Glob Top

Description: Thermally Conductive Adhesives (TCAs) are electrically insulating materials that conduct heat as an adhesive or encapsulant. These products are typically oven cured or set at room temperature and are available in a range of viscosities. Our TCAs are well known for resisting hostile environments,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 16.67 to 42.22 µin/in-F
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System

Description: Well suited for glob top or die attach applications, Master Bond Supreme 3HTND-2GT is a one part epoxy system with limited flow for bonding and sealing. Combining outstanding thermal conductivity and electrical insulation values, this system offers superior protection to electronic

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 12.78 to 15 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Master Bond Polymer System UV15X-2GT is a new, easily processable, one component, UV curable glob top, featuring exceptional durability and chemical resistance. UV15X-2GT is a thixotropic paste that handles well when encapsulating selected components and chips on circuit boards. The

• Coeff. of Thermal Expansion (CTE): 47 to 50 µin/in-F
• Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
• Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Single Component System
• Dielectric Constant (Relative Permittivity): Over 3.65

Description: Master Bond EP17HTND-CCM is a single part, heat cured epoxy system for bonding, sealing and glob top applications.

• Chemical / Polymer System Type: Epoxy (EP)
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: LOCTITE ECCOBOND FP4460, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4460 encapsulant is designed for protection of bare semiconductor devices. Pressure pot performance on live devices is up to 500 hours with no failures, depending on device and package type. High

• Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
• Form / Function: Glob Top / Daub
• Use Temperature: 85 to 302 F
• Viscosity: Up to 425000 cP

Description: LOCTITE ECCOBOND FP4323, Epoxy, Encapsulant - glob top LOCTITE® ECCOBOND FP4323 is a high purity liquid epoxy encapsulant for chip on board (plastic substrate) and plastic PGA applications. It is designed with flow capabilities that allows encapsulation without flowing beyond the

• Coeff. of Thermal Expansion (CTE): 15.56 µin/in-F
• Form / Function: Glob Top / Daub
• Viscosity: 220000 cP

Description: For protection of wire bonds consider this high purity material as either a dam or a glob top.

• Coeff. of Thermal Expansion (CTE): 44.44 µin/in-F
• Industry: Electronics
• Use: Glob Top / Daub
• Viscosity: 125000 cP

Description: Sicomet 100 is a fast curing medium-viscosity ethylcyanoacrylate for bonding a wide range of materials including plastics and rubbers.Features and Benefits: Versatile instant adhesive suitable for a wide range of applications Available in low and medium viscosity and a gel formula Henkel

• Form / Function: Glob Top / Daub

Description: Sicomet 101 is a very low viscosity fast-curing ethylcyanoacrylate for bonding a wide range of materials including plastics, rubbers and metals.Features and Benefits: Versatile instant adhesive suitable for a wide range of applications Available in low and medium viscosity and a gel formula Henkel

• Form / Function: Glob Top / Daub

Description: (Known as Hysol EO1061 ) LOCTITE ECCOBOND EO1061 is a medium glob formulation for lower CTE and lower ionic than EO1016 content for more demanding applications.

• Coeff. of Thermal Expansion (CTE): 22.22 µin/in-F
• Industry: Electronics
• Use: Glob Top / Daub
• Viscosity: 50000 cP

Description: (Known as Hysol FP4460 ) LOCTITE ECCOBOND FP4460 is a high purity, low stress glob top semiconductor encapsulant with improved moisture resistance and working life compared to earlier generation products.

• Coeff. of Thermal Expansion (CTE): 11.11 µin/in-F
• Industry: Electronics
• Use: Glob Top / Daub
• Viscosity: 420000 cP

Description: Clear glob top material with good adhesion to any substrate.

• Industry: Electronics
• Use: Encapsulant / Potting Compound, Glob Top / Daub

Description: SWIR EMITTER 1060NM SMD GLOB TOP

Description: SWIR EMITTER 1550NM SMD GLOB TOP

Description: NIR EMITTER 940NM SMD GLOB TOP

Description: SWIR EMITTER 1200NM SMD GLOB TOP

Description: requires their optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes.? EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 36.11 to 108 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Electrical / Electronics Applications: Optoelectronics / Photonics

Description: We have served the optical market since 301 was introduced in 1969.? Our products encapsulate, coat, bond and seal plastics, crystals and glass together for optical components, such as prism, filters, and mirrors. EPO-TEK® fabricated components are the building blocks of camera, laser, telescope,

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 11.67 to 71.11 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 3.18

Description: requires their optical properties. Additionally, our products are found in dental and surgical tools, catheters and diagnostic probes.? EPO-TEK® epoxies also fabricate the circuitry for bench-top instruments, as well as ensure high performance in radiation detection heavy machinery

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 34.44 to 83.89 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
• Electrical / Electronics Applications: Optoelectronics / Photonics

Description: A solvent-free, single component resin with low linear expansion and high ionic purity for protecting semi-conductor silicon crystals.

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 10 to 41.67 µin/in-F
• Composition: Filled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Primarily used for chip coating, glob top and die attach applications, Supreme 3HTND-2CCM is a single component chemical resistant system with low shrinkage upon curing, good thermal conductivity and sound dimensional stability. Its inherent toughness allows it to withstand the most

• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 15 to 16.67 µin/in-F
• Composition: Unfilled
• Cure Type / Technology: Thermosetting / Crosslinking, Single Component System

Description: Non-corrosive, single component alkoxy cure silicone sealant/adhesive

• Chemical / Polymer System Type: Silicone
• Composition: Unfilled
• Compound Type: Electrical Insulation / Dielectric
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Single Component System

Description: The 66291 contains 2 proton tolerant LEDs optically coupled to 2 silicon planar phototransistors. The optocoupler is in a surface mount Glob Top molded plastic Gull Wing package with 0.050” lead spacing. The package eliminates the need for thru-hole mounting and is well suited for high

• Collector Emitter Breakdown Voltage: 30 volts
• Isolation Voltage: 1500 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C

Description: The 66292 contains a proton tolerant LED optically coupled to a corresponding high gain photon detector. This unique single channel Optocoupler provides high CTR and low leakage currents over the specified temperature range. The 66292 is in a surface mount Glob Top molded plastic Gull

• Collector Emitter Breakdown Voltage: 20 volts
• Isolation Voltage: 1500 volts
• Mounting Option: Surface Mount
• Operating Temperature: -55 to 125 C

Description: for a wide range of applications including glob-top dispensing and dispensing UV light-curable adhesives in medical-device manufacturing. The Model 485 needle valve is available by itself for mounting into automated systems or is also available in a bench-top configuration, paired with

• Application: Other

Description: Multi-Cure® 9037-F is a resilient chip encapsulant designed for applications where a thixotropic, high-viscosity encapsulant or a damming material is required. This is often the case for conventional glob top encapsulation applications – for chip on glass, chip on board, or

• Cure Type / Technology: UV / Radiation Cured (also EB, Light)
• Form / Function: Encapsulant / Potting Compound
• Viscosity: 55000 cP

Description: , electronic components, and speaker membranes. This adhesive is a thixotropic gel suitable for dams and/or general-purpose bonding. The viscosity is ideal for medium-glob top profiles. Dymax materials have no solvents added and cure upon exposure to light. Their ability to cure in

• Cure Type / Technology: UV / Radiation Cured (EB, Light)
• Elongation: 200 %
• Substrate / Material Compatibility: Plastic, Other
• Viscosity: 45000 cP

Description: considered but is not recommended due to the potential for tin whiskers. Non-standard finishes may incur additional charges or minimum order quantities. Where applicable, sealing is by high purity glob top encapsulant, heat cured. Inductors Inductors are ferrite beads. These may

• Operating Temperature: -55 to 125 C