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Supplier: Kistler Group
Description: The Type 8316A... capacitive accelerometer family utilizes a silicon Micro-Electro Mechanical System (MEMS) variable capacitance sensing element. Each axis consists of a very small inertial mass and a flexure element cantilever positioned between two plates. As the mass deflects under
- Acceleration: 2 to 200 g
- Device Type: Sensor / Transducer
- Frequency Range: 0.0 to 7000 Hz
- Maximum Shock: 6000 g
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Supplier: Kistler Group
Description: Type 8396A... triaxial capacitive accelerometer family utilizes a silicon Micro-Electro-Mechan ical System (MEMS) variable capacitance sensing element. The sensing element of each axis consists of a very small inertial mass and a flexure element cantilever positioned between two
- Acceleration: 2 to 200 g
- Device Type: Sensor / Transducer
- Frequency Range: 0.0 to 7000 Hz
- Maximum Shock: 6000 g
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: set to a different address code, long distance series with multiple sensors to facilitate multi-point measurement and data analysis.AKE392B-Wir eless is a monocrystalline silicon capacitive sensor, composed by a silicon chip of micro-mechanical treatment, low power ASIC for the
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Frequency Range: 5 to 300 Hz
- Number of Axes: Triaxial
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: stability .etc characteristics to guarantee the reliability of outstanding output. AKE390B is a monocrystalline silicon capacitive sensor, composed by a silicon chip of micro-mechanical treatment, low power ASIC for the signal adjustment, a microprocessor for storing compensation value
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: Shenzhen Rion Technology Co., Ltd
Description: stability .etc characteristics to guarantee the reliability of outstanding output. AKE398B is a monocrystalline silicon capacitive sensor, composed by a silicon chip of micro-mechanical treatment, low power ASIC for the signal adjustment, a microprocessor for storing compensation value
- Acceleration: 1 to 40 g
- Device Type: Sensor / Transducer
- Number of Axes: Triaxial
- Operating Temperature: -40 to 185 F
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Supplier: SICK
Description: Inclination sensors take a non-contact measurement of the inclination angle of an object in relation to the earth's gravity. Thanks to the use of capacitive MEMS technology, inclination sensors are both highly precise and extremely reliable. One-dimensional sensors
- Accuracy: 0.0100 to 0.1000 degrees
- Form Factor: Module / Standalone
- Number of Axes: 1 to 2
- Output: Analog
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Supplier: Qorvo
Description: The Qorvo FT-7600 MEMS Force sensor represents the World’s smallest force sensor and the easiest sensor to integrate, as it only requires attachment to the under-side of a sensing surface. At 0.8mm x 1.2mm, it is designed to fit into small form factor and to serve a broad
- Application: Weigh Scales, Other
- Category of Device: Sensor Element / Chip
- Operating Temperature: -4 to 158 F
- Sensor Output: Analog Voltage
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Supplier: Qorvo
Description: The FT-4x00 series MEMS Force sensor represents the highest performance, smallest size and most reliable force sensing solution in the market. Designed to serve a broad range of applications such as buttons, sliders and screens, the FT-4x00 series can be used with or without
- Application: Weigh Scales, Other
- Category of Device: Sensor Element / Chip
- Operating Temperature: -40 to 185 F
- Sensor Output: Analog Voltage
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Supplier: Qorvo
Description: The FT-4x00 series MEMS Force sensor represents the highest performance, smallest size and most reliable force sensing solution in the market. Designed to serve a broad range of applications such as buttons, sliders and screens, the FT-4x00 series can be used with or without
- Application: Weigh Scales, Other
- Category of Device: Sensor Element / Chip
- Operating Temperature: -40 to 221 F
- Sensor Output: Analog Voltage
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Supplier: Qorvo
Description: The FT-4x00 series MEMS Force sensor represents the highest performance, smallest size and most reliable force sensing solution in the market. Designed to serve a broad range of applications such as buttons, sliders and screens, the FT-4x00 series can be used with or without
- Application: Weigh Scales, Other
- Category of Device: Sensor Element / Chip
- Operating Temperature: -4 to 158 F
- Sensor Output: Analog Voltage
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Supplier: Jewell Instruments, LLC
Description: Jewell Instruments AKA Series Accelerometers are an excellent choice for cost to performance trade-off. The AKA is based on silicon micro-machined MEMS Capacitive Accelerometer technology and designed for low power and high stability. • Triaxial Configuration • Measuring
- Acceleration: 2 to 40 g
- Device Type: Sensor / Transducer
- Features: Sealed
- Frequency Range: 500 Hz
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Supplier: Jewell Instruments, LLC
Description: Jewell Instruments DKA Series Accelerometers are an excellent choice for cost to performance trade off. The DKA is based on silicon micro-machined MEMS Capacitive Accelerometer technology and designed for low power and high stability. • Triaxial Configuration • Measuring
- Acceleration: 2 to 40 g
- Device Type: Sensor / Transducer
- Features: Sealed
- Frequency Range: 500 Hz
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Supplier: Jewell Instruments, LLC
Description: Jewell Instruments DMA Series Accelerometers are an excellent choice for cost to performance trade off. The DMA is based on silicon micro-machined MEMS Capacitive Accelerometer technology and designed for low power and high stability. Features Single, Dual and Triaxial
- Acceleration: -40 to 40 g
- Device Type: Sensor / Transducer
- Features: Sealed
- Frequency Range: 400 Hz
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Supplier: ES Systems S.A.
Description: ES Systems has developed a series of pressure sensor modules targeting a variety of markets. Each module integrates an oil filled pressure capsule equipped with a medium isolation diaphragm that protects the MEMS capacitive pressure sensor die. The capsule housing is
- Accuracy: 0.5000 ±% FS
- Device Category: Sensor
- Electrical Output: Other
- Features: Temperature Compensation
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Supplier: ES Systems S.A.
Description: ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS
- Accuracy: 0.2500 ±% FS
- Device Category: Sensor
- Features: Temperature Compensation
- Media: Liquid, Gas
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Supplier: First Sensor AG
Description: First Sensor features a highly innovative technology platform for manufacturing high-precision inertial sensors for geoengineering, condition monitoring or navigation applications. The MEMS sensors allow for flexible customization to fit your individual application
- Form Factor: Integrated Chip (IC)
- Operating Temperature: -40 to 248 F
- Supply Voltage: 2.7 to 5.2 volts
- Tilt Angle: -90 to 90 degrees
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Supplier: Jewell Instruments, LLC
Description: Jewell Instruments AMA Series Accelerometers are an excellent choice for cost to performance trade off. The AMA is based on silicon micro-machined MEMS Capacitive Accelerometer technology and designed for low power and high stability. Features & Benefits
- Acceleration: -40 to 40 g
- Device Type: Sensor / Transducer
- Features: Sealed
- Frequency Range: 400 Hz
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Supplier: ES Systems S.A.
Description: ES Systems has developed a series of board mountable pressure sensors targeting a variety of markets requiring high resolution and accuracy for absolute, gauge or differential pressure measurements. The ESCP-BMS1 is a MEMS capacitive pressure sensor with state-of-the-art
- Accuracy: 0.1500 ±% FS
- Device Category: Sensor
- Electrical Output: Other
- Features: Temperature Compensation
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Supplier: Silicon Designs, Inc.
Description: MEMS DC accelerometer combines two patented capacitive silicon sense elements and a precision, custom CMOS integrated circuit in a hermetically sealed LCC package. The differential output voltage of the MEMS accelerometer is converted on the PCB into a current proportional to
- Acceleration: 2 to 50 g
- Device Type: Sensor / Transducer, Other
- Features: Sealed
- Maximum Shock: Up to 5000 g
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Supplier: Silicon Designs, Inc.
Description: Model 1527 MEMS DC Accelerometer combines two patented capacitive silicon sense elements and a precision, custom CMOS integrated circuit in a hermetically sealed LCC package. The differential output voltage of the MEMS accelerometer is converted on the PCB into a current
- Acceleration: 10 to 50 g
- Device Type: Sensor / Transducer, Other
- Features: Sealed
- Frequency Range: 0.0 to 4200 Hz
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Supplier: First Sensor AG
Description: First Sensor features a highly innovative technology platform for manufacturing high-precision inertial sensors for geoengineering, condition monitoring or navigation applications. The MEMS sensors allow for flexible customization to fit your individual application
- Device Type: Sensor / Transducer
- Frequency Range: 400 to 800 Hz
- Maximum Shock: 2000 g
- Number of Axes: Biaxial
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Supplier: Rieker, Inc.
Description: DESCRIPTION The H6 inclinometer provides dual axis inclination sensing in a rugged environmentally protected housing. This unit incorporates a MEMS sensing element referenced to gravity with integrated temperature compensation over the industrial operating range of -40°
- Form Factor: Module / Standalone
- Number of Axes: 1
- Operating Temperature: -40 to 185 F
- Output: Analog, Digital
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Supplier: Rieker, Inc.
Description: Description The highly accurate H4360 inclinometer provides 360 degree total measurement along a single axis in a rugged environmentally protected metal housing. The sensing package incorporates a MEMs sensing element and integrated temperature compensation over the industrial
- Accuracy: -0.1000 to 0.1000 degrees
- Form Factor: Module / Standalone
- Number of Axes: 1
- Operating Temperature: -40 to 185 F
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Supplier: LufftUSA
Description: /RH, MEMS capacitive/Pressure, Kipp&Zonen/Radiation Product highlights: Compact all-in-one weather sensor, low power, heater, aspirated radiation shield, maintenance-free operation, open communication protocol Interfaces: RS485, 2-wire, half-duplex Article number: 8374.U13
- Device Classification: Sensor Only
- Height: 13.07 inch
- Interface Options: Serial Interface
- Measures Barometric Pressure: Yes
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Supplier: PCB Piezotronics, Inc.
Description: 3-channel, line-powered, signal cond. for single-ended MEMS and capacitive sensors, 4-pin input conn.
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Supplier: ES Systems S.A.
Description: , including the new generation of green propellants. ESCP-SAPT pressure transmitters consist of a MEMS capacitive pressure sensor die, which is underpinned by ES' innovative microfabrication process that has been proven suitable for the mechanical, radiation and temperature
- Accuracy: 0.3000 ±% FS
- Electrical Output: Analog Voltage
- Media: Gas
- Operating Temperature: -4 to 167 F
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Supplier: HUBER+SUHNER AG
Description: Features reliable 1 ms speed latching capacitive state sensor 2x2, 2x1, 1x1 variants Applications Protection Switching Reconfiguration WDM
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Supplier: LufftUSA
Description: : Temperature, relative humidity, air pressure (redundant pressure as option) Measurement technology: PT100/Temp, Capacitive/RH, MEMS Resonant Pressure transducer, Kipp&Zonen CMP10 / radiation Product highlights: Compact all-in-one weather sensor, heater, aspirated radiation
- Device Classification: Sensor Only
- Height: 18.5 inch
- Interface Options: Serial Interface
- Measures Barometric Pressure: Yes
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Supplier: RS Components, Ltd.
Description: Solid state MEMS Pressure Sensors utilising piezo-resistive elements to provide superior electrical performance when compared to capacitive element types. They feature low power consumption and ultra-compact dimension, with good linearity and low temperature drift. Pressure
- Device Category: Sensor
- Electrical Output: Other
- Media: Gas, Other
- Operating Temperature: 212 F
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Supplier: RS Components, Ltd.
Description: Solid state MEMS Pressure Sensors utilising piezo-resistive elements to provide superior electrical performance when compared to capacitive element types. They feature low power consumption and ultra-compact dimension, with good linearity and low temperature drift. Pressure
- Device Category: Sensor
- Electrical Output: Other
- Media: Gas, Other
- Operating Temperature: 32 F
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Supplier: RS Components, Ltd.
Description: Solid state MEMS Pressure Sensors utilising piezo-resistive elements to provide superior electrical performance when compared to capacitive element types. They feature low power consumption and ultra-compact dimension, with good linearity and low temperature drift. Pressure
- Device Category: Sensor
- Electrical Output: Other
- Media: Gas, Other
- Operating Temperature: 212 F
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Supplier: RS Components, Ltd.
Description: Solid state MEMS Pressure Sensors utilising piezo-resistive elements to provide superior electrical performance when compared to capacitive element types. They feature low power consumption and ultra-compact dimension, with good linearity and low temperature drift. Pressure
- Device Category: Sensor
- Electrical Output: Other
- Media: Gas, Other
- Operating Temperature: 32 F
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Supplier: ABB Measurement & Analytics
Description: – Optional plug-in cards – Automatic firmware update – Various communication protocols available SmartSensor – All digital solution – Installation flexibility – Meter intelligence located in the sensor SensorApplicationMem
- Mass Flow Rate: 0.0 to 3160 lbs/min
- Electrical Output: Analog Current
- End Fittings: Flanged
- Features: Audible or Visual Alarms, Programmable
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Supplier: ABB Measurement & Analytics
Description: intelligence located in the sensor SensorApplicationMem ory – Maximum data security – Plug and play electronics replacement ABB common look and feel – Easy Set-up – Operation through the glass via capacitive keys VeriMass on
- Mass Flow Rate: 0.0 to 919 lbs/min
- Electrical Output: Analog Current
- End Fittings: Threaded
- Features: Audible or Visual Alarms, Programmable
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At the 2025 World Robot Conference in Beijing, XJCSENSOR introduced a breakthrough MEMS Force Torque Sensor designed for next-generation robotic systems. As robots advance toward delicate manipulation, dexterous (read more)
Browse Force and Load Sensors Datasheets for XJCSENSOR Technology Co., Ltd. -
Traditional six-axis sensors relied on manual strain gauge placement, resulting in high costs and inconsistent quality. XJCSENSOR introduced micro-fused MEMS strain gauge technology, automating key production steps to cut cycle time by over 50%, reduce costs, and enhance reliability. The glue (read more)
Browse Six-axis Force and Torque Sensors Datasheets for XJCSENSOR Technology Co., Ltd. -
-Technology Approach: Supports resistive strain, capacitive, MEMS, and piezoelectric sensing technologies for versatile applications. Industry Trends & Technology Evolution (read more)
Browse Force and Load Sensors Datasheets for XJCSENSOR Technology Co., Ltd. -
The 8MPP2 low-pressure sensor utilizes Sensata’s field-proven automotive Micro-Electro-Mechanical-Systems (MEMS) technology that outputs fully conditioned pressure values via the digital I²C bus. The 8MPP2 features best-in-class performance including high accuracy, low power (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies -
other Hydrogen (H2) gas sensing applications where cost or size may be an issue, look at the Robust Thin Film, Electrochemical and MEMS Solutions available. (read more)
Browse Gas Sensors Datasheets for Electro Optical Components, Inc. -
Dexter Research Center announces the availability of its new ST60 High Temperature Detectors. The specially constructed MEMS based thermopiles (read more)
Browse Noncontact Infrared Temperature Sensors Datasheets for Dexter Research Center, Inc. -
Sense the (EVS-GTR) pressure? Churod Sensing’s Gen II Battery Pressure Sensor combines the accuracy of its Gen I sensor with a cost-driven design. The Gen II is a MEMS-based, PCB-mounted solution (read more)
Browse Pressure Sensor Chips Datasheets for Churod Americas, Inc. -
Economic air pressure sensors is especially designed for racing car and track gas brake systems, it sets a new performance standard for low cost, high volume, commercial and industrial applications. Benefits (read more)
Browse Pressure Sensors Datasheets for Holykell Technology Company Limited -
VVB 3-axis IO-Link vibration sensor: Technology ifm’s VVB3 provides real-time machine health insights and predictive failure detection. Unlike typical analog MEMS sensors (read more)
Browse Vibration Sensors Datasheets for ifm efector inc. -
AutomationDirect has added Gefran inclination sensors to their growing lineup of position transducers. Gefran sensors use cutting-edge MEMS technology (micro-electromechanical devices integrated onto a single silicon chip) to provide reliable and precise tilt angle measurement with respect (read more)
Browse Datasheets for Automationdirect.com
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MEMS Capacitive vs Piezoresistive Pressure Sensors - What are Their Differences?
industry, automation, hydraulics, as well as aeronautics. The majority of the pressure sensors currently installed in the field are based on MEMS technology and utilize either piezoresistive or capacitive measurement principle. In this article, we will be discussing their main differences and we
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When to Use MEMS Capacitive Pressure Sensors
Various technologies are used to make pressure sensors. 2 of the most common include piezoresistive and capacitive pressure sensors. Both can be used for gauge, differential, or absolute pressure measurement. While piezoresistive is found in low-cost sensors, there are situations where a capacitive
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The Differences Between Capacitive & Piezoresistive Pressure Sensors
The majority of the pressure sensors currently installed in the field are based on MEMS technology and utilize either piezoresistive or capacitive measurement principle. In this article, we will be discussing their main differences and we will be highlighting the advantages of each. The term
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AKF392B MEMS Digital Accelerometer
to a different address code, long distance series with multiple sensors to facilitate multi-point measurement and data analysis. AKE392B-Wireless is a monocrystalline silicon capacitive sensor, composed by a silicon chip of micro-mechanical treatment, low power ASIC for the signal adjustment
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MSilica Nanoparticles Treated by Cold Atmospheric-Pressure Plasmas Improve the Dielectric Performance of Organic-Inorganic Nanocomposites
chamber geometries by. imposing a dielectrophoresis (DEP) force on the beads. In cDEP the electrodes are not in. direct contact with the fluid sample but are instead capacitively coupled to the mixing. chamber through thin dielectric barriers, which eliminates many of the problems. encountered
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A dual-axis MEMS capacitive inertial sensor with high-density proof mass
…to the high density of gold for proof mass material, the actual BNs in Z- and X-axis directions has shown the capability of sensing sub-1G acceleration typically below mG accel- eration, while silicon MEMS capacitive sensors with the same proof…
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Wideband Continuous-time ΣΔ ADCs, Automotive Electronics, and Power Management
Section 12.2 describes the basic operating principle of a MEMS capacitive sensor , as well as the possible AFE circuit topologies that can be used for reading out the sensor capacitance variations.
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A MEMS-based, high-resolution Electric-Field meter
2 MEMS Capacitive Sensor .
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Development of a wireless intra-ocular pressure monitoring system for incorporation into a therapeutic glaucoma drainage implant
The resolution of the current system is limited by the sensitivity and Q of the MEMS capacitive sensor .
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Development of a CMOS MEMS pressure sensor with a mechanical force-displacement transduction structure
[18] Tsai M-H, Sun C-M, Liu Y-C, Wang C and Fang W 2009 Design and application of a metal wet-etching post-process for the improvement of CMOS- MEMS capacitive sensors .
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Pick-and-place process for sensitivity improvement of the capacitive type CMOS MEMS 2-axis tilt sensor
Various approaches have been investigated to improve the performance of CMOS MEMS capacitive sensors [15, 16].
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Design of a CMOS readout circuit for wide-temperature range capacitive MEMS sensors
Many previous works in high temperature bulk CMOS electronics, in particular for MEMS capacitive sensors readout interfaces, have used feature sizes of 1µm or more, and power supplies of 5 V or more [8, 11, 12].
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Interface electronics for MEMS-based wireless sensing applications
Though stand-alone MEMS capacitive sensors are insensitive to temperature variations, the packaged devices can exhibit temperature dependence due to thermal mismatch between the sensor, package, and strained surface.
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2009 Index Journal of Microelectromechanical Systems Vol. 18
Nanoprecision MEMS Capacitive Sensor for Linear and Rotational Positioning; JMEMS June 2009 660-670 Lee, W. C., see Lee, J. Y., JMEMS Aug. 2009 792-798 Leong, T. G., see Tyagi, P., JMEMS Aug. 2009 784-791 Lewis, G. N., Moktadir, Z…