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Supplier: Master Bond, Inc.
Description: not contain any solvents or other volatiles. It is especially recommended where low viscosity is required for ease of application and applications in which bonded assemblies must exhibit superior dimensional stability. Shrinkage upon cure is exceptionally low - 0.0003 inches/inch.
- Use Temperature: -60 to 300 F
- Coeff. of Thermal Expansion (CTE): 16 µin/in-F
- Tensile Strength (Break): 8,000 psi
- Dielectric Strength: 400.00000000000006 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30AN-1 is a two part epoxy for high performance potting, sealing, coating and bonding featuring exceptionally high thermal conductivity, excellent electrical insulation properties and NASA low outgassing approval. It will cure at room temperature or more
- Viscosity: 20,000 to 30,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 3.603 W/m-K
- Coeff. of Thermal Expansion (CTE): 14 µin/in-F
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP30LTE-LO is a recently developed thermal shock resistant epoxy resin system with uniquely low thermal expansion properties and unmatched dimensional stability for high performance bonding, sealing and casting. This new two component epoxy resin compound which
- Viscosity: 25,000 to 30,000 cP
- Use Temperature: -60 to 250 F
- Thermal Conductivity: 0.721 W/m-K
- Coeff. of Thermal Expansion (CTE): 22 µin/in-F
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Supplier: Master Bond, Inc.
Description: Supreme 12AOHT-LO is a toughened system with superior resistance to aggressive thermal cycling and shock. Cryogenically serviceable, it combines superior thermal conductivity with reliable electrical insulation properties. This dimensionally stable epoxy has formidable bond strength, particularly
- Use Temperature: -452 to 500 F
- Thermal Conductivity: 1.3 to 1.44 W/m-K
- Tensile Strength (Break): 7,000 to 8,000 psi
- Dielectric Strength: 400.00000000000006 to 450.00000000000006 kV/in
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RF and Microwave Laminates - Copper Clad Laminate, Coverlay, Bondply & Sheet Adhesive -- Pyralux® LFSupplier: DuPont Electronics & Imaging
Description: resistance Halogen-free Low outgassing, NASA data available No refrigeration required for storage Able to withstand multiple lamination cycles without degradation Two-year product performance warranty Pyralux® LF Copper-Clad Laminate Pyralux® LF acrylic based laminates
- Materials: Plastic / Polymer, Polyimide (e.g., Kapton®)
- Features: Specialty / Other, Tested to IPC
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Supplier: DuPont Electronics & Imaging
Description: performance in the most demanding applications Low CTE for rigid flex multilayers Superior electrical performance and signal integrity (Dk = 3.4, Df = 0.002) Robust thermal resistance High tear and peel strengths Excellent dielectric thickness tolerance Low outgassing, NASA data
- Thickness: 0.02 inches
- Width: 24 inches
- Length: 7.083333333333333 ft
- Temperature Resistance: 200 C
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Supplier: DuPont Electronics & Imaging
Description: reliability System Features: >225°C IPC service temperature Excellent thermal resistance UL 94V-0 Low loss characteristics Excellent punching and drilling performance Excellent dielectric thickness tolerance/electrical performance High adhesion Halogen-free Low outgassing
- Thickness: 0.003 inches
- Width: 24 inches
- Length: 250 ft
- Temperature Resistance: 225 C
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Supplier: Allied Electronics, Inc.
Description: and low temperature, low out-gassing and chemical resistant applications, improved electrical, and provides quick identification and circuit tracing, along with easy breakouts for circuit routing.
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Supplier: Can-Do National Tape
Description: temperature attachment (short term up to 450°F) in the aerospace and electronics industries Meets NASA low outgassing specifications because of its low outgassing properties Use for flex circuit attachment Caliper-controlled liner for rotary die-cutting. For adhering,
- Width: 48 inches
- Adhesive: Pressure Sensitive (PSA), Transfer
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Supplier: DuPont Electronics & Imaging
Description: resistance Halogen-free Low outgassing, NASA data available No refrigeration required for storage Able to withstand multiple lamination cycles without degradation Two-year product performance warranty Pyralux® LF Coverlay and Pyralux® LF Bondply DuPont™ Pyralux® LF coverlay (bondply)
- Chemical System: Acrylic / Polyacrylate
- Features: Die Bonding Adhesive / Compound, Encapsulating / Potting, Film / Sheet, Specialty / Other
- Industry: Electronics, OEM / Industrial
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Journal of Spacecraft and Rockets > Review of Inflatable Booms for Deployable Space Structures: Packing and Rigidization
Thermally cured resins are compatible with a wide range of reinforcing fibers and can be used to create laminates with low outgassing , good space resilience, and a low CTE.
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Rogers To Display Advanced Materials For Defense Applications At DMC 2010
Compatible with lead-free-solder processes, these reliable laminates have low outgassing characteristics for use in space-based, vacuum environments.
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Space platform for student CubeSat pico-satellite
PSU printed circuit board for the main board is manufactured using FR-4 laminate (homogenous, low outgassing in vacuum) covered with 17 um copper foil.
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Fermilab Main Ring ion profile monitor system
Future boards will be made using a Teflon@-glass laminate material which has a much lower outgassing rate.
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COSMO SkyMed active phased array SAR instrument
• CTE in X and Y axes similar to the copper CTE = 16ppm/°C • Low loss factor • Low dielectric constant • Low outgassing 2) Metallization of the RF laminate material 3) Adhesive for RF laminate material • Adherence capabilities on the…
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Design and fabrication of a lightweight 2-m telescope for the balloon-borne large-aperture submillimeter telescope: BLAST
Components were machined from the laminate and bonded together using high strength, low outgassing adhesives.
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High-performance TFTs fabricated on plastic substrates
In addition to good adhesion, laminated wafers need to with- stand process chemicals and to have very low outgassing rates not to contaminate deposition chambers.
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Gossamer Spacecraft: Membrane And Inflatable Structures Technology For Space Applications > Rigidization Mechanisms And Materials
However, using films to encase the laminates and MLI blankets to surround the structure results in extremely low system outgassing .
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Smooth-Surfaced Carbon/Carbon Reflector Panels
Surface-densification technique integral to fabrication of reflective, lightweight, low - outgassing radio-antenna-reflector panels including carbon/carbon surface laminates supported by carbon/carbon core structures.
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Advances in Electrostatic Dust Detection on Remote Surfaces
The substrate was woven glass reinforced polytetrafluorethylene (PTFE) microwave laminate substrate (Ultralam 2000) that is classified by NASA as a low outgassing material.