Medical Device Epoxy Adhesives

Description: Loctite Hysol 30680 amber M-121HP medical device epoxy adhesive is compatible with ceramic, glass, metal, pvc and thermoplastic materials. Provides a 2 hr working time. Works in a mix ratio of 2:1. Delivers great performance with tensile strength of 5910 psi. Minimum to

• Viscosity: 110,000 cP
• Use Temperature: -65 to 300 F
• Features: Epoxy (EP), Leveling / Filling Compound
• Industry: Medical / Food (Sanitary / FDA)

Description: Loctite Hysol 30671 off-white M-21HP medical device epoxy adhesive is compatible with ceramic, glass, metal and thermoplastic materials. Provides a 20 min working time. Works in a mix ratio of 2:1. Delivers great performance with tensile strength of 5700 psi. Minimum to

• Viscosity: 37,000 cP
• Use Temperature: -65 to 300 F
• Features: Epoxy (EP), Leveling / Filling Compound
• Industry: Medical / Food (Sanitary / FDA)

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 1,800 to 3,600 cP
• Use Temperature: 572 F
• Thermal Conductivity: 12.6 to 26.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F

Description: Henkel Loctite 3981 is a low viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to

• Viscosity: 4,000 to 6,000 cP
• Tensile Strength (Break): 8,970 psi
• Elongation: 2.98 %
• Features: Epoxy (EP)

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 25,000 to 45,000 cP
• Use Temperature: 482 F
• Thermal Conductivity: 2.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 51.99999999999999 to 88.99999999999999 µin/in-F

Description: steel cannula as the center, syringe and lancet assembly. It is suitable for the assembly of disposable medical devices.

• Features: Epoxy (EP), Specialty / Other
• Cure / Technology: Single Component System

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 800 to 1,600 cP
• Use Temperature: 482 F
• Thermal Conductivity: 1.4 W/m-K
• Coeff. of Thermal Expansion (CTE): 26.666666666666664 to 83.33333333333333 µin/in-F

Description: Henkel Loctite 3984 is a high viscosity, heat curing epoxy adhesive suitable for applications that require fast cure, excellent environmental resistance and high adhesion. The product cures rapidly when exposed to temperatures as low as 100 °C and achieves excellent adhesion to

• Viscosity: 22,000 to 28,000 cP
• Tensile Strength (Break): 5,540 psi
• Elongation: 1.1 %
• Features: Epoxy (EP)

Description: Henkel Loctite EA M-121HP is a non-sagging, room temperature curing epoxy adhesive that cures to form a tough bond line with excellent resistance to peel and impact forces. It is ISO 10993 Biological Tested for use in the assembly of disposable medical devices. 50 mL

• Viscosity: 2,000 to 61,000 cP
• Tensile Strength (Break): 5,910 psi
• Elongation: 10 %
• Dielectric Strength: 650.2400000000014 kV/in

Description: EPO-TEK® offers a full suite of electrically and thermally conductive epoxy adhesives. Our extensive product line allows users from a wide range of industries to easily select the optimal adhesive for their specific application, based on the best combination of physical,

• Viscosity: 1,800 to 3,600 cP
• Use Temperature: -67 to 572 F
• Thermal Conductivity: 12.6 to 26.3 W/m-K
• Coeff. of Thermal Expansion (CTE): 21.11111111111111 to 52.22222222222222 µin/in-F

Description: Loctite Hysol 30673 clear M-31CL medical device adhesive is compatible with ceramic, glass, metal and thermoplastic materials. Provides a 30 min working time. Works in a mix ratio of 2:1. Delivers great performance with tensile strength of 8000 psi. Minimum to maximum operating

• Viscosity: 6,000 cP
• Use Temperature: -65 to 300 F
• Features: Epoxy (EP), Leveling / Filling Compound
• Industry: Medical / Food (Sanitary / FDA)

Description: sealing, coating and encapsulation applications in the medical device industry.

• Use Temperature: -60 to 250 F
• Thermal Conductivity: 1.2981 to 1.4423 W/m-K
• Coeff. of Thermal Expansion (CTE): 12.219999999999999 to 13.889999999999999 µin/in-F
• Tensile Strength (Break): 5,000 to 6,000 psi

Description: Master Bond EP41S-5Med is a two part epoxy system that meets the requirements of ISO 10993-5 for non-cytotoxicity and can be used for bonding, sealing, and coating in medical devices. This epoxy was tested against many sterilization methods, such as autoclaving, STERRAD®,

• Applied Thickness / Gap Fill: 0.004 to 0.006 inch
• Viscosity: 25,000 to 30,000 cP
• Use Temperature: -80 to 450 F
• Coeff. of Thermal Expansion (CTE): 19.444444444444443 to 22.22222222222222 µin/in-F

Description: LOCTITE ABLESTIK FDA 2 BIPAX, Epoxy, Medical LOCTITE® ABLESTIK FDA 2 BIPAX is designed for medical device applications. This material bonds offer resistance to water, weather, galvanic action, petroleum solvents, lubricants, fuels, mild acids and alkalis and other organic

• Viscosity: 14,000 cP
• Use Temperature: 103 to 293 F
• Features: Epoxy (EP)
• Industry: Medical / Food (Sanitary / FDA)

Description: LOCTITE® M-31CL Hysol Medical Device Epoxy Structural Adhesive is an ultra clear, low viscosity adhesive that bonds glass, ceramic, metal, and many rigid plastics. Ideal for applications where optical clarity and excellent structural and mechanical properties are

• Viscosity: 6,000 cP
• Use Temperature: 65 to 300 F
• Industry: Medical / Food (Sanitary / FDA), Optical Grade / Material

Description: electrical conductivity. A heating oven is recommended for faster curing times. Uses for G6E-SG™ epoxy include photovoltaic cells, EMI / RFI shielding, medical device assembly and repair, etc. FEATURES: · Silver-Graphene Filled (Non-Magnetic) · Excellent Electrical Conductivity

• Viscosity: 110,000 to 120,000 cP
• Use Temperature: 77 to 302 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Grease / Paste, Other, Specialty / Other

Description: adhesive properties of a traditional adhesive. This product is unique in that it also requires strong electrical resistance, thereby broadening its range of possible applications. To achieve this, the G6E-TSHV™ Epoxy is formulated with a blend of proprietary nanomaterials,

• Viscosity: 400,000 to 450,000 cP
• Use Temperature: 77 to 302 F
• Thermal Conductivity: 2.9 W/m-K
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Medical / Food (Sanitary / FDA)

Description: epoxy’s properties result from being formulated with proprietary nanomaterials and fillers. G6E-FRP™ epoxy is low cost (compared with silver). A heating oven is highly recommended during curing. Uses for G6E-FRP™ epoxy include flexible circuits, medical sensor assembly

• Viscosity: 285,000 to 295,000 cP
• Use Temperature: 77 to 248 F
• Industry: Aerospace, Automotive, Electrical Power / HV, Electronics, Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: EMI / RFI Shielding Material, Electrically Conductive, Epoxy (EP), Filled, Flexible / Dampening, Grease / Paste, Other, Specialty / Other

Description: Master Bond EP62-1HTMed is a two part epoxy that meets the requirements of ISO 10993-5 for non-cytotoxicity and therefore can be utilized in many medical device applications.

• Use Temperature: -60 to 450 F
• Tensile Strength (Break): 2,600 psi
• Elongation: 3 to 5 %
• Dielectric Constant (Relative Permittivity): 4.2

Description: Master Bond Polymer System EP62-1Med is a two component epoxy adhesive, sealant, coating, and encapsulant featuring outstanding temperature and chemical resistance. It has wide applicability for use in medical devices, particularly because of its ability to withstand

• Viscosity: 8,000 to 10,000 cP
• Use Temperature: -60 to 400 F
• Coeff. of Thermal Expansion (CTE): 19.444444444444443 to 22.22222222222222 µin/in-F
• Tensile Strength (Break): 8,900 psi

Description: resistance and high shear strengths. The fully cured epoxy is resistant to a wide range of chemicals and solvents, and acts as an excellent electrical insulator. Suitable for use in the assembly of disposable medical devices. ISO 10993 compliant for use in the assembly of

• Substrate Compatibility: Ceramic / Glass, Metal, Plastic
• Features: Epoxy (EP)
• Industry: Medical / Food (Sanitary / FDA)

Description: A medium viscosity epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI approval.

• Viscosity: 1,700 cP
• Industry: Electronics
• Cure / Technology: Room Temp. Cure / Vulcanizing

Description: (Known as Hysol TRA-BOND FDA2 ) A thixotropic epoxy resin paste system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests in vivo and received Class VI approval.

• Viscosity: 9,000 cP
• Industry: Electronics
• Cure / Technology: Room Temp. Cure / Vulcanizing, Two Component System

Description: The Nordson EFD Mikros™ dispensing pen features a 0.25cc reservoir that reduces waste while delivering consistent microdot control of medium viscosity assembly fluids. Ideal for micro-deposits of two-part epoxies, UV-cure adhesives, and other fluids, the dispensing pen makes it easy to bond

• Container Size: 0.025 cc
• Application: Adhesive / Silicone
• Dispensed From: Barrel / Syringe
• Dispensing Type: Bead, Dot

Description: die bonding processes Jetting silicone phosphor in the LED assembly process Jetting under-fill in micro-electronic package applications on PCBA Jetting micro dots of UV adhesive in medical device applications

• Shot Size: 0.000002000211225939454 cc
• Media Viscosity: 7,000 to 2,000,000 cps
• Application: Adhesive / Silicone
• Material Feed: Batch (Syringe)

Description: lower than polyamide materials. ADHESIVE LAYER Adhesives are not used in all flexible printed circuit boards. There are boards that have only a base material and a conductive layer in their composition, without the use of adhesive. But most products require an adhesive

• Thickness: 0.011811023622047244 inches
• Type: Film / Flexible Substrate

Description: is used in far-infrared and infrared military devices such as infrared and far-infrared views, night vision camera systems, and night vision cameras, also among other devices. Additionally, this glass is also used in space technology instruments, satellites,s and indifferent works

• Thickness: 0.01968503937007874 to 0.15748031496062992 inches
• Features: Specialty / Other

Description: No Description Provided

• Use Temperature: 230 F
• Substrate Compatibility: Ceramic / Glass, Composites, Concrete / Masonry, Dissimilar Substrates, Metal, Paper / Paperboard, Porous Surfaces
• Features: Epoxy (EP), Other, Polyurethane (PU, PUR), Rubber Based / Elastomeric
• Industry: Medical / Food (Sanitary / FDA), OEM / Industrial

Description: ANE-57103 is a toughened two part adhesive. ANE-57103 is used for high speed bonding even at lower temperatures. ANE-57103is specifically developed for bonding difficult substrates such as glass, ceramics, metals and engineered plastics. Proven applications are bonding MRI magnets under full

• Viscosity: 10,000 cP
• Use Temperature: -50 to 130 F
• Tensile Strength (Break): 4,500 psi
• Dielectric Constant (Relative Permittivity): 4.3

Description: 20-3068 is a room temperature curing, two component, epoxy potting compound, adhesive, and coating system. The 20-3068 meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA

• Viscosity: 3,500 cP
• Coeff. of Thermal Expansion (CTE): 34.44444444444444 µin/in-F
• Tensile Strength (Break): 10,600 psi
• Elongation: 6 %

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 180 F
• Features: Epoxy (EP), Other, Specialty / Other
• Industry: Medical / Food (Sanitary / FDA), OEM / Industrial

Description: 10-3039 is a room temperature curing, two component epoxy. This system meets the Food and Drug Administration (FDA) regulations permitting use in food contact applications. When properly cured, these products comply with the FDA regulations of Title 21 Code of Federal Regulations under

• Viscosity: 175,000 to 800,000 cP
• Use Temperature: -40 to 266 F
• Tensile Strength (Break): 8,600 psi
• Elongation: 3.7 %

Description: DuPont™ Pyralux® HP is an epoxy-based adhesive system demonstrating both low loss and high reliability, specifically designed for OEMs and PCB design manufacturers. Its optimized low-loss solution is suitable for multi-layer flex and rigid-flex designs for military, automotive and

• Industry: Automotive, Electronics, Medical / Food (Sanitary / FDA), Military / Government (MIL-SPEC / GG), OEM / Industrial
• Features: Die Bonding Adhesive / Compound, Epoxy (EP)

Description: fiber including: carbon, glass, aramid, hybrid materials, etcetera. Equipment includes: • Uni-tape production at 1m width • Woven fabric prepreg at 12″ to 62″ width • Adhesive filming at 50" width • Towpreg production • Large capacity resin mixing facility • Large capacity 0°F and 40°F cold

• Use Temperature: 200 F
• Features: Epoxy (EP), Other, Specialty / Other
• Industry: Marine, Medical / Food (Sanitary / FDA), OEM / Industrial