Non Conductive Sealant

Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.

• Viscosity: 15,000 cP
• Use Temperature: -76 to 302 F
• Thermal Conductivity: 3.5 W/m-K
• Dielectric Strength: 300 kV/in

Description: LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing Electrically conductive Low viscosity Good dispense and flow

• Viscosity: 6,000 cP
• Chemical System: Epoxy (EP)
• Cure / Technology: Single Component System

Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

• Applied Thickness / Gap Fill: 0.001 to 0.003 inch
• Viscosity: 80,000 to 100,000 cP
• Use Temperature: -100 to 300 F
• Thermal Conductivity: 1.16 to 1.6 W/m-K

Description: Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight siloxane. N800B helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity

• Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
• Use Temperature: -76 to 257 F
• Thermal Conductivity: 13 W/m-K
• Dielectric Strength: 203.20000000000041 kV/in

Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,

• Applied Thickness / Gap Fill: 0.002 to 0.003 inch
• Viscosity: 300,000 to 400,000 cP
• Use Temperature: -65 to 400 F
• Thermal Conductivity: 1.15 to 1.3 W/m-K

Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar

• Viscosity: 100,000 cP
• Use Temperature: -76 to 302 F
• Thermal Conductivity: 2.5 W/m-K
• Dielectric Strength: 350 kV/in

Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It

• Use Temperature: -60 to 400 F
• Thermal Conductivity: 2.1 W/m-K
• Tensile Strength (Break): 210 psi
• Elongation: 70 %

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from siloxane

• Use Temperature: -40 to 257 F
• Thermal Conductivity: 3 W/m-K
• Tensile Strength (Break): 7.977026164645835 psi
• Elongation: 70 %

Description: Safety Packaging Under Nitrogen

• Chemical System: Silicone

Description: Techsil® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough

• Features: Electrically Conductive, Gap Filling Compound, Thermal Compound / Interface (Thermally Conductive)

Description: Polyurethane sealant paste which is a non-sag, multi-purpose adhesive providing a flexible, durable and resistant elastomeric seam with good adhesion. LOCTITE® UR 3370 WH is a white, fast curing, polyurethane adhesive sealant paste. It is a non-sag, multi-purpose adhesive

Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It

• Features: Electrically Conductive, Thermally Conductive

Description: LiPOLY’s S282 is a thermally conductive pad designed for gap filling. The thermal conductivity is 1.7 W/m*K. It uses fiberglass cloth as the reinforcement material with great self-adhesive that can fit closely with non-flat heat sinks to increase the contact area. The low stress damped

• Applied Thickness / Gap Fill: 0.01968505 to 0.1968505 inch
• Use Temperature: -76 to 356 F
• Thermal Conductivity: 1.7 W/m-K
• Dielectric Strength: 381.0000000000008 kV/in

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Industry: Electronics
• Features: Encapsulating / Potting, Rubber Based / Elastomeric, Thermal Compound / Heat Conductive
• Chemical System: Silicone

Description: Toughened, two part epoxy Supreme 11ANHT withstands thermal cycling and is both thermally conductive and electrically insulative.

• Applied Thickness / Gap Fill: 0.002 to 0.004 inch
• Use Temperature: -112 to 400 F
• Thermal Conductivity: 2.88 to 3.1 W/m-K
• Coeff. of Thermal Expansion (CTE): 16.666666666666668 to 19.444444444444443 µin/in-F

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Features: Electrically Conductive, Gel, Rubber Based / Elastomeric
• Industry: Electronics, OEM / Industrial
• Chemical System: Silicone
• Cure / Technology: Thermosetting / Crosslinking

Description: stringent and non-burning requirements of UL 94 V-O. The 50-2185 has outstanding thermal cycling properties and low embedment stress to sensitive components. This system will maintain its’ integrity over a wide operating temperature range, -50 to 120°C. Its’ low glass transition temperature

• Viscosity: 27,000 cP
• Use Temperature: -58 to 248 F
• Thermal Conductivity: 1.22593715 W/m-K
• Tensile Strength (Break): 800 psi

Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.

• Viscosity: 150,000 cP
• Dielectric Strength: 177.80000000000038 kV/in
• Cure / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking, Two Component System
• Features: Die Bonding Adhesive / Compound, Gap Filling Sealant / FIP Gasket, Gel

Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a

• Viscosity: 350,000 cP
• Use Temperature: -58 to 428 F
• Thermal Conductivity: 1.55 W/m-K
• Tensile Strength (Break): 406.1031502001516 psi

Description: Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. 1.1 kg Kit.

• Viscosity: 542,000 cP
• Tensile Strength (Break): 985 psi
• Elongation: 355 %
• Substrate Compatibility: Ceramic / Glass

Description: Henkel Loctite STYCAST 5952 White, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant,

• Viscosity: 18,000 to 40,000 cP
• Thermal Conductivity: 0.85 W/m-K
• Tensile Strength (Break): 500 psi
• Elongation: 50 %

Description: electrical insulation properties, is non-corrosive and reversion resistant. Part B, 1 gal Pail.

• Viscosity: 15,000 to 35,000 cP
• Thermal Conductivity: 1.15 W/m-K
• Tensile Strength (Break): 400 psi
• Elongation: 17 %

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from siloxane

• Use Temperature: -40 to 257 F
• Thermal Conductivity: 2 W/m-K
• Tensile Strength (Break): 7.977026164645835 psi
• Elongation: 70 %

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance are

• Viscosity: 400 cP
• Thermal Conductivity: 0.5 W/m-K
• Coeff. of Thermal Expansion (CTE): 3,055.5555555555557 µin/in-F
• Dielectric Strength: 635.0000000000014 kV/in

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ◆ Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ◆ Available in various thicknesses from 0.5 to 5.0 mm. ◆ Free from siloxane

• Use Temperature: -40 to 248 F
• Thermal Conductivity: 8 W/m-K
• Tensile Strength (Break): 4.35110518071591 psi
• Elongation: 30 %

Description: HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.

• Viscosity: 1,200 cP
• Industry: Electronics

Description: (Known as HYSOL DS7301 ) LOCTITE ECCOBOND DS 7301 is a one component non-conductive adhesive sealant is designed for display assembly applications that require protection against humidity and oxygen.

• Viscosity: 600 cP
• Industry: Electronics