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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30-2 is a low viscosity, two component epoxy resin compound for high performance bonding, laminating and sealing formulated to cure at room temperature or more rapidly at elevated temperatures with a 100/10 mix ratio by weight. This resin system is 100%
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 16 µin/in-F
- Dissimilar Substrates: Yes
- Features: Thermal / Heat Insulating, Electrical Insulation / Dielectric, Flexible / Dampening, Non-corrosive Cure
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
- Dissimilar Substrates: Yes
- Features: Electrical Insulation / Dielectric, Flexible / Dampening, Non-corrosive Cure
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
- Dissimilar Substrates: Yes
- Features: Electrical Insulation / Dielectric, Flexible / Dampening, Non-corrosive Cure
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Supplier: Master Bond, Inc.
Description: With a glass transition temperature exceeding 175°C, EP30-3LO combines superior chemical resistance along with passing NASA low outgasing testing requirements. It has an easy to use 100 to 30 mix ratio by weight, and while it requires heat curing, it offers a long open time of 6-10 hours for
- Chemical / Polymer System Type: Epoxy (EP)
- Dissimilar Substrates: Yes
- Features: Thermal / Heat Insulating, Electrical Insulation / Dielectric, Non-corrosive Cure
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV, Marine, OEM / Industrial, Optical Grade / Material, Tooling / Mold Material
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RF and Microwave Laminates - Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive -- Pyralux® LFSupplier: DuPont Electronics & Imaging
Description: High bond strength High thermal resistance Halogen-free Low outgassing, NASA data available No refrigeration required for storage Able to withstand multiple lamination cycles without degradation Two-year product performance warranty
- Features: Tested to IPC
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®), Specialty / Other
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Supplier: DuPont Electronics & Imaging
Description: DuPont™ Pyralux® AP is an all polyimide double sided copper clad laminate that is the industry standard in terms of thermal, chemical and mechanical properties. It is ideal for use in rigid flex and multilayer flex applications which require advanced performance, such as low
- Features: Tested to IPC, UL Listed
- Length: 7.08 ft
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Temperature Resistance: 200 C
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Supplier: DuPont Electronics & Imaging
Description: tolerance/electrical performance High adhesion Halogen-free Low outgassing Bonding Film Features: Able to withstand multiple lamination cycles without degradation Excellent encapsulation and conformation over circuitry
- Features: Tested to IPC, UL Listed
- Length: 250 ft
- Materials of Construction: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Temperature Resistance: 225 C
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Supplier: DuPont Electronics & Imaging
Description: High bond strength High thermal resistance Halogen-free Low outgassing, NASA data available No refrigeration required for storage Able to withstand multiple lamination cycles without degradation Two-year product performance warranty
- Chemical / Polymer System Type: Specialty / Other, Acrylic / Polyacrylate
- Features: Encapsulating / Potting
- Industry: Electronics, OEM / Industrial
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Supplier: Can-Do National Tape
Description: designed for temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear values even at elevated temperatures. They also offer low “outgassing” properties, which is an important consideration for the aerospace, automotive
- Adhesive: Pressure Sensitive (PSA)
- Type: Transfer
- Width: 48 inches
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Supplier: Can-Do National Tape
Description: temperature exposure to 450°F (232°C) for short periods of time and/or solvent resistance. They have exceptional shear values even at elevated temperatures. They also offer low “outgassing” properties, which is an important consideration for the aerospace, automotive and
- Adhesive: Pressure Sensitive (PSA)
- Type: Transfer
- Width: 48 inches
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Journal of Spacecraft and Rockets > Review of Inflatable Booms for Deployable Space Structures: Packing and Rigidization
Thermally cured resins are compatible with a wide range of reinforcing fibers and can be used to create laminates with low outgassing , good space resilience, and a low CTE.
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Rogers To Display Advanced Materials For Defense Applications At DMC 2010
Compatible with lead-free-solder processes, these reliable laminates have low outgassing characteristics for use in space-based, vacuum environments.
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Space platform for student CubeSat pico-satellite
PSU printed circuit board for the main board is manufactured using FR-4 laminate (homogenous, low outgassing in vacuum) covered with 17 um copper foil.
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Fermilab Main Ring ion profile monitor system
Future boards will be made using a Teflon@-glass laminate material which has a much lower outgassing rate.
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COSMO SkyMed active phased array SAR instrument
• CTE in X and Y axes similar to the copper CTE = 16ppm/°C • Low loss factor • Low dielectric constant • Low outgassing 2) Metallization of the RF laminate material 3) Adhesive for RF laminate material • Adherence capabilities on the…
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Design and fabrication of a lightweight 2-m telescope for the balloon-borne large-aperture submillimeter telescope: BLAST
Components were machined from the laminate and bonded together using high strength, low outgassing adhesives.
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High-performance TFTs fabricated on plastic substrates
In addition to good adhesion, laminated wafers need to with- stand process chemicals and to have very low outgassing rates not to contaminate deposition chambers.
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Gossamer Spacecraft: Membrane And Inflatable Structures Technology For Space Applications > Rigidization Mechanisms And Materials
However, using films to encase the laminates and MLI blankets to surround the structure results in extremely low system outgassing .
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Smooth-Surfaced Carbon/Carbon Reflector Panels
Surface-densification technique integral to fabrication of reflective, lightweight, low - outgassing radio-antenna-reflector panels including carbon/carbon surface laminates supported by carbon/carbon core structures.
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Advances in Electrostatic Dust Detection on Remote Surfaces
The substrate was woven glass reinforced polytetrafluorethylene (PTFE) microwave laminate substrate (Ultralam 2000) that is classified by NASA as a low outgassing material.