Products & Services
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Supplier: ACCRAbond, Inc.
Description: CONATHANE® UF-3 is a unique polyurethane foam characterized by low vapor pressure. UF-3 is unaffected by grease, oils, and most solvents. Also, it is ozone resistant, has excellent insulation characteristics, is dimensionally stable and will not rot or mildew.
- Chemical / Polymer System Type: Epoxy (EP)
- Form / Function: Encapsulant / Potting Compound
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Supplier: SAE International
Description: Technical Standard
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Supplier: Epoxies Etc...
Description: 20-2028 is a light weight, two component, closed cell, liquid urethane foaming resin system designed for potting and encapsulating.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Accuris
Description: Potting Compound, Epoxy Bisphenol A-Type Syntactic Foam, Heat Cure
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Supplier: SAE International
Description: This specification covers a glass or silica microsphere-filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
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Supplier: SAE International
Description: Technical Standard
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Supplier: SAE International
Description: This specification covers a glass or silica micosphere-filled epoxy resin formulation, supplied as a two-component system, requiring an oven cure for attainment of maximum properties.
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Supplier: Epoxies Etc...
Description: 20-2024 is a low viscosity, two component, closed cell urethane foam. This is a rigid, non-CFC containing foam. 20-2024 can be used for potting, encapsulating, thermal insulation, flotation devices, sandwich panel cores, etc.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Thermal / Heat Insulating
- Cure Type / Technology: Two Component System
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Supplier: Epoxies Etc...
Description: 20-3036 is a light weight epoxy for potting, casting, and encapsulating electronic components and assemblies. It is formulated in a convenient 2:1 by weight mix ratio.
- Chemical / Polymer System Type: Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Electronics
Description: HYSOL STYCAST EFF15 is a one component epoxy based free flowing syntactic foam powder designed to infiltrate around densely packed components and fill voids in electronic modules. It exhibits low shrinkage during cure so little stress is transmitted. The material self extinguished after an
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: HB Fuller EV Protect 4006 SFR is a two component, polyurethane foam encapsulant that is used for potting and encapsulating battery cells in EV battery modules. It is a flame retardant, low density, and light weight material. It also protects against noise, vibration, and harshness.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 3 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: HB Fuller EV Protect 4006 SFR is a two component, polyurethane foam encapsulant that is used for potting and encapsulating battery cells in EV battery modules. It is a flame retardant, low density, and light weight material. It also protects against noise, vibration, and harshness.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 3 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Ellsworth Adhesives
Description: HB Fuller EV Protect 5006 is a two component, polyurethane foam encapsulant that is used for encapsulating all components within an EV battery module. It is a flame retardant, low viscosity, and ultra-lightweight material. It reduces thermal propagation and offers great vibration and impact
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Dielectric Strength: 50.8 kV/in
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 0.0300 W/m-K
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Supplier: Ellsworth Adhesives
Description: HB Fuller EV Protect 5006 is a two component, polyurethane foam encapsulant that is used for encapsulating all components within an EV battery module. It is a flame retardant, low viscosity, and ultra-lightweight material. It reduces thermal propagation and offers great vibration and impact
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Dielectric Strength: 50.8 kV/in
- Form / Function: Encapsulant / Potting Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 4640, Silicone, Flexible, Potting or Encapsulant LOCTITE® STYCAST 4640 RTV condensation cure silicone rubber syntactic foam is engineered to yield a flexible, low density material with a low dielectric constant and dissipation factor. It is designed for airborne
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 200 psi
- Use Temperature: 85 to 500 F
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Supplier: Wacker Chemical Corp.
Description: outstanding resistance to casting resins, particularly polyurethanes Application encapsulation of electrical and electronic components making flexible molds for reproducing models with no or only minor undercuts in all common reproduction materials release coat for rigid molds for the casting or
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Elongation: 130 %
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Supplier: Beacon Adhesives, Inc.
Description: /B - Potting Compound - Equal-Mix Epoxy Adhesive Note: Fully cured panels consisting of degreased steel or etched aluminum skins and foamed glass cores produced with this adhesive pass FPL Test Cycles (ASTM Test D1037-55T), also given in ASTM C481, Cycle A.
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Supplier: ASTM International
Description: to produce the data necessary to support mathematical models used for the prediction of molecular contaminant generation, migration, and deposition. 1.4 All types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams,
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Supplier: ASTM International
Description: , the tolerance on 25 and 125°C is ±1°C and on 23°C is ±2°C. The tolerance on relative humidity is ±5 %. 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes
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Supplier: ASTM International
Description: tolerance on relative humidity is 5 %. <> 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink tubings, adhesives, coatings, fabrics, tie cords, and lubricants.
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Supplier: ASTM International
Description: 125°C is ± 1°C and on 23°C is ± 2°C. The tolerance on relative humidity is ± 5%. 1.3 Many types of organic, polymeric, and inorganic materials can be tested. These include polymer potting compounds, foams, elastomers, films, tapes, insulations, shrink tubings
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In the transportation sector, designing lighter weight components has widely become a key trend especially to reduce energy consumption and maximize the range of electric vehicles. CHT’s advanced Silicone Foam is designed to reduce weight – as well as mitigate thermal (read more)
Browse Encapsulants and Potting Compounds Datasheets for CHT USA Inc.
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Polyurethane: "Customized Plastic"
PU Potting Compounds: Vacuum Processing Provides Optimum Results - Polyurethanes have an extremely wide and flexibly modifiable range of properties. This makes them a popular and frequently used group of materials in industrial production. PU potting compounds can be processed easily and feature
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Dielectric Materials for Use in Radomes
low dielectric constants, useful in radio and microwave frequencies. This makes them ideal for applications such as in conformal antennas, where the material must be applied around a radius. Microelectronics - Non-foamed polyurethanes are often used as "potting compounds" in electronics, where
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Indicates content that may require registration and/or purchase.
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Handbook on dynamics of jointed structures.
The circuit boards are intrinsically rugged partly because of the foam potting compound supporting them.
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Drying oils
Plasticizers, adhesives, foams , potting compounds , and molding materials also can be made in this fashion.
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Modelling the thermal conductivity of epoxy nanocomposites with low filler concentrations
It is used for industrial castings, surface coatings, high strength adhesives, durable laminates, cold casters, lightweight foam and potting compounds for a variety of electrical and electronic apparatuses [1].
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Modeling of spacecraft contamination outgassing as a diffusion controlled process
A list of such materials would include paints, coatings, adhesives, tapes, plastics, elastomers, potting compounds , foams , fabrics, films, honeycomb structures, multilayer insulation, etc.
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CR4 - Thread: Chemically Resistant polyurethane
Is the, "chemically resitant polyurethane" a coating/ potting compound / foam /mechanical part?
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Characterization and control of organic airborne contamination in lithographic processing
Outgassing from HEPA filter potting compounds , foams , sealants; flame retardants, plasticizers .
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Triaxial Load Cells for Monitoring Overhead Transmission Lines
A foam -type potting compound is used to completely seal the internal parts after assembly.