I7 3770k Chipsets

Description: Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d). The Intel 5500 series of chipsets supports Intel® QuickPath Interconnects at 6.4 GT/s, 5.86 GT/s, and 4.8 GT/s speeds. Additionally, this chipset delivers up to dual x16 or quad x8 PCI Express* 2.0 card

Description: Intel® Virtualization Technology (Intel® VT) for Directed I/O (Intel® VT-d). The Intel 5500 series of chipsets supports Intel® QuickPath Interconnects at 6.4 GT/s, 5.86 GT/s, and 4.8 GT/s speeds. Additionally, this chipset delivers up to dual x16 or quad x8 PCI Express* 2.0 card

Description: The Intel® 7500 chipset and Intel® 7500 Scalable Memory Buffer support the 45nm, high-k Intel® Xeon® processor 7500/6500 series and Intel® Itanium® processor 9300 series. The Intel 7500 chipset is built for the Intel® QuickPath Architecture allowing for exceptional bandwidth for I/O in

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3610QE (6M Cache, up to 3.3 GHz); 45W - Intel Core i5-3610ME (3M Cache, up to 3.3 GHz); 35W - Intel Core i3-3120ME (3M Cache, 2.4 GHz); 35W 2nd generation Intel Core processors (32nm process

• Max Speed: 1.066 to 1.6 GHz
• Memory Capacity: 16 GB
• LAN / Networking: 2
• SATA: 2

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M Cache, 3.1 GHz); 65W 2nd

• Max Speed: 1.066 to 1.6 GHz
• Memory Capacity: 32 GB
• PCI Slots: 4
• LAN / Networking: 2

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M Cache, 3.1 GHz); 65W

• Max Speed: 1.066 to 1.333 GHz
• Memory Capacity: 16 GB
• LAN / Networking: 2
• SATA: 2

Description: Recommended Processors: 3rd generation Intel Core processors (22nm process technology) - Intel Core i7-3770 (8M Cache, up to 3.9 GHz); 77W - Intel Core i5-3550S (6M Cache, up to 3.7 GHz); 65W - Intel Core i3-3220 (3M Cache, 3.3 GHz); 55W - Intel Pentium G2120 (3M Cache, 3.1 GHz); 65W 2nd

• Max Speed: 1.066 to 1.333 GHz
• Memory Capacity: 32 GB
• PCI Slots: 2
• LAN / Networking: 2

Description: 11th Gen. Intel® Core U-series i7/i5/i3/Celeron Pico-ITX SBC Intel® Tiger Lake-UP3 (10nm++) Series, On-board LPDDR4x-4266 up to 32G with IBECC Dual independent display: eDP/MIPI-DSI, DP up to 8K Rich I/O interface with GbE x 2, USB 3.2, COM Port, DIO SMBus, TPM2.0 Flexible expansion to IoT

• CPU Speed: 1,350 MHz
• Operating Temperature: 32 to 140 F
• Chipset: Intel® Chipset
• Features: Other, RJ-45 Connectors

Description: The IMBM-B75A is a Micro-ATX form factor with an Intel® Core™ i7-3770 or i5-3550S LGA 1155 processor and Intel® B75 Express chipset. Moreover, up to 32GB of DDR3 1066/1333/1600 (1600 for 3rd generation processor) memory is feasible with four DIMMs. Its five SATA connectors allow

• Chipset: Intel® Chipset
• On Board Features: On-board Ethernet Controller, Serial Interface (RS232, RS422, RS485)
• Features: Other

Description: Key Features 6th Generation Intel® Core™ i7/i5/i3 Processors and QM170 chipset 2x DDR4 SO-DIMM sockets support up to 32GB memory 1x PCI and 2x PCIe Gen3 x8 (or 1x PCIe Gen3 x16) slots 2x Mini PCIe and 1x USIM slots Support for 3 independent displays with 2x DisplayPort and 1x DVI-I

• Speed: 2,800 MHz
• RAM: 32 GB
• Cache Memory (L1 & L2): 8,000 KB
• Operating Temperature: -4 to 158 F

Description: 3rd generation Intel® Core™ processor: 4-core 2.3 GHz Intel Core i7-3615QE processor 4-core 2.1 GHz Intel Core i7-3612QE processor 2-core 2.5 GHz Intel Core i7-3555LE processor 2-core 1.7 GHz Intel Core i7-3517UE processor Up to 16 Gbytes of DDR3-1600 DRAM with ECC Up to

• CPU Speed: 1,700 to 2,500 MHz
• RAM: 16,000 MB
• Communication Networks: Ethernet
• Features: Other

Description: 2.5" Embedded SBC supports Intel® 11th Gen Tiger Lake-UP3 i7 / i5 / i3, Celeron CPU, 4 x HDMI, 3 x Intel 2.5Gb Ethernet, 2 x M.2, 1 x Nano SIM, 4DI / 4DO, 2 x USB 3.0, 4 x USB 2.0, 2 x COM, SMBus LEX SYSTEM 2I110AW is powered by 11th Gen Intel® Core™ i7i5/i3 Processors . (formerly Tigert Lake

• RAM: 32,000 MB
• Communication Networks: Ethernet
• Chipset: Intel® Chipset
• Features: Other

Description: microphone with noise cancellation Navigation Integrated GPS SiRF Star III chipset with WAAS/EGNOS support Integrated E-Compass and G-Sensor Integrated Altimeter Camera Integrated 3 megapixel camera with autofocus and LED Flash Options RFID Barcode scanner

• Speed: 806 MHz
• RAM: 0.128 GB
• Display Size: 3.5 inch
• Operating Temperature: -22 to 140 F

Description: wireless standards with up to 160 MHz analysis bandwidth for measurements on components, chipsets and base stations. Typical measurement tasks include standard-compliant spectrum emission mask measurements as well as spurious emission and adjacent channel leakage ratio (ACLR) measurements.

• Frequency Range: 7,000,000 kHz

Description: Supports the Intel 2nd generation Core i7 and Core i5 processors in the 1155 package Intel Z68 single chip architecture Support 4-DIMM DDR3-2200(OC)/2133(OC)/1866(OC)/1600(OC)/1333 up to 32G maximum capacity Support SATA 6Gb/s 2X speed than current SATA 3G Support Intel Smart Response

• Memory Capacity: 32 GB
• Chipset: Intel® Chipset
• On Board Features: On-board Ethernet Controller, Serial Interface (RS232, RS422, RS485)
• Features: Other

Description: This allows our rugged digital board to be added to any PCI-104 or PC/104 stack by connecting it to a simple USB port usually included on-board with embedded CPU form factors such as EBX, EPIC, and PC/104 — especially important since many newer CPU chipsets do not support ISA and have plenty

• Digital I/O Channels: 16 #
• Operating Temperature: 32 to 158 F
• Features: Application Software Included
• User Interface: Computer Programmable

Description: state of the art chipsets against ESD transients. ESD, IEC 61000-4-2, ±10kV contact, ±15 kV air EFT, IEC 61000-4-4, 80 A (tP=5/50ns) Lightning, 2 A (8/20 as defined in IEC 61000-4-5 2nd edition) Low capacitance of 0.2pF (TYP) per I/O Low leakage current of 0.01μA (TYP) at 5V Tiny μDFN( JEDEC

• VR: 5 volts
• V_BR: 7 volts
• C_T: 0.96 pF
• Features: Array, Bidirectional

Description: resistance to protect the most sensitive, state of the art chipsets against ESD transients. IEC 61000-4-2 ESD protection: ±30kV by contact and ±30 kV through air ISO 10605-compliant ESD protection: 330 pF 330 Ω, ±30 kV by contact, ±30 kV through air EFT, IEC 61000-4-4, 80 A (tP=5/50ns)

• VR: 5 volts
• Features: Array, Bidirectional
• RoHS Compliant: RoHS Compliant
• Diode Type: Transient Voltage Suppressor Diodes (TVS), Zener Diodes

Description: chipset are not included with Koolance systems. Other liquid components (such as the radiator, pumps, and display) come pre-installed. Components Included Cooling unit (pump/reservoir, radiator, fans, control board, display, etc.), manual, slot interface adapter, power cable, mounting feet,

Description: and includes rack mountable ears. The front display can be rotated for these positions by hand. ERM-3K3U has G 1/4 BSP rear nozzle threads. NOTE: 3 x 700mL bottles of coolant is recommended for this system. Components Required Cooler kits such as the CPU, hard drive, and video/motherboard

Description: (without the bus connections). This allows our rugged digital/serial board to be added to any PCI-104 or PC/104 stack by connecting it to a simple USB port usually included on-board with embedded CPU form factors such as EBX, EPIC, and PC/104 - especially important since many newer CPU

• Number of Ports: 2
• Features: CE Conformity Marks, RoHS
• Connector: DB25, DB9
• Serial Protocol: RS232/422/485

Description: Very Low Cost Ultra Miniature (1.2 x 2.4 x 0.28 inches) (30 x 61 x 7.1 mm) Advanced Hybrid Design Full or Half Step High Input Voltage (+12 to +48 VDC) Output Current (0.1 to 2 Amps Per Phase) 20 kHz Chopping Rate Alternative to Chipsets

Description: The MIC2826 is a four output, programmable Power Management IC, optimized for high efficiency power support in Mobile Application Processors, Co-Processors, DSPs, GPS and Media Player chipsets. The device integrates a single 500mA PWM/PFM synchronous buck (step-down) regulator with three Low

• Output Voltage (V_olt): 0.8 to 1.8 volts
• Input Voltage (V_IN): 5.5 volts
• Features: Other

Description: Hexa-Core Coffee Lake processors and 9th Gen processors (coming soon) push the limit of what's possible with embedded computing. The C246 chipset enables Xeon processing and ECC memory for rugged server capability at the edge and allows for real-time machine learning, object detection, and

• RAM: 64 GB
• General Features: Integrated Bluetooth^TM Technology
• Processor: Intel®
• Operating System: Microsoft®

Description: 125°C Intended Chipset: SN6501 Chipset Manufacturer: Texas Instruments Footprint: 0.265" L x 0.395" W (6.73mm x 10.05mm) Manufacturer Homepage: www.we-online.com Height - Seated (Maximum): 0.170" (4.32mm) Popularity: Medium Fake Threat In the Open Market: 28 pct. Supply and Demand

• Operating Frequency Range: 10,000 Hz
• Operating Temperature: -40 to 125 C
• Features: Other, Surface Mount Technology (SMT)
• Category: Signal / RF Transformer

Description: 125°C Intended Chipset: SN6501 Chipset Manufacturer: Texas Instruments Footprint: 0.265" L x 0.395" W (6.73mm x 10.05mm) Manufacturer Homepage: www.we-online.com Height - Seated (Maximum): 0.170" (4.32mm) Popularity: Medium Fake Threat In the Open Market: 62 pct. Supply and Demand

• Operating Frequency Range: 10,000 Hz
• Operating Temperature: -40 to 125 C
• Features: Other, Surface Mount Technology (SMT)
• Category: Signal / RF Transformer

Description: Chipset: SN6501 Chipset Manufacturer: Texas Instruments Footprint: 0.360" L x 0.500" W (9.14mm x 12.70mm) Manufacturer Homepage: www.we-online.com Height - Seated (Maximum): 0.305" (7.75mm) Popularity: Medium Fake Threat In the Open Market: 71 pct. Supply and Demand Status: Limited

• Operating Temperature: -40 to 125 C
• Features: Other, Surface Mount Technology (SMT)
• Category: Signal / RF Transformer

Description: limit of what's possible with embedded computing. The C246 chipset enables Xeon processing and ECC memory for rugged server capability at the edge and allows for real-time machine learning, object detection, and behavior recognition while minimizing the dependency on large-scale data centers

• RAM: 64 GB
• General Features: Integrated Bluetooth^TM Technology
• Processor: Intel®
• Operating System: Microsoft®

Description: 12th/13th/14th Gen Intel® Core™ Processor LGA1700 12/13/14th Gen Intel® Core™ Desktop Processors (LGA1700), Up to 24Core. Support Q670E/H610E chipset Dual channel DDR5 5600MHz, max. 96GB with two SODIMMs Super Speed I/O: PCIe x16 Gen5 (32GT/s), USB3.2 Gen2 (10Gbps), 2.5GbE Quad independent 4K

• Max Speed: 3.8 GHz
• Memory Capacity: 96 GB
• Features: Other

Description: CPU chipsets do not support ISA and have plenty of USB ports. The USB-AIO M Series boards can also be installed using standoffs inside other enclosures or systems. For embedded OEM type applications, an additional micro-fit USB input header is provided in parallel with the type B connector.

• Analog Input Channels: 64 #
• Digital I/O Channels: 16 #
• Sampling Frequency: 100 kHz
• Resolution: 12 bits

Description: resolution 1280x1024@24bpp, 1600x1200@8bpp Intel 82815 & 82801BA chipset include Graphic Memory Controller Hub, I/I controller Hub 2, and Firmware Hub Dual LAN, Intel 81559 controller, 10/100 Mbps, autoswitch, with dual RJ-45 connectors CompactFlash socket for up to 512MByte, 8 Mbit Flash

Description: Intel 82815 Chipset, supports the low power processors and Intel socket 370 processors up to 1.2GHz. The performance that comes with this chipset includes SDRAM memory optimization and FSB 133HMz , PCI ATA, and USB design. The IND-P815LV integrated Intel® 82559 and 82562 10/100 based

Description: systems. The board can be added to any PC/104-based stack by connecting it to a USB 2.0 port usually included on-board with embedded CPU form factors such as EBX, EPIC, and PC/104. This is especially important since many newer CPU chipsets do not support ISA and have plenty of USB ports. The

• Analog Input Channels: 64 #
• Digital I/O Channels: 16 #
• Sampling Frequency: 500 kHz
• Resolution: 12 bits

Description: 38 V input voltage range and generates an output at 24 V / 0.7 A, with a peak efficiency of up to 90.6% at full load. The part has a maximum height of just 7.4 mm, significantly lower than other parts recommended for the same chipset. Designed for use with Maxim 60 V No-opto isolated flyback

• Operating Temperature: -40 to 85 C
• Cooling Method: Dry-type / Air Cooled
• Transformer Type: Isolation Transformer
• Features: Other, Power / Power System / Distribution Transformer

Description: Features 5.25" form factor Single Board Computer Pentium III Socket 370 Processors 533-1G mhz Intel Celerion, Cyrix III, VIA C3 Up to 256 MB SDRAM in one 168-Pin DIMM socket, PC100/PC133 supported Intel 815E chipset integrates graphics ITE 8712 I/O chipset integrates Ethernet and audio