Food Grade Epoxy Adhesives

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy

• Viscosity: 700 to 1,200 cP
• Use Temperature: 527 F
• Coeff. of Thermal Expansion (CTE): 31.666666666666664 to 82.77777777777777 µin/in-F
• Transmission: 1 %

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy

• Viscosity: 11,000 to 20,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 30 to 89.44444444444444 µin/in-F
• Substrate Compatibility: Ceramic / Glass

Description: spectrometer and fiber-optic circuitry. Additionally, they ruggedize and toughen LCD touch panels as the transparent adhesive for plastic lamination. Through liquid injection molding, our optical epoxies form the plastic cap over LEDs.  More recently, solar cells require our UV curing resin

• Viscosity: 3,000 to 5,000 cP
• Use Temperature: 572 F
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 106.66666666666666 µin/in-F
• Dielectric Constant (Relative Permittivity): 3.34

Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries.  Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy

• Viscosity: 3,000 to 5,000 cP
• Use Temperature: 662 F
• Coeff. of Thermal Expansion (CTE): 28.333333333333332 to 98.88888888888889 µin/in-F
• Index of Refraction: 1.5701

Description: LOCTITE® M-31CL Hysol Medical Device Epoxy Structural Adhesive is an ultra clear, low viscosity adhesive that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are required. 30

• Viscosity: 6,000 cP
• Use Temperature: 65 to 300 F
• Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material

Description: Master Bond Polymer Adhesive EP30ND is a high viscosity, two component epoxy adhesive for general purpose bonding and repair formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight or volume. This

• Viscosity: 1,200 to 1,400 cP
• Use Temperature: -60 to 250 F
• Dielectric Strength: 440 kV/in
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Marine, Medical / Food (Sanitary / FDA), OEM / Industrial, Optical Grade / Material, Semiconductors / IC Packaging, Tooling / Mold Material

Description: Master Bond Polymer Adhesive EP30HT is a medium viscosity, two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a four (4) to one (1) mix ratio by weight. This adhesive is 100%

• Use Temperature: -60 to 400 F
• Coeff. of Thermal Expansion (CTE): 22 µin/in-F
• Tensile Strength (Break): 9,500 psi
• Elongation: 3 %

Description: Master Bond Polymer Adhesive EP30Med is a two component very low viscosity epoxy resin system for high performance bonding, sealing, coating, encapsulating and casting. It is formulated to cure readily at room temperature or more quickly at elevated temperatures. It has a 4 to 1 mix

• Viscosity: 1,200 to 1,400 cP
• Use Temperature: -60 to 250 F
• Dielectric Strength: 440 kV/in
• Index of Refraction: 1.53 to 1.55

Description: Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity.

• Viscosity: 4,000 to 10,000 cP
• Use Temperature: -58 to 347 F
• Thermal Conductivity: 1.44 to 1.73 W/m-K
• Coeff. of Thermal Expansion (CTE): 8.333333333333334 to 11.11111111111111 µin/in-F

Description: Henkel Loctite 3984 is a high viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to

• Viscosity: 22,000 to 28,000 cP
• Tensile Strength (Break): 5,540 psi
• Elongation: 1.1 %
• Features: Epoxy (EP)

Description: Henkel Loctite 3981 is a low viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to

• Viscosity: 4,000 to 6,000 cP
• Tensile Strength (Break): 8,970 psi
• Elongation: 2.98 %
• Features: Epoxy (EP)

Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSAL™ Epoxy is formulated with a blend of proprietary nanomaterials,

• Viscosity: 40,000 to 50,000 cP
• Use Temperature: 77 to 302 F
• Thermal Conductivity: 1.8 W/m-K
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)

Description: Loctite Hysol 30673 clear M-31CL medical device adhesive is compatible with ceramic, glass, metal and thermoplastic materials. Provides a 30 min working time. Works in a mix ratio of 2:1. Delivers great performance with tensile strength of 8000 psi. Minimum to maximum operating temperatures

• Viscosity: 6,000 cP
• Use Temperature: -65 to 300 F
• Features: Epoxy (EP), Leveling / Filling Compound
• Industry: Medical / Food (Sanitary / FDA)

Description: 10-3039 is a room temperature curing, two component epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title 21 Code of Federal

• Viscosity: 175,000 to 800,000 cP
• Use Temperature: -40 to 266 F
• Tensile Strength (Break): 8,600 psi
• Elongation: 3.7 %

Description: LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic and inorganic

• Viscosity: 14,000 cP
• Use Temperature: 103 to 293 F
• Features: Epoxy (EP)
• Industry: Medical / Food (Sanitary / FDA)

Description: Loctite Hysol 30671 off-white M-21HP medical device epoxy adhesive is compatible with ceramic, glass, metal and thermoplastic materials. Provides a 20 min working time. Works in a mix ratio of 2:1. Delivers great performance with tensile strength of 5700 psi. Minimum to maximum

• Viscosity: 37,000 cP
• Use Temperature: -65 to 300 F
• Features: Epoxy (EP), Leveling / Filling Compound
• Industry: Medical / Food (Sanitary / FDA)

Description: 20-3062 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. Both the 20-3062 and 20-3062 LV, (Low Viscosity version of 20-3062), meet the Food and Drug Administration (FDA) regulations permitting use in food contact

• Viscosity: 30,000 cP
• Tensile Strength (Break): 8,800 psi
• Elongation: 4 %
• Dielectric Constant (Relative Permittivity): 3.73

Description: DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive and

• Industry: Automotive, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Epoxy (EP)

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 200 F
• Features: Epoxy (EP), Other, Specialty / Other
• Industry: Marine, Medical / Food (Sanitary / FDA), OEM / Industrial

Description: Off-white, 2-part, epoxy adhesive which cures at room temperature to form a tough bondline providing high peel resistance and high shear strengths. LOCTITE® EA M-21HP is an off-white, 2-part, epoxy adhesive which cures at room temperature once mixed, to form a tough

• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Features: Epoxy (EP)
• Industry: Medical / Food (Sanitary / FDA)

Description: No Description Provided

• Use Temperature: 230 F
• Substrate Compatibility: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Metal, Paper / Paperboard, Porous Surfaces
• Features: Epoxy (EP), Other, Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Industry: Medical / Food (Sanitary / FDA), OEM / Industrial

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full

• Viscosity: 10,000 cP
• Use Temperature: -50 to 130 F
• Tensile Strength (Break): 4,500 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 180 F
• Features: Epoxy (EP), Other, Specialty / Other
• Industry: Medical / Food (Sanitary / FDA), OEM / Industrial