Non Conductive Sealant

Description: LOCTITE 3220W, Epoxy, Adhesive and Sealant LOCTITE® 3220W is designed for use in heat sensitive optoelectronic components and other microelectronic devices. This material offers excellent light reflection characteristics. LOCTITE 3220W is an white colored version of LOCTITE 3220 adhesive. One

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Single Component System
• Substrate / Material Compatibility: Ceramic / Glass
• Viscosity: 31800 cP

Description: also used as a sealant and adhesive for assembly and repair of industrial furnaces, ovens, boilers, exhaust stacks, high temperature ducting, and heating elements in electrical appliances. This product is typically used in applications with an operating range of -50 °C to +250 °C and can

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Single Component System
• Viscosity: 73500 cP

Description: Techsil RTV 1084G is a non-corrosive, 1-part, grey silicone rubber. RTV 1084 G has amazing thermal conductivity (2.3 W/mK) and is non corrosive, fast skinning with low linear shrinkage. It is one of a new family of products called acetone cure sealants that are solvent free. It

• Compound Type: Electrically Conductive, Thermally Conductive

Description: LOCTITE ABLESTIK A 304-6, Epoxy, Adhesive and Sealant LOCTITE® ABLESTIK A 304-6 epoxy adhesive and sealant is designed for high throughput assembly operations. Non-conductive One component Readily pourable Fast cure Good toughness Excellent chemical resistance

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Single Component System
• Features: Electrical Insulation / Dielectric Material
• Viscosity: 21500 cP

Description: LOCTITE ABLESTIK E 3517, Epoxy, Low Electrical Conductivity, Sealant LOCTITE® ABLESTIK E 3517 is used in applications where a low electrical conductive sealant is required. One component, requires no mixing Electrically conductive Low viscosity Good dispense and flow

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Single Component System
• Viscosity: Up to 6000 cP

Description: LiPOLY N-putty series is silicone-free and dispensable thermally conductive material. With a thermal conductivity from 3.5 W/m*K, this product can be used successfully to remove manufacturing tolerances. It is ideally suited for dispensing using the N-putty dispensing robot.

• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 300 kV/in
• Features: Thermal Compound / Interface (Thermally Conductive)
• Industry: Electronics

Description: Techsil® TIM11123 (GB) Grey is a 200 micron, self-gapping, non-corrosive, 1-part room temperature vulcanizing (RTV) silicone rubber. It is one of a new family of products called acetone cure sealants. These products are cured rapidly in contact with atmospheric moisture to a tough

• Compound Type: Electrically Conductive, Thermally Conductive
• Material Form: Gap Filling Compound

Description: LiPOLY EP770 is a two-part epoxy material for gap filling. Extremely low viscosity and flowability. Good dispersion and no delamination. The high deformation material, which filling the gap closely, cover the tolerance, and has outstanding conductivity, makes is suitable for filling the peculiar

• Chemical / Polymer System Type: Epoxy (EP)
• Dielectric Strength: 350 kV/in
• Features: Gap Filling Sealant / FIP Gasket, Thermal Compound / Interface (Thermally Conductive)
• Industry: Electronics

Description: MasterSil 323AO-LO is a two component silicone elastomer with a self-priming feature, designed for bonding, sealing and gap filling applications. This electrically insulating and thermally conductive compound meets NASA low outgassing specifications and can be used in the aerospace,

• Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
• Chemical / Polymer System Type: Silicone
• Coeff. of Thermal Expansion (CTE): 77.78 to 94.44 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: Non-Silicone Thermal Compound N800AH is made of non-silicon resin material and none low-molecular-weight siloxane. N800AH helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal

• Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 203 kV/in
• Features: Thermal Compound / Interface (Thermally Conductive)

Description: Non-Silicone Thermal Compound N800B is made of non-silicon resin material and none low-molecular-weight siloxane. N800B helps avoid electrical contact problems. N800 is flexible and has great thermal conduction, making the thermal resistance as low as possible. The thermal conductivity

• Applied Thickness / Gap Fill: 0.0197 to 0.1969 inch
• Chemical / Polymer System Type: Specialty / Other
• Dielectric Strength: 203 kV/in
• Features: Thermal Compound / Interface (Thermally Conductive)

Description: The SHEEN's AF Series Silicone-free Thermal Pads (Non-silicone Thermal Pads) are renowned for their distinctive characteristics, which include: ? Good thermal conductivity, with options ranging from 1.0 to 8.0 W/m·K. ? Available in various thicknesses from 0.5 to 5.0 mm

• Compound Type: Thermal Compound / Heat Conductive
• Dielectric Constant (Relative Permittivity): 7.5
• Dielectric Strength: 2.03E-4 kV/in
• Elongation: 70 %

Description: Safety Packaging Under Nitrogen

Description: Master Bond EP40TC is a two part epoxy system, designed for bonding, sealing and encapsulating applications where thermal conductivity and electrical insulation are required.

• Applied Thickness / Gap Fill: 1.00E-3 to 0.0030 inch
• Chemical / Polymer System Type: Epoxy (EP)
• Coeff. of Thermal Expansion (CTE): 2.22E7 to 2.50E7 µin/in-F
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System

Description: Our G6E-TSAL™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
• Filled / Reinforced: Yes

Description: Our G6E-TSHV™ Epoxy has been specifically developed for general purpose applications that necessitate the bonding or connecting of thermally conductive components/materials . It is designed to provide efficient heat transfer between components or surfaces, while also providing the

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease), Grease / Paste
• Filled / Reinforced: Yes

Description: Master Bond MasterSil 705TC is a one component, thermally conductive, electrically isolating silicone for bonding, sealing and coating applications. It features outstanding thermal conductivity and is well suited for applications that require flexibility and high temperature resistance. It

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Reactive / Moisture Cured, Single Component System
• Dielectric Constant (Relative Permittivity): 4.2
• Dielectric Strength: 850 kV/in

Description: Master Bond EP35AOLV is a two component thermally conductive, electrically isolating epoxy for bonding, sealing and potting. Key features include its good flow properties, high temperature resistance, its ability to withstand aggressive chemicals, and high compressive strength.

• Applied Thickness / Gap Fill: 0.0020 to 0.0030 inch
• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Dielectric Constant (Relative Permittivity): 4.6

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Chemical / Polymer System Type: Silicone
• Compound Type: Thermally Conductive
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
• Rubber Based / Elastomeric: Yes

Description: SEMICOSIL® 962 TC A/B is a shear-thinning, easydispensing, non-slump, addition-curing, two part silicone rubber that cures at room temperature to a soft, flexible and tacky rubber with excellent thermal conductivity.

• Chemical / Polymer System Type: Silicone
• Cure Type / Technology: Air Setting / Film Drying, Thermosetting / Crosslinking, Two Component System
• Dielectric Strength: 178 kV/in
• Features: Gap Filling Sealant / FIP Gasket

Description: WACKER’s silicone adhesives and sealants are based on many years of experience, innovative research and comprehensive technological expertise. In a wide variety of industries, especially in lighting technology, flowable or non-sag silicone products offer decisive advantages in

• Chemical / Polymer System Type: Silicone
• Compound Type: Electrically Conductive
• Cure Type / Technology: Thermosetting / Crosslinking
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: Thermotech TE™ is a Silver-filled, electrically conductive high-vacuum compound specifically manufactured by Pure Tech for the sputtering target industry. Thermotech TE combines the excellent thermal and electrical conductive properties of pure Silver with a low vapor pressure

• Compound Type: Electrically Conductive
• Cure Type / Technology: Two Component System
• Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)

Description: The 50-2150FR Potting and Encapsulating Compound has been formulated to meet the stringent non-burning requirements of UL94 V-O. This system offers excellent heat transfer, low exotherm, and excellent electrical properties. 50-2150 is a two part, non-mercury, flexible polyurethane

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.3
• Dielectric Strength: 540 kV/in

Description: stringent and non-burning requirements of UL 94 V-O. The 50-2185 has outstanding thermal cycling properties and low embedment stress to sensitive components. This system will maintain its’ integrity over a wide operating temperature range, -50 to 120°C. Its’ low glass transition temperature

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking, Room Temperature Curing
• Dielectric Constant (Relative Permittivity): 4.3
• Dielectric Strength: 540 kV/in

Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature resistance are

• Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System, Thermosetting / Crosslinking
• Dielectric Constant (Relative Permittivity): 4.7 to 4.8

Description: circuits, medical sensor assembly and repair and many other similar applications. FEATURES: · Flexible (after curing) · Carbon Filled (Non-Metallic & Non-Magnetic) · Electrically Conductive · Resistant to Temperature Variations

• Chemical / Polymer System Type: Epoxy (EP)
• Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
• Features: Electrically Conductive Compound (Adhesive, Grease), EMI / RFI Shielding Material, Flexible / Dampening, Grease / Paste
• Filled / Reinforced: Yes

Description: Dow DOWSIL™ SE 1700 W/C Thermally Conductive Adhesive Clear is a two-part non-flowing, heat cure, and high tensile strength adhesive. It is primarily used for sealing ceramic condensers, sealing PCB components, and as a bonding agent for key pad of PC. 1.1 kg Kit.

• Cure Type / Technology: Two Component System
• Elongation: 355 %
• Features: Thermal Compound / Interface (Thermally Conductive)
• Substrate / Material Compatibility: Ceramic / Glass

Description: Henkel Loctite STYCAST 5952 Red, formerly Emerson and Cuming, is a two component, addition cured, filled silicone encapsulant that is used for encapsulating electronic components that generate heat such as sensors, transformers, and power supplies. It is non-corrosive, reversion resistant,

• Compound Type: Encapsulating / Potting, Thermal Compound / Heat Conductive
• Cure Type / Technology: Two Component System
• Dielectric Strength: 450 kV/in
• Elongation: 50 %

Description: Fills gap between device and heatsink, reduces thermal resistance. Can be used as a low bond strength adhesive, sealant or gasketing compond. High viscosity, non-slump paste. High thermal conductivity. Good electrical insulation characteristics. Remains flexible and elastic at high

• Compound Type: Thermally Conductive
• Material Form: Specialty / Other
• Thermal Conductivity: 1.8 W/m-K
• Use Temperature: -58 to 446 F

Description: CHT’s AS1803 is a white, non-corrosive, neutral cure 1-part RTV silicone adhesive sealant. This product will not corrode copper or its alloys and is designed for use with electronic components. It is part of CHT's range of Acetone cure products which are all solvent free. It features a

• Cure Type / Technology: Single Component System, Specialty / Other
• Dielectric Strength: 991 kV/in
• Elongation: 94 %
• Features: Flame Retardant (e.g. UL 94 Rated), UL Approved

Description: also be used as a waterproof sealant for electrical, electronic and communication equipment. Product Benefits Easy to use, one-component material Flame retardant Non-corrosive to most metals Low volatility Low odour Fast cure at room

• Chemical / Polymer System Type: Silicone
• Function: Thermal Compound / Heat Conductive
• Industry: Electronics

Description: sealant for electrical, electronic and communication equipment. Product Benefits Easy to use, one-component material Flame retardant Non-corrosive to most metals Low volatility Low odour Fast cure at room temperature

• Compound Type: Thermal Compound / Heat Conductive
• Industry: Electronics

Description: The SHEEN's PU4500 Series Thermal Conductive PU Adhesive are renowned for their distinctive characteristics, which include: ? Thermal conductivity ranging from 1.0 to 2.0 W/m·K. ? Two-component adhesive, cures at room temperature or with heat. ? 100% solid

• Compound Type: Thermal Compound / Heat Conductive
• Industry: Electronics
• Use Temperature: -40 to 185 F

Description: HYSOL ECCOBOND DS7300 one component non-conductive epoxy perimeter sealant is designed to be used in display applications.

• Industry: Electronics
• Viscosity: 1200 cP

Description: Sauereisen Insa-Lute Adhesive Cement No. 1 is specified throughout the automotive, appliance and assembly industries for bonding, insulating, and encapsulating applications. A thermally conductive and electrically insulating cement paste, the material bonds well to metal, ceramics and

• Chemical / Polymer System Type: Ceramic / Inorganic Cement
• Cure Type / Technology: Air Setting / Film Drying, Single Component System
• Dielectric Constant (Relative Permittivity): 3.5 to 6
• Dielectric Strength: 1.3 to 50.8 kV/in