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Supplier: Merit Sensor Systems
Description: The K Series is ideal for high-volume, high-pressure OEM applications. Features Pressure 1,000 to 10,000 psi (68.9 to 690 bar; 6,895 to 68,948 KPa) Temperature -40 to 150 °C Configuration Absolute Media Clean, dry air and non-corrosive gases Shipping Wafers on tape
- Device Category: Sensor
- Media: Gas
- Operating Temperature: -40 to 302 F
- Pressure Reading: Absolute
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Supplier: Merit Sensor Systems
Description: The 5000 Series is ideal for high-volume, high-pressure OEM applications Features Pressure 1,000 to 10,000 psi (68.9 to 689 bar; 6,895 to 68,948 KPa) Temperature -40 to 150 °C Configuration Absolute Media Clean, dry air and non-corrosive gases Shipping Wafers on tape
- Device Category: Sensor
- Media: Gas
- Operating Temperature: -40 to 302 F
- Pressure Reading: Absolute
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Supplier: Merit Sensor Systems
Description: The L Series is an ultra-sensitive and stable MEMS die that is ideal for low-pressure applications, such as CPAP and air handlers. Features Pressure 0.15 to 1 psi (10 to 68.95 mbar; 1 to 6.89 KPa) Temperature -40 to 150 °C Configuration Gage or differential Media Clean,
- Device Category: Sensor
- Media: Gas
- Operating Temperature: -40 to 302 F
- Pressure Reading: Differential, Gauge
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Supplier: Merit Sensor Systems
Description: The HM Series was designed for harsh-media applications from low to medium pressure. Features Pressure 15 to 500 psi (1 to 34.5 bar; 103 to 3,447 KPa) Temperature -40 to 150 °C Configuration Absolute, pressurized from the cavity side Media Air and gases and liquids that are
- Device Category: Sensor
- Media: Liquid, Gas
- Operating Temperature: -40 to 302 F
- Pressure Reading: Absolute
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Supplier: ES Systems S.A.
Description: , including the new generation of green propellants. ESCP-SAPT pressure transmitters consist of a MEMS capacitive pressure sensor die, which is underpinned by ES' innovative microfabrication process that has been proven suitable for the mechanical, radiation and
- Accuracy: 0.3000 ±% FS
- Electrical Output: Analog Voltage
- Media: Gas
- Operating Temperature: -4 to 167 F
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Supplier: ES Systems S.A.
Description: ES Systems has developed a series of pressure sensor modules targeting a variety of markets. Each module integrates an oil filled pressure capsule equipped with a medium isolation diaphragm that protects the MEMS capacitive pressure sensor die. The capsule housing
- Accuracy: 0.5000 ±% FS
- Device Category: Sensor
- Electrical Output: Other
- Features: Temperature Compensation
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Supplier: ES Systems S.A.
Description: ES Systems has developed a series of medium isolated pressure sensors suitable for applications with harsh environmental conditions where resistance to corrosive fluids or gases is required. Each sensor integrates a MEMS capacitive pressure sensor die, and a CMOS ASIC for
- Accuracy: 0.2500 ±% FS
- Device Category: Sensor
- Features: Temperature Compensation
- Media: Liquid, Gas
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Supplier: ES Systems S.A.
Description: MEMS pressure sensor die is underpinned by ES Systems’ innovative SOI-surface micromachining technology. ESCP-BMS1 is an absolute, gauge or differential pressure sensor of ultrahigh resolution with analog, SPI or I2C interface. The output is fully calibrated, and
- Accuracy: 0.1500 ±% FS
- Device Category: Sensor
- Electrical Output: Other
- Features: Temperature Compensation
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Supplier: Palomar Technologies, Inc
Description: he SST 3130 is a vacuum and pressure furnace that provides precise automatic control of heating to 500°C (1000°C optional) and cooling in an inert gas environment from vacuum levels of below 50 millitorr to pressures exceeding 50 psig. Process profiles are easily created, and the
- Application: Brazing / Soldering, Curing, Industrial, Other
- Computer Interface: Yes
- Configuration: Top Loading
- Controller Type: Programmable
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Supplier: Palomar Technologies, Inc
Description: Overview The SST 518 Vacuum/Pressure furnace provides the right combination of performance and value for use in R&D labs to high mix/low volume production environments. Void-free, flux-free solder joints are reliably obtained through a carefully controlled and sequenced combination
- Application: Brazing / Soldering, Curing, Industrial, Other
- Configuration: Top Loading
- Controller Type: Programmable
- Height: 1067 mm
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Supplier: Palomar Technologies, Inc
Description: thermal profiles up to 350°C Processes Void-Free Die Soldering. Void-free die and substrate solder attach is used to create a uniform thermal interface for high-reliability microelectronic devices. High Vacuum MEMS Package Sealing. Advanced MEMS devices
- Application: Brazing / Soldering, Curing, Industrial, Other
- Computer Interface: Yes
- Configuration: Top Loading
- Controller Type: Programmable
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Supplier: RS Components, Ltd.
Description: time of 1 ms.,These sensors operate on the heat transfer principle to measure mass airflow. They consist of a microbridge Microelectronic and Microelectromechanic al System (MEMS) with temperature-sensitiv e resistors deposited with thin films of platinum and silicon nitride. The MEMS
- Gas Volumetric Flow Rate: 0.0 to 0.0265 SCFM
- Operating Pressure: 25 psi
- Operating Temperature: -4 F
- Pipe Diameter: 0.2106 inch
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Supplier: RS Components, Ltd.
Description: time of 1 ms.,These sensors operate on the heat transfer principle to measure mass airflow. They consist of a microbridge Microelectronic and Microelectromechanic al System (MEMS) with temperature-sensitiv e resistors deposited with thin films of platinum and silicon nitride. The MEMS
- Gas Volumetric Flow Rate: 0.0 to 0.0071 SCFM
- Operating Pressure: 25 psi
- Operating Temperature: -4 F
- Pipe Diameter: 0.2106 inch
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Supplier: RS Components, Ltd.
Description: time of 1 ms.,These sensors operate on the heat transfer principle to measure mass airflow. They consist of a microbridge Microelectronic and Microelectromechanic al System (MEMS) with temperature-sensitiv e resistors deposited with thin films of platinum and silicon nitride. The MEMS
- Gas Volumetric Flow Rate: 0.0 to 0.0018 SCFM
- Operating Pressure: 25 psi
- Operating Temperature: -4 F
- Pipe Diameter: 0.2106 inch
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Supplier: RS Components, Ltd.
Description: time of 1 ms.,These sensors operate on the heat transfer principle to measure mass airflow. They consist of a microbridge Microelectronic and Microelectromechanic al System (MEMS) with temperature-sensitiv e resistors deposited with thin films of platinum and silicon nitride. The MEMS
- Gas Volumetric Flow Rate: 0.0 to 0.0071 SCFM
- Operating Pressure: 25 psi
- Operating Temperature: -4 to 158 F
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The 8MPP2 low-pressure sensor utilizes Sensata’s field-proven automotive Micro-Electro-Mechanical-Systems (MEMS) technology that outputs fully conditioned pressure values via the digital I²C bus. The 8MPP2 features best-in-class performance including high accuracy, low power (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies -
Sense the (EVS-GTR) pressure? Churod Sensing’s Gen II Battery Pressure Sensor combines the accuracy of its Gen I sensor with a cost-driven design. The Gen II is a MEMS-based, PCB-mounted solution (read more)
Browse Pressure Sensor Chips Datasheets for Churod Americas, Inc. -
Economic air pressure sensors is especially designed for racing car and track gas brake systems, it sets a new performance standard for low cost, high volume, commercial and industrial applications. Benefits (read more)
Browse Pressure Sensors Datasheets for Holykell Technology Company Limited -
The Series 89 is a miniature and robust pressure transducer with calibrated and temperature compensated output . It incorporates MEMS sensing chip which is oil-filled and SS (read more)
Browse Pressure Sensors Datasheets for Angst+Pfister Sensors and Power -
microelectromechanical system (MEMS) pressure sensors are all common within medical and healthcare settings. Importance: As stated before, sensors are used to uphold accurate pressure measurements to promote patient safety and equipment functionality. 5 (read more)
Browse Pressure Sensors Datasheets for ASAP Semiconductor LLC -
Sensata Paves the Way for Sustainable Water Use with New Smart Pressure Sensor for In-Meter Monitoring Sensata’s new Digital Water Pressure Sensor allows for remote pressure monitoring by utilities to identify distribution issues, leaks, and other (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies -
BLE functionality. Sensata's new BLE TPMS leverages its field proven tire pressure monitoring sensors by replacing the ultra high frequency (UHF) radio with BLE radio to enable two-way communication. These new BLE TPMS solutions are available in both clamp-in and snap-in configurations (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies -
Learn how to eliminate costly downtime with ready-made solutions for hazardous area level switches.
(read more)
Browse Pressure Switches Datasheets for Sensata Technologies -
with glycol) pressure. If the pressure is too high, there is a risk of damage or leakage to the hydronic system. If the pressure is too low, there is a risk of damaging the heat exchanger inside the boiler. An unreliable system will lead to higher costs (efficiency loss and maintenance (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies -
traffic. Providing an aerial platform on the back of a truck poses engineering challenges for the equipment. Sensors are needed to constantly assess the balance of the machine and provide feedback to the actuators to maintain safety. Learn more about Sensata's Pressure and Position Sensors for Vehicle-Mounted Aerial Platforms. (read more)
Browse Pressure Sensors Datasheets for Sensata Technologies
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Dual Die Compensation for MEMS Pressure Sensors
Several pressure sensor manufactures promote product incorporating "dual die compensation." This compensation technique is employed for very low pressure sensors where common mode errors cannot be compensated by any other means for either gage or differential pressure measurements. There are two
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Understanding Common Specifications for MEMS Silicon Dies
The primary thing to understand about MEMS dies is that when they are exposed to either pressure or temperature, they will produce a corresponding output, which will be in millivolts, provided that an input voltage, or excitation voltage, has been supplied.
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Four Characteristics of Our Newest MEMS Sensing Element
Merit Sensor has owned and operated a wafer fab from its beginnings. Fabricating our own MEMS (micro-electro-mechanical systems) sensing elements, or die, is something that sets us apart from other pressure sensor manufacturers, many of whom source their MEMS die from foundries or suppliers
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Three Common Types of Pressure-Sensor Packages
At the heart of every MEMS pressure sensor is a MEMS silicon die. Merit Sensor owns and operates a wafer fab, where it produces all of its own MEMS die. Packaging a MEMS die requires specialized equipment and skills to handle the small and sensitive die and to perform delicate wire bonding
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CR4 - Thread: Pressure in a Door During Side Impact Event...
I'm hoping my cheap-ass MEMS pressure die will work for this application.
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An energy-efficient capacitance-controlled oscillator-based sensor interface for MEMS sensors
Measured period and cycle-to-cycle jitter of the CCO as a function of the applied pressure for a capacitive MEMS pressure sensor die wirebonded to the sensor interface die.
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Holed packaging for mems sensors
To do this the Mems pressure sensor die attach is made using a low young’s modulus Silicon Material with with a controlled bondline thickness ina range of 50-70 um.
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Chemical Engineering and Material Properties II
[3] MEYYAPPAN K.MCCLUSKEY P.CHEN L Y Thermo-mechanical analysis of MEMS pressure sensor die -attach for high temperature applications 2004 .
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Optically interrogated MEMS pressure sensor array
The two most important components of the new system are the surface-mounted passive MEMS pressure sensor dies and a highly sensitive active-pixel CMOS lock-in detector, enabling wireless interrogation of many sensors in parallel.
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Implantable MEMS compressive stress sensors: Design, fabrication and calibration with application to the disc annulus.
A commercial microelectromechanical systems ( MEMS ) pressure sensor die was selected as the active element for a custom stress sensor.
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Studies on thermally induced packaging effects of surface acoustic wave devices: Simulation and experiment verification
[6] K. Meyyappan, P. McCluskey and L. Y. Chen, “Thermo-Mechanical Analysis of MEMS Pressure Sensor Die -attach for High Temperature Applications”, IEEE Aerospace Conference Proceedings, pp. 2556- 2561, 2004.
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A 2.3μW wireless intraocular pressure/temperature monitor
A capacitive MEMS pressure sensor die (E1.3N, microFAB Bremen) is used for pressure sensing.
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Multi Chip Module (MCM) Design for Packaging of a MEMS Pressure Sensor
Ii The low profile MEMS pressure sensor die was fabricated .
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Table of contents
...............,2538 7.1006 Thermo-Mechanical Analysis of MEMS Pressure Sensor Die -attach for High TemperatureApplications.