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Supplier: ELANTAS North America LLC
Description: the high-voltage rotating machine industry. ELAN-Volt® product series includes following chemistries: • Catalyzed epoxy • Anhydride cured epoxy • Monomer-based unsaturated polyester and polyesterimide • Nonvolatile unsaturated polyester and polyesterimide • Hybrid resin technology
- Industry: Aerospace, Electric Power
- Chemical System: Epoxy, Polyester (PET, PBT), Polyetherimide
- Type: Thermoplastic
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100%
- Use Temperature: -60 to 300 F
- Coeff. of Thermal Expansion (CTE): 16 µin/in-F
- Tensile Strength (Break): 8,000 psi
- Tensile Modulus: 450 ksi
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Supplier: Master Bond, Inc.
Description: Key Features Free flowing viscosity High temperature resistance Exceptionally long open time Passes NASA low outgassing Product Description Master Bond Supreme 121AO is a thermally conductive epoxy for bonding, sealing and encapsulation. The mix ratio is 100:80 by weight. This system has a
- Use Temperature: -80 to 550 F
- Thermal Conductivity: 0.5769116 to 0.7211395 W/m-K
- Viscosity: 10,000 to 25,000 cP
- Industry: Aerospace, Electric Power, Electronics, Industrial, Optoelectronics, Semiconductor / IC's
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Supplier: Master Bond, Inc.
Description: Master Bond EP21LSCL-1 is a two component, low viscosity epoxy resin system featuring superb optical clarity as well as outstanding non-yellowing properties. This system has a forgiving mix ratio of 100 to 60 by weight. It will cure readily at 75°F in 3-5 days or 3-4 hours at 150-200°F. The
- Deflection Temperature (@ 264 psi, 1.8 MPa): 180 F
- Thermal Conductivity: 0.288 to 0.432 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 to 33 µin/in-F
- Tensile Strength (Break): 7,600 psi
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 356 F
- Thermal Conductivity: 0.95 to 1.05 W/m-K
- Coeff. of Thermal Expansion (CTE): 25 to 86.11111111111111 µin/in-F
- Tensile Strength (Break): 4,600 psi
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30M3LV is a low viscosity, two component epoxy compound for high performance, chemical resistant casting and potting applications, formulated to cure at ambient temperatures or more rapidly at elevated temperatures, with a convenient two (2) to one (1) mix
- Use Temperature: -60 to 250 F
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Tensile Strength (Break): 10,000 psi
- Tensile Modulus: 440 to 460 ksi
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Supplier: ELANTAS North America LLC
Description: enamel, impregnating resins, potting compounds, casting resins, conformal coatings, adhesives, and specialty epoxy products used in hi-temp applications used for a number of electrical, industrial, automotive, aerospace and civil applications.
- Use Temperature: 311 F
- Thermal Conductivity: 0.3 to 0.35 W/m-K
- Coeff. of Thermal Expansion (CTE): 41.666666666666664 to 138.88888888888889 µin/in-F
- Tensile Strength (Break): 2,900 psi
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Description: Cuming Microwave manufactures a range of epoxy and silicone-based rigid and castable absorbers, loaded with high magnetic loss carbonyl iron and ferrite fillers. The proper filler and loading level can produce a very lossy material in UHF, microwave or millimeter wave frequencies. Unlike
- Type: Casting Resin, Thermoset
- Features: EMI / RFI Shielding
- Chemical System: Epoxy, Silicone
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Use Temperature: 572 F
- Coeff. of Thermal Expansion (CTE): 33.888888888888886 to 100 µin/in-F
- Dielectric Constant: 3.8
- Index of Refraction: 1.5318
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Supplier: Epoxy Technology
Description: We have served the optical market since 301 was introduced in 1969. Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,
- Use Temperature: 617 F
- Coeff. of Thermal Expansion (CTE): 23.88888888888889 to 128.33333333333334 µin/in-F
- Dielectric Constant: 3.21
- Light Transmission: 5 to 7 %
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Supplier: Norplex-Micarta
Description: NP511B pre-preg is composed of a high temperature electrical grade of epoxy resin (Tg = 170°C) combined with a woven glass substrate. This grade of pre-preg is not flame retardant. With a non-brominated resin system, the product offers high mechanical strength at temperatures up to 170°C.
- Chemical System: Epoxy
- Filler: Fiber Glass
- Type: Molding Resin, Thermoset
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Supplier: Epoxy Technology
Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,
- Use Temperature: 572 F
- Thermal Conductivity: 0.5 W/m-K
- Coeff. of Thermal Expansion (CTE): 8.88888888888889 to 37.77777777777778 µin/in-F
- Dielectric Constant: 4.9
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market
- Use Temperature: 662 F
- Coeff. of Thermal Expansion (CTE): 32.77777777777778 to 82.77777777777777 µin/in-F
- Index of Refraction: 1.57
- Light Transmission: 95 %
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Supplier: Epoxies Etc...
Description: 70-3810 is a low viscosity, aluminum filled epoxy casting and tooling resin. This system is used for making heat resistant cast tools or parts that require high heat resistance and thermal conductivity. 70-3810 utilizes a new polymer resin that offers better heat resistance than most
- Use Temperature: -103 to 572 F
- Thermal Conductivity: 1.80284875 W/m-K
- Coeff. of Thermal Expansion (CTE): 2.5 µin/in-F
- Tensile Strength (Break): 14,500 psi
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Supplier: GS Polymers, Inc.
Description: No Description Provided
- Chemical System: Epoxy
- Industry: Industrial
- Filler: Mineral
- Type: Thermoset
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Supplier: Georgia-Pacific Chemicals LLC
Description: GP® 7565 resin is used as a crosslinker for hydroxyl containing polymers such as epoxies, polyesters, vinyls and acrylics. GP 7565 resin provides outstanding chemical resistance. It can be emulsified into water-based epoxy resins. It is used where light colored coatings are required
- Viscosity: 2,500 to 4,000 cP
- Chemical System: Epoxy, Phenolics (Melamine, Furan)
- Industry: Industrial
- Form / Shape: Liquid
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sizes. Qualtek’s heat shrink tubing products are produced by cross-linking extruded polymer compounds which produces a shape memory effect and when heated can be recovered to its original shape. Some features of our heat shrink products include: Wide range of sizes (read more)
Browse Shrink Tubing Datasheets for Qualtek Electronics Corp. -
Reinforcement Kink Resistance Variable Flexibility Improved Hoop (Crush) Strength Increased Column Strength Improve Tensile Strength Improved Torque Response Withstand High Pressure Add Shape Memory (read more)
Browse Medical Tubing Datasheets for New England Tubing Technologies -
(MIL) specification shrink tubing with varying ratios, colors and sizes. Qualtek’s heat shrink tubing products are produced by cross-linking extruded polymer compounds which produces a shape memory effect and when heated can be recovered to its original shape. Some features of (read more)
Browse Shrink Tubing Datasheets for Qualtek Electronics Corp. -
materials including acrylates, methacrylates, epoxies, polyesters, nylon, ABS and other resin compounds. Easy dispersion within a polymer matrix. Prevention of soft polymer blocking in powder fusion processes. Active chemical surface facilitating strong chemical bonding (read more)
Browse Silica, Quartz, and Silicate Materials Datasheets for AGC Chemicals Americas, Inc. -
polytetrafluoroethylene (PTFE) is sufficient for common analytes or if stainless steel or specialized polymers are needed for more reactive compounds. Researchers must also define if their work requires ultra-low levels, broader ranges, or flexible switching, since these needs will shape the system design (read more)
Browse Permeation Instruments Datasheets for Environics, Inc.
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Indicates content that may require registration and/or purchase.
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Applied Mechanics and Mechatronics Automation
Tailoring of Thermal Transition Temperature and Toughening of Shape Memory Epoxy Polymer H. Deng, J.P. Gao, X.F.
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Shape memory polymers from benzoxazine-modified epoxy
[12] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperature of epoxy shape memory polymers Polymer 50 1852–6 [13] Prima D, Lesniewski M, Gall K, McDowell D L, Sanderson T and Campbell D 2007 Thermo-mechanical behavior of …
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Synthesis and characterization of shape memory epoxy-anhydride system
2009) Facile tailoring of thermal transition temperatures of epoxy shape memory polymers .
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http://repositories.lib.utexas.edu/bitstream/handle/2152/19972/sunday_report_20129.pdf?sequence=1
Chemistry Most epoxy shape memory polymer systems are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic- hydrogen which is reacted with at least one multifunctional cross linking reagent which contains at least three …
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Shape memory polymers and their composites in aerospace applications: a review
17 39–52 [72] Hu J L 2007 Shape Memory Polymers and Textiles (Cambridge: Woodhead) [73] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 [74] Rousseau I A and Xie …
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Thermomechanical and shape-memory properties of epoxy-based shape-memory polymer using diglycidyl ether of ethoxylated bisphenol-A
… R J J 2011 Shape memory epoxies based on networks with chemical and physical crosslinks Eur. Polym. J. 47 362–9 [5] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 .
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The effects of carbon nanotubes on electroactive shape-memory behaviors of hydro-epoxy/carbon black composite
Syst. Struct. 21 677–83 [15] Xie T and Rousseau I A 2009 Facile tailoring of thermal transition temperatures of epoxy shape memory polymers Polymer 50 1852–6 [16] Leng S J, Lan X, Liu Y J and Du S Y 2009 Electroactive thermoset …
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Characterization of shape memory behaviour of CTBN-epoxy resin system
In the present work, 0, 5, 10 and 15 % CTBN-modified epoxy shape memory polymers were prepared and their shape memory performance was evaluated.
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Thermo-mechanical property of shape memory polymer/carbon fibre composites
T. Xie and I. A. Rousseau: ‘Facile tailoring of thermal transition temperatures of epoxy shape memory polymers ’, Polymer, 2009, 50, 1852–1856.
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Modeling attempt of shape memory performance of epoxy resin with experimental methods
Xie et al. [5] synthesized epoxy shape memory polymer (SMP) by either reducing the cross-link density or introducing flexible aliphatic epoxy chains to precisely tune the Tg of these polymers ranging from room temper- ature to 89 °C in order to …