Products & Services
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Supplier: Allied Electronics, Inc.
Description: PLCC Chip Carrier Socket (Surface Mount) 44 position
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Supplier: Allied Electronics, Inc.
Description: DRIVER; PLASTIC CHIP CARRIER PACKAGE; 25 V (MAX.)
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Supplier: Ironwood Electronics, Inc.
Description: probing connection to all pins of the chip. A high density male to male adapter provides interconnect from the probe board to the target attached SMT feet. The SMT foot is simply soldered to the same pads as for the IC using standard soldering methods. The IC is installed into
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Supplier: Powell Electronics, Inc.
Description: 3M Chip Carrier Sockets, 8400 Series, 8
- Product Type: IC Socket
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Supplier: RS Components, Ltd.
Description: CHIP CARRIER SOCKET THRU-HOLE 44W
- Number of Contacts: 44
- Contacts Pitch: 1.27 mm
- Product Type: IC Socket
- Contact Plating: Nickel Plating
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Supplier: New Yorker Electronics Co., Inc.
Description: CONNECTOR, CHIP CARRIER SOCKET
- Product Type: IC Socket
- RoHS Compliant: RoHS Compliant
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Supplier: DigiKey
Description: IC SOCKET, CHIP CARRIER, 1.27MM,
- Features: Board Mount Connector
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Supplier: VOXMICRO
Description: dedicated antenna with Class I mode, ANT+ and BLE Up to full Industrial range of operating temperatures Modular World Regulatory Certification (50+ domains) Technical Summary Form Factor M.2 (NGFF) Regular 2230 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 100GBPS CARRIER ETHERNET SWITCH Product overview: BCM56457B1KFSBG from Broadcom is an Interface Transceiver IC for serial communication, bus conversion, signal driving, receiver stages, and industrial networking. It is useful for engineers and buyers comparing datasheets, replacement
- Data Rate: 100,000,000 kbps
- Features: Other, RoHS Compliant
- Device Type: Transceiver
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: HPE 8 TB, SAS 7.2K rpm, 512e, large form factor hard drive in a SmartCarrier Product overview: 819201-B21 from Hewlett Packard Enterprise is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement
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Supplier: ERSAELECTRONICS PTE. LTD.
Description: 960GB SSD SATA Read Intensive 6Gbps 512e 2.5in with 3.5in Hybrid Carrier, S4520 Product overview: S4520-960G from Intel is a Memory IC and Storage Component for data storage, firmware boot, embedded logging, industrial controllers, computing modules, and replacement sourcing. It is
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Description: IC MIXER/CARRIER REMOVR 160-PQFP
- Features: Other
- Package Type: QFP
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Supplier: ams
Description: The AS3932 is a 3-channel ASK receiver that generates a wake-up signal upon detection of a data signal with a carrier frequency in the range of 110 – 150 kHz. It can be used to wake-up active tags in RTLS, PKE and other similar tracking and access control systems.
- Operating Frequency: 0.11 to 0.15 MHz
- Data Rate: 0.5 to 4 kbps
- Pin Count: 16 #
- Features: Other
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Supplier: ams
Description: The AS3930 is a single-channel ASK receiver that generates a wake-up signal upon detection of a data signal with a carrier frequency in the range of 110 – 150 kHz. It can be used to wake-up active tags in RTLS, PKE and other similar tracking and access control systems.
- Operating Frequency: 0.11 to 0.15 MHz
- Data Rate: 0.5 to 4 kbps
- Pin Count: 16 #
- Features: Other
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Description: ITU CO/LOOP CARRIER SLIC
- TJ: -40 to 85 C
- Features: Other
- Device Type: Sensor Interface
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Supplier: Acme Chip Technology Co., Limited
Description: ITU CO/LOOP CARRIER SLIC
- Features: Other
- Package Type: SOIC
- Device Type: Sensor Interface
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Supplier: ODG (Origin Data Global)
Description: 100GBPS CARRIER ETHERNET SWITCH
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Supplier: Lingto Electronic Limited
Description: 100GBPS CARRIER ETHERNET SWITCH
- Device Type: CardBus Controller, Sensor Interface
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Supplier: WAGO
Description: Interface module; RJ-45; RJ-45; Cat. 5; in mounting carrier
- TJ: -40 to 85 C
- Device Type: Sensor Interface
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Supplier: Renesas Electronics Corporation
Description: relationship. This re-sampling feature simplifies use of sample rates that do not have harmonic or integer frequency relationships to the input data rate and decouples the carrier from the DATACLK.brbr A complex quadrature modulator modulates the baseband data on a programmable carrier
- Form Factor: IC Chip
- Converter Type: Upconverter
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Supplier: Renesas Electronics Corporation
Description: mixers, a quadrature carrier NCO, digital filters, a resampling filter, a Cartesian-to-polar coordinate converter and an AGC loop.brbr The ISL5216 accepts four channels of 16-bit fixed or up to 14-bit mantissa/3-bit exponent floating point real or complex digitized IF samples which are mixed
- Converter Type: Downconverter
- Form Factor: IC Chip
- Applications: Mobile / Wireless Systems
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Supplier: Allied Electronics, Inc.
Description: PLCC Test Adapter Kits Test adapters designed for plastic-leaded chip carriers (PCC or PLCC) with “J” leads. Snap-ring design allows Quad Clip® Test Adapter to fit directly into IC, providing hands-free testing. Upper: 0.025" square pins, gold-plated, phosphor bronze. Lower:
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Supplier: Renesas Electronics Corporation
Description: The ISL5217 Quad Programmable UpConverter (QPUC) is a QASK/FM modulator/FDM upconverter designed for high dynamic range applications such as cellular basestations. The QPUC combines shaping and interpolation filters, a complex modulator, and timing and carrier NCOs into a single package. Each
- Form Factor: IC Chip
- Applications: Mobile / Wireless Systems
- Converter Type: Upconverter
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Supplier: QUALCOMM, Incorporated
Description: The Qualcomm® Snapdragon™ X5 LTE Modem was the mobile industry’s first to implement 4G LTE Advanced carrier aggregation, achieving and LTE Category 4 peak download data rates of up to 150Mbps by aggregation of two 10MHz LTE
- Data Rate: 50,000 to 150,000 kbps
- Technology: 3G Standard, CDMA, EDGE, GSM, WCDMA
- Device Type: Modem
- Features: Other
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Supplier: Richardson RFPD
Description: most of the licensed and unlicensed cellular bands. The DPD algorithm supports linearization on signal bandwidths up to 40 MHz depending on the power amplifier (PA) characteristics (for example, two adjacent 20 MHz carriers). The IC supports Rx bandwidths up to 100 MHz. It also
- Package Type: BGA
- Features: Other
- Device Type: Transceiver
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Supplier: Win Source Electronics
Description: Manufacturer: Exar Corporation Win Source Part Number: 1119546-XR2211ACP-F Packaging: Tube/Rail Mounting: Through Hole Power (Watts): 900mW Includes: Carrier Detector Family Name: XR2211A Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 70°C Case /
- TJ: 0 to 70 C
- Package Type: DIP, PDIP
- Features: Other
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Supplier: Richardson RFPD
Description: The AD5700/AD5700-1 are single-chip solutions, designed and specified to operate as a HART® FSK half-duplex modem, complying with the HART physical layer requirements. The AD5700/AD5700-1 integrate all of the necessary filtering, signal detection, modulating, demodulating and signal
- Features: Other
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Supplier: Win Source Electronics
Description: Manufacturer: Exar Corporation Win Source Part Number: 128927-XR2211ACD-F Packaging: Tube/Rail Mounting: SMD (SMT) Power (Watts): 900mW Includes: Carrier Detector Family Name: XR2211A Categories: Integrated Circuits Status: Obsolete(EOL) Temperature Range - Operating: 0°C to 70°C Case /
- TJ: 0 to 70 C
- Features: Other
- Package Type: SOIC
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Supplier: Skyworks Solutions, Inc.
Description: Darlington detector I/C, mounted and coupled in a custom hermetic surface mount leadless chip carrier (LCC) package that provides 1500 VDC electrical isolation between the input and output. The Darlington detector has an integrated base-to-emitter resistor for superior high temperature
- Isolation Voltage: 1,500 volts
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Supplier: Data Device Corporation (DDC)
Description: The BU-67401L is a dual MIL-STD-1553 dual transceiver that operates from a +3.3V power supply voltage. It operates in conjunction with "Harris" type encoder/decoders and comes in an ultra low profile and small footprint in a 48-pad Leadless Plastic Chip Carrier package (LPCC). The LPCC
- Supply Voltage: 3.3 V
- Device Type: CardBus Controller, Transceiver
- Features: Other, RoHS Compliant
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Supplier: Microchip Technology, Inc.
Description: grounded ‘G’ and isolated ‘IG’), TO-3, TO-39 and leadless chip carrier (LCC) packages. Additional Features Output Voltage Set Internally to ±1.5% on SG78xxA Input Voltage Range to 50 V max on SG78xxA 2 V Input-Output Differential Excellent Line and Load Regulation Fold back Current
- Regulated Output Voltage (Volt): 12 volts
- Output Current (IOUT): 2 amps
- Dropout Voltage (VD): 0.002 volts
- Volt Tolerance: 4.1 %
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Supplier: Microchip Technology, Inc.
Description: grounded ‘G’ and isolated ‘IG’), TO-3, TO-39 and leadless chip carrier (LCC) packages. Additional Features Output Voltage Set Internally to ±1.5% on SG78xxA Input Voltage Range to 50 V max on SG78xxA 2 V Input-Output Differential Excellent Line and Load Regulation Fold back Current
- Regulated Output Voltage (Volt): 20 volts
- Output Current (IOUT): 2.2 amps
- Dropout Voltage (VD): 0.002 volts
- Volt Tolerance: 1.5 %
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Supplier: Telit IoT Solutions, Inc.
Description: applications requiring this certification. The xE920 family is available in different variants with regional features and band-groups addressing requirements from major local carriers and partner networks in your region.
- Operating Frequency: 850 to 2,100 MHz
- Data Rate: 50,000 to 100,000 kbps
- TJ: -40 to 85 C
- Pin Count: 198 #
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Supplier: Broadcom Inc.
Description: The 5962-8876905K2A is a DSCC SMD highest reliability Class K two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temperature
- Isolation Voltage: 1,500 volts
- Rise Time: 0.045000000000000005 µs
- Collector Emitter Breakdown Voltage: 3 volts
- Operating Temperature: -55 to 125 C
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Supplier: Broadcom Inc.
Description: The HCPL-6531 is a high reliability Class H two channel hermetically sealed optocoupler in a 20 pad leadless ceramic chip carrier with solder dipped pads. The solder contains lead. The product is capable of operation and storage over the full military temp range and may also be
- Isolation Voltage: 1,500 volts
- Collector Emitter Breakdown Voltage: 5 volts
- Operating Temperature: -55 to 125 C
- Input: DC
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Multiple Chip-Addressing Modes SUMMIT 2629 has been designed to address the critical challenges that currently constrain 5G mmWave success, by: 1) Extending range to decrease carrier cost and improve customer satisfaction, 2) Reducing thermal and electrical power consumption (read more)
Browse RF Modules Datasheets for Richardson RFPD -
that has filled the skies with satellites. We are seeing additions from BeiDo, Galileo, Glosnoss, Michibiki, and NavIC among others. Each year a new constellation is being added and will begin sending millions of transmission and reception signals to and from earth (read more)
Browse Electrical Connectors Datasheets for Omnetics Connector Corporation
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
and chip developers have banked their hopes on virtual concatenation technology as the best way to make Ethernet connectivity cost-effective in the metro. Virtual concatenation, or Vcat, allows existing Sonet carriers to "right-size " their pipes in order to more efficiently allocate bandwidth
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
market into summer slump A series of conflicting data points in the semiconductor market point to a summer slump and modest growth rates in the overall IC business. Two apply carbon nanotubes to chip packaging, delivery Carbon Nanotechnologies Inc. (CNI) has agreed with Kostat Inc. to develop
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Commentary & analysis of week's chip news, Jan. 21-25 Wired communications chip sales will drop again due to carrier cuts, says report EL SEGUNDO, Calif. -- Semiconductor suppliers serving wired communications applications will market revenues drop 19.7% in 2002 to about $14 billion from last year's
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
EDAC stats show strong pc-board CAD growth A surprising surge in pc-board CAD revenue, and a sudden drop in IC layout revenue, highlight the market statistics survey results for the second quarter of 1999 released this week by The newest numbers totally reverse last year's trend, when pc-board CAD
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Systems Conference this week an Internet-based service for deploying and managing open source platforms. Wireless video set to run on DSPs As Sprint PCS and other carriers ready wireless video applications for delivery later this year, chip companies are racing to optimize MPEG-4 and other key audio
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
De Man calls for new breed of engineer, tools and methodologies For the IC design business industry to thrive in the post PC era, it will have to formalize system-on-chip (SOC) methodologies, create better architectural-level tools, and cultivate a new class of designer, called an SOC Architect
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EETimes.com | Electronics Industry News for EEs & Engineering Managers
Shift to 65-nm designs likely to be quick Many IC designers may quickly move past the 90-nm node for digital-dominated designs to 65-nm design rules. AMD set to launch dual-core Opterons AMD Inc. is widely expected to formally launch the first dual-core versions of its popular 64-bit Opteron server
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Indicates content that may require registration and/or purchase.
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Optical interconnects speed interprocessor nets
A number of candidate lightguide technologies are used for integrated optics, but few are compatible with the constraints of an IC chip carrier and the IC chip-attach- ment processes.
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Rotation- and translation-invariant pattern recognition based on distance transformations
One tested application has been the recognition of some different IC chip carriers .
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Printed Circuits Handbook, Seventh Edition > DIELECTRIC MATERIALS AND COATING METHODS
Some of these materials can be used in both IC chip carrier and PWB HDI applications.
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Money operated rice milling equipment.
To provide money-operated rice milling equipment that allows for digital money payment with the minimum necessary operations for securing degrees of freedom of handling of a proximity type noncontact IC chip carrier , such as a portable cellular phone. Solution.
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Printed Circuits Handbook, Sixth Edition > INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
Some of these materials can be used in both IC chip carrier and PWB HDI applications.
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Electronic Materials and Processes Handbook, Third Edition > Plastics, Elastomers, and Composites
Applications include low-loss radomes, printed-wiring boards, IC chip carriers , bobbins, and infrared switches.
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Microsensors MEMS and Smart Devices
More oflen than nbt, a moulded PCB is in essence an IC chip carrier package.
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Integrated Te To Tm Depolarization Modulator On LinbO3 Proton-Exchanged Channel Waveguides
After the proper heat treatment, the device was mounted and bounded on a specially designed IC chip carrier to facilitate performance measurement via edge coupling.