Products & Services
See also: Categories | Featured Products | Technical Articles | More Information-
Supplier: Ironwood Electronics, Inc.
Description: /MLF allow probing connection to all pins of the chip. A high density male to male adapter provides interconnect from the probe board to the target attached SMT feet. The SMT foot is simply soldered to the same pads as for the IC using standard soldering methods. The IC is
-
Supplier: DigiKey
Description: IC SOCKET, CHIP CARRIER, 1.27MM,
-
Supplier: Powell Electronics, Inc.
Description: 3M Chip Carrier Sockets, 8400 Series, 8
- Product Type: IC Socket
-
-
Supplier: Powell Electronics, Inc.
Description: Sockets for plastic leaded chip carriers
- Product Type: IC Socket
-
Supplier: Powell Electronics, Inc.
Description: Sockets for plastic leaded chip carriers
- Product Type: IC Socket
-
Supplier: Powell Electronics, Inc.
Description: Sockets for plastic leaded chip carriers
- Product Type: IC Socket
-
Supplier: VOXMICRO
Description: Form Factor M.2 (NGFF) Regular 2230 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5.1 Data Transfer Rates Up to
-
Supplier: VOXMICRO
Description: ) Technical Summary Form Factor M.2 (NGFF) 3030 E-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5
-
Supplier: VOXMICRO
Description: ) Technical Summary Form Factor M.2 (NGFF) 3042 B-Key Chipset Qualcomm QCA6391, with IC-external FEMs (RF360) Standard IEEE 802.11ax/ac/abgn dual band simultaneous Wi-Fi combo with BT5
-
Supplier: RS Components, Ltd.
Description: A spring assisted chip carrier extraction tool. Specially designed for the safe removal of PLCCâ??s from sockets without damage to component parts. Steel tongs inserted at the socket corners lift carriers with a simple squeeze on the tool grips Socket Type = PLCC
-
Supplier: Renesas Electronics Corporation
Description: The HSP50415 Wideband Programmable Modulator (WPM) is a quadrature amplitude modulator/upconverte r designed for wideband digital modulation. The WPM combines shaping and interpolation filters, a complex modulator, timing and carrier NCOs and dual DACs into a single package.brbr The HSP
- Form Factor: IC Chip
-
Supplier: ams
Description: The AS3933 is a 3-channel ASK receiver that generates a wake-up signal upon detection of a data signal with a carrier frequency in the range of 15 – 150 kHz. It can be used to wake-up active tags in RTLS, PKE and other similar tracking and access control systems.
- Data Rate: 0.5000 to 4 kbps
- Device Type: Receiver
- IC Package Type: QFN, TSSOP, Other
- Operating Frequency: 0.0150 to 0.1500 MHz
-
Supplier: ams
Description: The AS3932 is a 3-channel ASK receiver that generates a wake-up signal upon detection of a data signal with a carrier frequency in the range of 110 – 150 kHz. It can be used to wake-up active tags in RTLS, PKE and other similar tracking and access control systems.
- Data Rate: 0.5000 to 4 kbps
- Device Type: Receiver
- IC Package Type: QFN, TSSOP, Other
- Operating Frequency: 0.1100 to 0.1500 MHz
-
Supplier: ams
Description: The AS3930 is a single-channel ASK receiver that generates a wake-up signal upon detection of a data signal with a carrier frequency in the range of 110 – 150 kHz. It can be used to wake-up active tags in RTLS, PKE and other similar tracking and access control systems.
- Data Rate: 0.5000 to 4 kbps
- Device Type: Receiver
- IC Package Type: QFN, TSSOP, Other
- Pin Count: 16 #
-
Description: IC MIXER/CARRIER REMOVR 160-PQFP
- Device Type: Other
- IC Package Type: QFP
-
Supplier: Renesas Electronics Corporation
Description: mixers, a quadrature carrier NCO, digital filters, a resampling filter, a Cartesian-to-polar coordinate converter and an AGC loop.brbr The ISL5216 accepts four channels of 16-bit fixed or up to 14-bit mantissa/3-bit exponent floating point real or complex digitized IF samples which are mixed
- Applications: Mobile / Wireless Systems
- Form Factor: IC Chip
-
RF Upconverters and RF Downconverters - Four-Channel Programmable Digital DownConverter -- ISL5216KISupplier: Renesas Electronics Corporation
Description: mixers, a quadrature carrier NCO, digital filters, a resampling filter, a Cartesian-to-polar coordinate converter and an AGC loop.brbr The ISL5216 accepts four channels of 16-bit fixed or up to 14-bit mantissa/3-bit exponent floating point real or complex digitized IF samples which are mixed
- Applications: Mobile / Wireless Systems
- Form Factor: IC Chip
-
Supplier: Renesas Electronics Corporation
Description: : digital mixers, a quadrature carrier NCO, digital filters, a resampling filter, a Cartesian-to-polar coordinate converter and an AGC loop.brbr The HSP50216 accepts four channels of 16-bit real digitized IF samples which are mixed with local quadrature sinusoids. Each channel carrier
- Applications: Mobile / Wireless Systems
- Form Factor: IC Chip
-
Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation resistance 1000MΩ.
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
-
Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation resistance 1000MΩ.
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
-
Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation resistance 1000MΩ.
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
-
Supplier: Richardson RFPD
Description: The AD5700/AD5700-1 are single-chip solutions, designed and specified to operate as a HART® FSK half-duplex modem, complying with the HART physical layer requirements. The AD5700/AD5700-1 integrate all of the necessary filtering, signal detection, modulating, demodulating and signal
- IC Package Type: Other
-
Supplier: Richardson RFPD
Description: , covering most of the licensed and unlicensed cellular bands. The DPD algorithm supports linearization on signal bandwidths up to 40 MHz depending on the power amplifier (PA) characteristics (for example, two adjacent 20 MHz carriers). The IC supports Rx bandwidths up to 100 MHz. It
- Device Type / Applications: Transceiver
- IC Package Type: BGA, Other
- Supply Voltage: Other
-
Supplier: Data Device Corporation (DDC)
Description: The BU-67401L is a dual MIL-STD-1553 dual transceiver that operates from a +3.3V power supply voltage. It operates in conjunction with "Harris" type encoder/decoders and comes in an ultra low profile and small footprint in a 48-pad Leadless Plastic Chip Carrier package (LPCC). The LPCC
- Device Type / Applications: CardBus Controller, Transceiver
- IC Package Type: Other
- RoHS Compliant: Yes
- Supply Voltage: 3.3 V
-
Supplier: Microchip Technology, Inc.
Description: case grounded ‘G’ and isolated ‘IG’), TO-3, TO-39 and leadless chip carrier (LCC) packages. Additional Features Output Voltage Set Internally to ±1.5% on SG78xxA Input Voltage Range to 50 V max on SG78xxA 2 V Input
- IC Package Type: Other
- Regulator Category: Linear Regulator
-
Supplier: Skyworks Solutions, Inc.
Description: Darlington detector I/C, mounted and coupled in a custom hermetic surface mount leadless chip carrier (LCC) package that provides 1500 VDC electrical isolation between the input and output. The Darlington detector has an integrated base-to-emitter resistor for superior high
- Isolation Voltage: 1500 volts
-
Supplier: Broadcom Inc.
Description: The HCPL-673K is a two channel hermetically sealed optocoupler in a 20 pad Leadless Ceramic Chip Carrier package with solder dipped pads and the highest level of reliability (Class K). The solder contains lead. The product is capable of operation and storage over the full military
- Collector Emitter Breakdown Voltage: 5 volts
- Isolation Voltage: 1500 volts
- Mounting Option: Surface Mount
- Operating Temperature: -55 to 125 C
-
Supplier: TapeOnline.com
Description: Magnetic Layers have twice the remnant magnetic flux density of Metal Particle (MP) coatings, for higher performance, while the DLC (Diamond-Like Carbon) protective layer improves durability of your Sony MiniDV tape. Sony Mini DV tapes DVC-60 tapes are also available with an IC memory
-
Supplier: FX PCB Co., Ltd.
Description: brighter LEDs. Applications of BT PCB BT PCB was used only in chip packaging at the beginning, but it comes in many types now, such as: High-performance copper-clad laminates Chip carrier boards High-frequency copper-clad laminates Resin
Find Suppliers by Category Top
Featured Products Top
-
chip. This integration allows ICs to perform complex tasks efficiently while taking up minimal space. You can think of an IC as the "brain" behind the functionality of modern devices. It processes data, manages power, and controls various operations. For example, the IC in your smartphone (read more)
Browse Microcontrollers (MCU) Datasheets for ODG (Origin Data Global) -
Multiple Chip-Addressing Modes SUMMIT 2629 has been designed to address the critical challenges that currently constrain 5G mmWave success, by: 1) Extending range to decrease carrier cost and improve customer satisfaction, 2) Reducing thermal and electrical power consumption (read more)
Browse RF Modules Datasheets for Richardson RFPD -
-performance copper-clad laminates Chip carrier boards High-frequency copper-clad laminates Resin-coated copper foils This variety has made BT boards useful in many different industries. Characteristics of BT circuit board Resin (read more)
Browse Printed Circuit Substrate Materials (PCB / PWB) Datasheets for FX PCB Co., Ltd. -
that has filled the skies with satellites. We are seeing additions from BeiDo, Galileo, Glosnoss, Michibiki, and NavIC among others. Each year a new constellation is being added and will begin sending millions of transmission and reception signals to and from earth (read more)
Browse Electrical Connectors Datasheets for Omnetics Connector Corporation
Conduct Research Top
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
and chip developers have banked their hopes on virtual concatenation technology as the best way to make Ethernet connectivity cost-effective in the metro. Virtual concatenation, or Vcat, allows existing Sonet carriers to "right-size " their pipes in order to more efficiently allocate bandwidth
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
market into summer slump A series of conflicting data points in the semiconductor market point to a summer slump and modest growth rates in the overall IC business. Two apply carbon nanotubes to chip packaging, delivery Carbon Nanotechnologies Inc. (CNI) has agreed with Kostat Inc. to develop
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
. Commentary & analysis of week's chip news, Jan. 21-25 Wired communications chip sales will drop again due to carrier cuts, says report EL SEGUNDO, Calif. -- Semiconductor suppliers serving wired communications applications will market revenues drop 19.7% in 2002 to about $14 billion from last year's
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
EDAC stats show strong pc-board CAD growth A surprising surge in pc-board CAD revenue, and a sudden drop in IC layout revenue, highlight the market statistics survey results for the second quarter of 1999 released this week by The newest numbers totally reverse last year's trend, when pc-board CAD
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
Systems Conference this week an Internet-based service for deploying and managing open source platforms. Wireless video set to run on DSPs As Sprint PCS and other carriers ready wireless video applications for delivery later this year, chip companies are racing to optimize MPEG-4 and other key audio
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
De Man calls for new breed of engineer, tools and methodologies For the IC design business industry to thrive in the post PC era, it will have to formalize system-on-chip (SOC) methodologies, create better architectural-level tools, and cultivate a new class of designer, called an SOC Architect
-
EETimes.com | Electronics Industry News for EEs & Engineering Managers
Shift to 65-nm designs likely to be quick Many IC designers may quickly move past the 90-nm node for digital-dominated designs to 65-nm design rules. AMD set to launch dual-core Opterons AMD Inc. is widely expected to formally launch the first dual-core versions of its popular 64-bit Opteron server
More Information Top
Indicates content that may require registration and/or purchase.
-
Optical interconnects speed interprocessor nets
A number of candidate lightguide technologies are used for integrated optics, but few are compatible with the constraints of an IC chip carrier and the IC chip-attach- ment processes.
-
Rotation- and translation-invariant pattern recognition based on distance transformations
One tested application has been the recognition of some different IC chip carriers .
-
Printed Circuits Handbook, Seventh Edition > DIELECTRIC MATERIALS AND COATING METHODS
Some of these materials can be used in both IC chip carrier and PWB HDI applications.
-
Money operated rice milling equipment.
To provide money-operated rice milling equipment that allows for digital money payment with the minimum necessary operations for securing degrees of freedom of handling of a proximity type noncontact IC chip carrier , such as a portable cellular phone. Solution.
-
Printed Circuits Handbook, Sixth Edition > INTRODUCTION TO HIGH-DENSITY INTERCONNECTION (HDI) TECHNOLOGY
Some of these materials can be used in both IC chip carrier and PWB HDI applications.
-
Electronic Materials and Processes Handbook, Third Edition > Plastics, Elastomers, and Composites
Applications include low-loss radomes, printed-wiring boards, IC chip carriers , bobbins, and infrared switches.
-
Microsensors MEMS and Smart Devices
More oflen than nbt, a moulded PCB is in essence an IC chip carrier package.
-
Integrated Te To Tm Depolarization Modulator On LinbO3 Proton-Exchanged Channel Waveguides
After the proper heat treatment, the device was mounted and bounded on a specially designed IC chip carrier to facilitate performance measurement via edge coupling.