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Supplier: Techsil Limited
Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W is an white colored version of LOCTITE 3220 adhesive. One
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Substrate / Material Compatibility: Ceramic / Glass
- Viscosity: 31800 cP
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Supplier: Henkel Corporation - Industrial
Description: also used as a sealant and adhesive for assembly and repair of industrial furnaces, ovens, boilers, exhaust stacks, high temperature ducting, and heating elements in electrical appliances. This product is typically used in applications with an operating range of -50 °C to +250 °C and can
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System
- Viscosity: 73500 cP
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure Good toughness Excellent chemical resistance
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Features: Electrical Insulation / Dielectric Material
- Viscosity: 21500 cP
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Supplier: Techsil Limited
Description: Techsil® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough
- Compound Type: Electrically Conductive, Thermally Conductive
- Material Form: Gap Filling Compound
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing Electrically conductive Low viscosity Good dispense and flow
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Single Component System
- Viscosity: Up to 6000 cP
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 300 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar
- Chemical / Polymer System Type: Epoxy (EP)
- Dielectric Strength: 350 kV/in
- Features: Gap Filling Sealant / FIP Gasket, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
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Supplier: Gelest, Inc.
Description: Safety Packaging Under Nitrogen
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Supplier: Master Bond, Inc.
Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Shiu Li Technology Co., Ltd
Description: LiPOLY N-putty2-s series is a non-silicon thermally conductive material without volatilization of low molecular siloxane, and low total volatile gas. With a thermal conductivity of 5.0 W/m*K, the high deformation can perfectly fill small air gaps to eliminate tolerances. It also can
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 305 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
- Industry: Aerospace, Automotive, Electronics, Electrical Power / HV
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Supplier: Shiu Li Technology Co., Ltd
Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal
- Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
- Chemical / Polymer System Type: Specialty / Other
- Dielectric Strength: 203 kV/in
- Features: Thermal Compound / Interface (Thermally Conductive)
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Supplier: Master Bond, Inc.
Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.
- Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
- Filled / Reinforced: Yes
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Supplier: Graphene Laboratories, Inc.
Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
- Filled / Reinforced: Yes
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Supplier: CHT USA Inc.
Description: CHT’s AS1802 is a 1-part, gray, non-corrosive, neutral cure, thermally conductive, RTV silicone adhesive sealant. It is one in a range of CHT’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 is designed with excellent
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 508 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
- Dielectric Constant (Relative Permittivity): 4.2
- Dielectric Strength: 850 kV/in
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Supplier: Master Bond, Inc.
Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to ithstand aggressive chemicals, and high compressive strength.
- Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
- Chemical / Polymer System Type: Epoxy (EP)
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.6
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Supplier: CHT USA Inc.
Description: CHT’s AS1802 Black is a 1-part, non-corrosive, neutral cure, thermally conductive, black RTV silicone adhesive sealant. It is one in a range of CHT’s acetone cure products which are all solvent-free. It features a fast skin over time at 4 minutes. AS1802 Black is designed with
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Cure Type / Technology: Single Component System, Specialty / Other
- Dielectric Strength: 508 kV/in
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Supplier: Wacker Chemical Corp.
Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Materion Corporation
Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure
- Compound Type: Electrically Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Wacker Chemical Corp.
Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking, Two Component System
- Dielectric Strength: 178 kV/in
- Features: Gap Filling Sealant / FIP Gasket
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance are
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
- Dielectric Constant (Relative Permittivity): 4.7 to 4.8
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Supplier: Techsil Limited
Description: also be used as a waterproof sealant for electrical, electronic and communication equipment. Product Benefits Easy to use, one-component material Flame retardant Non-corrosive to most metals Low volatility Low odour Fast cure at room
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: also be used as a waterproof sealant for electrical, electronic and communication equipment. Product Benefits Easy to use, one-component material Flame retardant Non-corrosive to most metals Low volatility Low odour Fast cure at room
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Rubber Based / Elastomeric: Yes
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Polyurethane Adhesives and Sealants - Flame retardant thermally conductive polyurethane -- 50-2150FRSupplier: Epoxies Etc...
Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
- Dielectric Constant (Relative Permittivity): 4.3
- Dielectric Strength: 540 kV/in
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Supplier: RS Components, Ltd.
Description: Fills gap between device and heatsink, reduces thermal resistance. Can be used as a low bond strength adhesive, sealant or gasketing compond. High viscosity, non-slump paste. High thermal conductivity. Good electrical insulation characteristics. Remains flexible and elastic at high
- Compound Type: Thermally Conductive
- Material Form: Specialty / Other
- Thermal Conductivity: 1.8 W/m-K
- Use Temperature: -58 to 446 F
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite STYCAST 5954 White Silicone Encapsulant, formerly Emerson and Cuming, is a two component, addition cured, highly filled, silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is
- Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
- Cure Type / Technology: Two Component System
- Dielectric Strength: 450 kV/in
- Elongation: 17 %
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description HTS Silicone Heat Transfer Compound is a metal oxide filled silicone oil providing an extremely efficient and exceptionally thermally conductive interface material which will operate over a wide temperature range. Electrolube Heat Transfer Compound is recommended where
- Chemical / Polymer System Type: Silicone
- Features: Gap Filling Sealant / FIP Gasket, Thermal Compound / Interface (Thermally Conductive)
- Industry: Electronics
- Thermal Conductivity: 0.9000 W/m-K
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Supplier: Henkel Corporation - Electronics
Description: HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.
- Industry: Electronics
- Viscosity: 1200 cP
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Supplier: Sauereisen, Inc.
Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Cure Type / Technology: Air Setting / Film Drying, Single Component System
- Dielectric Constant (Relative Permittivity): 3.5 to 6
- Dielectric Strength: 1.3 to 50.8 kV/in
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Supplier: Hosco Finishing System Components
Description: PSH – non-conductive, PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PSHC – conductive (carbon impregnated), PTFE lined, fiberglass reinforced innercore, overbraided with 300 series stainless steel. PDH – .030 wall, non-conductive
- Application: Other
- Construction Options: Reinforced
- Material: Fluoropolymers / Silicone
- Outside Diameter: 0.3750 to 1.25 inch
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Supplier: Ellsworth Adhesives
Description: Henkel Loctite Ablestik 59C Silver, formerly Emerson and Cuming ECCOBOND, is two component, heat curing, epoxy adhesive resin that is used to replace hot soldering for electrical connections. It offers high strength bonds, non-flowing properties, long pot life, high thermal conductivity,
- Chemical / Polymer System Type: Silicone
- Cure Type / Technology: Single Component System
- Thermal Conductivity: 11.7 W/m-K
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Supplier: Henkel Corporation - Electronics
Description: (Known as Hysol ECCOBOND G500HF ) General purpose one-component non-conductive epoxy adhesive and sealant that cures to a high gloss finish.
- Cure Type / Technology: Single Component System
- Industry: Electronics
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Featured Products Top
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View our video: AS1802 - Thermally Conductive, 1-Part RTV Silicone Adehsive Sealant CHT's AS1802 is a gray, non-corrosive, neutral cure, thermally conductive 1-part RTV silicone adhesive sealant. It is one in a range of (read more)
Browse Silicone Adhesives and Sealants Datasheets for CHT USA Inc. -
resistance, electrical insulating properties over a wide temperature range, and low shrinkage, low stress, and chemical resistance when cured. Deepmaterial is best top waterproof structural adhesive glue for plastic to metal and glass manufacturer,supply non conductive epoxy adhesive sealant (read more)
Browse Epoxy Adhesives Datasheets for Shenzhen DeepMaterial Technologies Co., Ltd -
Amperage rating: to 400 amp Seals a single electrode or element Supplied with or without conductors Easy to assemble and adjust in the field Stainless Steel reusable fitting for gas or non-conductive liquid Available without electrode (read more)
Browse Electrical Feedthroughs Datasheets for Conax Technologies -
Adhesive Sealants The benefits of having a thermally conductive adhesive mean you can permanently bond your component to some form of heat sink and eliminate the need for additional mechanical fastening systems. It will also prevent the possibility of movement and air (read more)
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Conduct Research Top
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An Overview of Non-Conductive Epoxy for Electronics
to assembling electronic goods and other similar products. When it comes to bonding electronics/electrical products, conductive and non-conductive glues are used to achieve special purposes.
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All the Facts you Need to Understand Non Conductive Glue for Electronics
of various bonding materials like glues, sealants, and adhesives, they have great capability. Adhesive manufacturers make all types of non-conductive glues according to various customer specifications as demanded by the market and customers. These bonding materials are used in various areas