I7 3770k Chipsets

Description: The Intel® 5500 series of chipsets supports the Intel® Xeon® processor 5500 series, as well as the 32nm high-k Intel® Xeon® processor 5500 series, and features support for the Intel® QuickPath Architecture allowing for exceptional bandwidth for I/O in addition to advanced

Description: The Intel® 5500 series of chipsets supports the Intel® Xeon® processor 5500 series, as well as the 32nm high-k Intel® Xeon® processor 5500 series, and features support for the Intel® QuickPath Architecture allowing for exceptional bandwidth for I/O in addition to advanced

Description: The Intel® 7500 chipset and Intel® 7500 Scalable Memory Buffer support the 45nm, high-k Intel® Xeon® processor 7500/6500 series and Intel® Itanium® processor 9300 series. The Intel 7500 chipset is built for the Intel® QuickPath Architecture allowing for

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.07 to 1.6 GHz
• Memory Capacity: 32 GB

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.07 to 1.6 GHz
• Memory Capacity: 32 GB

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.07 to 1.33 GHz
• Memory Capacity: 32 GB

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M

• Chipset Type: Intel® Chipset
• LAN / Networking: 2
• Max Speed: 1.07 to 1.6 GHz
• Memory Capacity: 32 GB

Description: The IMBM-B75A is a Micro-ATX form factor with an Intel® Core? i7-3770 or i5-3550S LGA 1155 processor and Intel® B75 Express chipset. Moreover, up to 32GB of DDR3 1066/1333/1600 (1600 for 3rd generation processor) memory is feasible with four DIMMs. Its five SATA

• Chipset Type: Intel® Chipset
• On Board Features: Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
• Processor / CPU Type: Other

Description: 2.5" Embedded SBC supports Intel® 11th Gen Tiger Lake-UP3 i7 / i5 / i3, Celeron CPU, 4 x HDMI, 3 x Intel 2.5Gb Ethernet, 2 x M.2, 1 x Nano SIM, 4DI / 4DO, 2 x USB 3.0, 4 x USB 2.0, 2 x COM, SMBus LEX SYSTEM 2I110AW is powered by 11th Gen Intel® Core™

• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet
• I/O Bus Specifications: USB, Other
• Ports: Serial Ports, USB

Description: their companion chipset, the 855GME with integrated Extreme Graphics 2 and audio functions. The Pentium M version Cobra incorporates a number of power saving features, including SpeedStep technology, and performance enhancing features such as a large 1 MB level 2 cache. The advanced graphics

• CPU Speed: 1000 MHz
• Chipset Type: Intel® Chipset
• Communication Networks: Ethernet, Other
• CompactFlashTM: Yes

Description: Key Features 6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset 2x DDR4 SO-DIMM sockets support up to 32GB memory 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots 2x Mini PCIe and 1x USIM slots Support for 3

• Cache Memory (L1 & L2): 8000 KB
• Operating System: Microsoft®
• Operating Temperature: -4 to 158 F
• Processor: Intel®

Description: Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package Intel Z68 single chip architecture Support 4-DIMM DDR3-2200(OC)/2133(O C)/1866(OC)/1600(OC) /1333 up to 32G maximum capacity Support SATA

• Chipset Type: Intel® Chipset
• Memory Capacity: 32 GB
• On Board Features: Serial Interface (RS232, RS422, RS485)?, On-board Ethernet Controller?
• Processor / CPU Type: Other

Description: -to-install isolated input and relay output digital I/O capabilities to any PC or embedded system with a USB port. Featuring 16 Form C (SPDT) electromechanical relays and 16 optically isolated digital inputs, the unit is the smallest of its kind for digital monitoring and control using USB

• Computer Bus: USB
• Connection to Host: USB
• Digital I/O Channels: 16 #
• Form Factor: Printed Circuit Board (PCB), DIN Rail, Stand Alone

Description: touchscreen based user interface 5 GHz 0.4 dB level measurement uncertainty up to 7 GHz –110 dBc (1 Hz) phase noise at 10 kHz frequency offset +15 dBm third-order intercept (TOI) Displayed average noise level (DANL) in 1 Hz bandwidth: –155 dBm at 1 GHz

• Frequency Range: 7.00E6 kHz

Description: Processor/memory Processor: Marvell PXA310 806 MHz Memory: 128 MB SDRAM Data storage 4 GB iNAND Flash Operating system Microsoft Windows® Mobile 6.1 Classic (NX7-B) Microsoft Windows® Mobile 6.1 Professional (NX7-W

• Display Size: 3.5 inch
• Features: Touch Screen, Handheld / Portable, Integrated Bluetooth^TM Technology
• Operating System: Microsoft®
• Operating Temperature: -22 to 140 F

Description: assembly number. Features: 3rd generation Intel® Core™ processor: 4-core 2.3 GHz Intel Core i7-3615QE processor 4-core 2.1 GHz Intel Core i7-3612QE processor 2-core 2.5 GHz Intel Core i7-3555LE processor 2-core

• CPU Speed: 1700 to 2500 MHz
• Communication Networks: Ethernet
• I/O Bus Specifications: VMEbus
• Processor / CPU Type: Other

Description: , state of the art chipsets against ESD transients. ESD, IEC 61000-4-2, ±10kV contact, ±15 kV air EFT, IEC 61000-4-4, 80 A (tP=5/50ns) Lightning, 2 A (8/20 as defined in IEC 61000-4-5 2nd edition) Low capacitance of 0.2pF (TYP) per I/O Low leakage current of 0.01µA (TYP)

• Diode Type: General Purpose (PN Junction Diodes), Zener Diodes, Transient Voltage Suppressor Diodes (TVS)
• RoHS Compliant: Yes
• VR: 5 volts

Description: Features High-speed USB 2.0 multifunction DAQ, USB 3.0 and 1.1 compatible Sustained sampling speeds up to 500kHz 12 or 16-bit resolution A/D converter Flexible, software configured functionality 64 single-ended or 32 differential analog

• Analog Input Channels: 64 #
• Computer Bus: USB
• Connection to Host: USB
• Differential Channels: Yes

Description: Features High-speed USB 2.0 multifunction DAQ Sustained sampling speeds up to 500kHz 12 or 16-bit resolution A/D converter Flexible, software configured functionality High density, up to 128 single-ended or differential analog inputs

• Analog Input Channels: 128 #
• Computer Bus: USB
• Connection to Host: USB
• Differential Channels: Yes

Description: Features High-speed USB 2.0 multifunction DAQ Sustained sampling speeds up to 500kHz 12 or 16-bit resolution A/D converter Flexible, software configured functionality High density, up to 128 single-ended or differential analog inputs

• Analog Input Channels: 64 #
• Computer Bus: USB
• Connection to Host: USB
• Differential Channels: Yes

Description: ERM-3K3UC (copper core radiator) is designed for industrial cooling and other special thermal applications. With a 24V PMP-450S pump and 9 x 120mm high-flow fans totaling 968CFM, it's the most powerful system available from Koolance. ERM-3K3U provides greater thermal performance at 20%

Description: ERM-3K3UA (aluminum radiator) is designed for industrial cooling and other special thermal applications. With a 24V PMP-450S pump and 9 x 120mm high-flow fans totaling 968CFM, it's the most powerful system available from Koolance. ERM-3K3U provides greater thermal performance at 20%

Description: dynamic resistance to protect the most sensitive, state of the art chipsets against ESD transients. IEC 61000-4-2 ESD protection: ±30kV by contact and ±30 kV through air ISO 10605-compliant ESD protection: 330 pF 330 O, ±30 kV by contact, ±30 kV through air EFT,

• Diode Type: Zener Diodes, Transient Voltage Suppressor Diodes (TVS)
• RoHS Compliant: Yes
• VR: 5 volts

Description: protect the most sensitive, state of the art chipsets against ESD transients. IEC 61000-4-2 ESD protection: ±30kV by contact and ±30 kV through air ISO 10605-compliant ESD protection: 330 pF 330 O, ±30 kV by contact, ±30 kV through air EFT, IEC 61000-4-4, 80 A

• Diode Type: Zener Diodes, Transient Voltage Suppressor Diodes (TVS)
• RoHS Compliant: Yes
• VR: 5 volts

Description: sensitive, state of the art chipsets against ESD transients. IEC 61000-4-2 ESD protection: ±30kV by contact and ±30 kV through air EFT, IEC 61000-4-4, 80 A (tP=5/50ns) Lightning, IEC 61000-4-5 2nd edition, 8A (tP=8/20µs) Low capacitance of 1pF (TYP) per I/O Low leakage

• Diode Type: Zener Diodes, Transient Voltage Suppressor Diodes (TVS)
• RoHS Compliant: Yes
• VR: 5 volts

Description: The Type 1CD module offers 2.4 GHz IEEE802.11b/g/n WLAN functionality. The ultra-small module is based on the Cypress Chipset CYW43362. It includes the STMicroelectronics STM32F405 ARM Cortex-M4 processor, operating at 168 MHz with 120 kB RAM and 23 free Input/Outputs. The software

• Interface: I2C, SPI, UART, Other
• T_J: -40 to 85 C

Description: The Type 1CD module offers 2.4 GHz IEEE802.11b/g/n WLAN functionality. The ultra-small module is based on the Cypress Chipset CYW43362. It includes the STMicroelectronics STM32F405 ARM Cortex-M4 processor, operating at 168 MHz with 120 kB RAM and 23 free Input/Outputs. The software

• Interface: I2C, SPI, UART, Other
• T_J: -40 to 85 C

Description: ) push the limit of what's possible with embedded computing. The C246 chipset enables Xeon processing and ECC memory for rugged server capability at the edge and allows for real-time machine learning, object detection, and behavior recognition while minimizing the dependency on large-scale

• Features: Integrated Bluetooth^TM Technology
• Operating System: Microsoft®
• Processor: Intel®, Other
• RAM: 64 GB

Description: Extended Support Program 5 year warranty protection, 24/7 support, advance replacement and more! HIGH-PERFORMANCE RUGGED EDGE COMPUTER Karbon 700 is a rugged edge computer matching high-performance with functional adaptability for reliable operation in virtually any

• Features: Integrated Bluetooth^TM Technology
• Operating System: Microsoft®
• Processor: Intel®, Other
• RAM: 64 GB

Description: Very Low Cost Ultra Miniature (1.2 x 2.4 x 0.28 inches) (30 x 61 x 7.1 mm) Advanced Hybrid Design Full or Half Step High Input Voltage (+12 to +48 VDC) Output Current (0.1 to 2 Amps Per Phase) 20 kHz Chopping Rate Alternative to Chipsets

Description: Dropout Regulators and a 400kHz I²C interface that provides programmable Dynamic Voltage Scaling (DVS), Power Sequencing, and individual output Enable/Disable controls allowing the user to optimally control all four outputs. The 4MHz synchronous buck regulator features a patented Hyper

• IC Package Type: Other
• Input Voltage (V_IN): 5.5 volts
• Output Voltage (V_olt): 0.8000 to 1.8 volts

Description: Features 5.25" form factor Single Board Computer Pentium III Socket 370 Processors 533-1G mhz Intel Celerion, Cyrix III, VIA C3 Up to 256 MB SDRAM in one 168-Pin DIMM socket, PC100/PC133 supported Intel 815E chipset integrates graphics ITE 8712 I

Description: /ICHE chipset /graphics controller Fast PCI ATA 33/66/100 IDE controller, supports four drives Intel® 82559 and 82562 10/100 based Ethernet controller Multi I/Os for IrDA, Floppy Drive, Parellel port, K/B & Mouse COM 1 as RS-232 and COM 2 as RS-232/422/485 selectable Five

Description: output. Display memory up to 32MB. CRT resolution 1280x1024@24bpp, 1600x1200@8bpp Intel 82815 & 82801BA chipset include Graphic Memory Controller Hub, I/I controller Hub 2, and Firmware Hub Dual LAN, Intel 81559 controller, 10/100 Mbps, autoswitch, with dual RJ-45 connectors

Description: Fake Threat In the Open Market: 62 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 1 (Unlimited) Parts Dimension: 0.265" L x 0.281" W (6.73mm x 7.14mm) Inductance at Frequency: 475µH at 10kHz

• Operating Frequency Range: 10000 Hz
• Operating Temperature: -40 to 125 C
• Package Type: Surface Mount Technology (SMT), Other

Description: Fake Threat In the Open Market: 28 pct. Supply and Demand Status: Limited Manufacturer Pack Quantity: 1 MSL Level: 1 (Unlimited) Parts Dimension: 0.265" L x 0.281" W (6.73mm x 7.14mm) Inductance at Frequency: 475µH at 10kHz

• Operating Frequency Range: 10000 Hz
• Operating Temperature: -40 to 125 C
• Package Type: Surface Mount Technology (SMT), Other

Description: - Operating: -40°C ~ 125°C Intended Chipset: SN6501 Chipset Manufacturer: Texas Instruments Footprint: 0.360" L x 0.500" W (9.14mm x 12.70mm) Manufacturer Homepage: www.we-online.com Height - Seated (Maximum): 0.305" (7.75mm) Popularity: Medium Fake Threat In the

• Operating Temperature: -40 to 125 C
• Package Type: Surface Mount Technology (SMT), Other

Description: . · Active chipset. · Aluminium headshell. · Easy installation · Supports 3D, 4k2k, 10.2Gpbs, 2160P and XV colour. · Supports all HDMI devices. · Supports audio return channel Connector A = Male HDMI Connector B = Male HDMI Connector A Type = HDMI Connector B Type = HDMI

• Connector Type: HDMI, Other

Description: . · Active chipset. · Aluminium headshell. · Easy installation · Supports 3D, 4k2k, 10.2Gpbs, 2160P and XV colour. · Supports all HDMI devices. · Supports audio return channel Connector A = Male HDMI Connector B = Male HDMI Connector A Type = HDMI

• Connector Type: HDMI, Other

Description: 18 – 38 V input voltage range and generates an output at 24 V / 0.7 A, with a peak efficiency of up to 90.6% at full load. The part has a maximum height of just 7.4 mm, significantly lower than other parts recommended for the same chipset. Designed for use with Maxim 60 V No

• Construction: Toroidal Core, Other
• Cooling Method: Dry-type / Air Cooled
• Operating Temperature: -40 to 85 C
• Standards / Compliance: RoHS Compliant

Description: /b/g/n/ac, Wi-Fi 5 Wi-Fi 1x1 SISO IEEE 802.11ac data rates up to 433 Mbit/s (PHY), beamforming Supports 802.11d/e/h/i/k/r/u/ v/w/ai Wi-Fi 20, 40, and 80 MHz channels Wi-Fi operation: Station, Access Point (AP) (with up to 10 clients), and Wi-Fi Direct

• Device Type: Receiver
• Technology: GPS

Description: Intel® 855GME chipset include Graphic Memory Controller Hub, I/O controller Hub 4, and Firmware Hub LAN1, Intel 82562ET 10/100 Mbps Ethernet LAN2, Intel 82551QM or Intel 82541GI (1Gb) Support Wake-on-LAN with ATX power x1CompactFlash socket x4 USB2.0 ports, IrDA, Floppy, Parallel,

Description: Switching (ver. 1.1) (2 sources) 192kHz/24 bit Crystal® DAC for all 8 Channels 32 bit Digital Surround Processing Chipsets Set-up menu via Video Outputs (Composite, S-Video, Component) Video Convert Feature (Composite/S-Video to Component) Dolby Digital EX

Description: Rugged/mil 3U CompactPCI single slot SBC Rugged/mil 3U CompactPCI Single Slot SBC Intel® T7500/L7500 Core™ Two (2) Duo (Merom) Processor with 2.2 GHz, 1.67 or 1.06 GHz On-chip 32 kb Data/32 kB Instruction L1 Cache On-chip 4 MB L2 Cache

Description: Rugged/mil 6U VME single slot SBC with Intel® L7500 Core™2 Duo 2.2 /1.67 / 1.06 GHz Rugged/mil 6U VME Single Slot SBC Intel® L7500 Core™2 Duo (Merom) Processor with 2.2 / 1.67 / 1.06 GHz On-chip 32 kb Data/32 kB Instruction L1 Cache

Description: features including 802.11e, 802.11i, and 802.11h Implementation of 802.11k, 802.11r, 802.11s, and 802.11v Enhanced roaming for pico-cell environments FIPS support Security protocols including WPA, WPA2, 802.1x, and EAP TTLS Cisco CCX support and pre

Description: features including 802.11e, 802.11i, and 802.11h Implementation of 802.11k, 802.11r, 802.11s, and 802.11v Enhanced roaming for pico-cell environments FIPS support Security protocols including WPA, WPA2,802.1x, and EAP TTLS Cisco CCX support and pre

Description: features including 802.11e, 802.11i, and 802.11h Implementation of 802.11k, 802.11r, 802.11s, and 802.11v Enhanced roaming for pico-cell environments FIPS support Security protocols including WPA, WPA2,802.1x, and EAP TTLS Cisco CCX support and pre

• Deployment: Standalone
• Licensing: Perpetual
• Use: Professional

Description: (dedicated closely coupled memory areas per core) 64 KB EEPROM at 500 k cycles 472KB RAM w/ ECC protection 64x DMA channels Sensor interfaces : 10xSENT, 3xPSI5, 1xPSI5S State of the art connectivity : 1xEthernet 100 Mbit

• DMA Channels: Yes
• Data Bus: 16 Bit, 32 Bit
• Internal RAM Size: 472 KB
• Internal ROM Type: Flash

Description: purpose inputs. Two interface modes are supported by the SST49LF008A: Firmware Hub (FWH) Interface mode for in-system programming and Parallel Programming (PP) mode for fast factory programming of PC-BIOS applications. Additional Features Firmware Hub for Intel 8xx Chipsets

• Data Retention: 100 years
• Density: 8000 kbits
• Endurance: 100000 Write/Erase Cycles
• IC Package Type: Other

Description: Generic Timer Module ( GTM), the TC23xL series aim for a reduced complexity, best-in-class power consumption and significant cost savings. Summary of Features TriCore™ with 200MHz / DSP functionality 2MB Flash w/ ECC protection 128KB EEProm @ 125k cycles

• DMA Channels: Yes
• Data Bus: 16 Bit, 32 Bit
• Internal RAM Size: 192 KB
• Internal ROM Type: Flash

Description: for direct connection to any power amplifier, negating the need for a preamplifier. Maximum output can be set at either two or four volts to suit different amplifier/speaker combinations. Specifications: Chipset: PCM1795 D/A Sampling rate: up to 24-Bit, 192kHz for all inputs Inputs:

• Signal Converter Type: Digital-to-Analog Converter

Description: | Automotive MOSFET IPD80R2K7C3A | Automotive MOSFET AIMCQ120R080M1T | Silicon Carbide MOSFET Discretes AIDK12S65C5 | CoolSiC™ Schottky Diodes BSS84P | Small signal/small power MOSFET BSS159N | N-Channel Depletion Mode MOSFET

• DMA Channels: Yes
• Data Bus: 32 Bit
• Internal RAM Size: 672 KB
• Internal ROM Type: Flash