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Supplier: PUI - Projections Unlimited, Inc.
Description: 120 Milliwatt (mW) Power Dissipation (PD) (Green) Plastic Leaded Chip Carrier (PLCC) Surface-Mount Light Emitting Diode (LED)
- Color: Multi-Colored, Other
- Forward Current: 30 milliamps
- Viewing Angle: 120 degrees
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Supplier: PUI - Projections Unlimited, Inc.
Description: 62.5 Milliwatt (mW) Power Dissipation (PD) (Green) Plastic Leaded Chip Carrier (PLCC) Surface-Mount Light Emitting Diode (LED)
- Color: Multi-Colored, Other
- Viewing Angle: 120 degrees
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Supplier: PUI - Projections Unlimited, Inc.
Description: A Relative Humidity between 40% and 60% is recommended in ESD-protected work areas to reduce static build up during assembly process
- Color: Multi-Colored, Other
- Forward Current: 30 milliamps
- Viewing Angle: 120 degrees
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Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
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Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
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Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
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Supplier: RS Components, Ltd.
Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation
- Contact Plating: Copper Plating, Other
- Contacts Pitch: 1.27 mm
- Current Rating: 1 amps
- Mounting: Through-hole, Solder
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Supplier: Microchip Technology, Inc.
Description: Temperature Ranges Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28-lead, 0.300" Wide,
- Access Time: 150 ns
- Data Retention: 10 years
- Density: 64 kbits
- IC Package Type: SOIC, DIP, Other
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Supplier: Microchip Technology, Inc.
Description: Data retention > 10 years Temperature Ranges Standard Temperature Range: -40°C to 85°C Military Temperature Range: -55°C to 125°C Available in Green (Pb/Halide-free) Packaging 32-lead, Plastic J-leaded Chip Carrier (PLCC
- Access Time: 70 to 120 ns
- Data Retention: 10 years
- Density: 256 kbits
- IC Package Type: SOIC, DIP, Other
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Supplier: Microchip Technology, Inc.
Description: > 10 years Temperature Ranges Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC)
- Access Time: 70 to 120 ns
- Data Retention: 10 years
- Density: 64 kbits
- IC Package Type: SOIC, Other
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Supplier: Microchip Technology, Inc.
Description: Ranges Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) 28-lead, Plastic Thin
- Access Time: 200 ns
- Data Retention: 10 years
- Density: 256 kbits
- IC Package Type: SOIC, Other
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Supplier: Richardson RFPD
Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic
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Supplier: Richardson RFPD
Description: -scale and offset errors, the part is also specified for dynamic performance parameters including harmonic distortion and signal-to-noise ratio.Power dissipation in normal mode is 90 mW typical while in the standby mode this is reduced to 75 °W typ. The part is available in a 44-pin plastic
- IC Package Type: Other
- Resolution: 12 bits
- Sample Rate: 500 kSamples/Sec
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Supplier: Richardson RFPD
Description: ensures greater functionality with low power dissipation. The part is packaged in both a 0.6', 40-pin plastic DIP and a 44-pin plastic leaded (J-lead) chip carrier, PLCC.
- IC Package Type: CSP
- Resolution: 10 bits
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Supplier: Richardson RFPD
Description: . Full power output signals up to 20kHz can be created.The AD7840 is fabricated in linear compatible CMOS (LC2MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in a 24-pin plastic and hermetic dual-in-line
- Resolution: 14 bits
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with dispersants, binders, plasticizers, and other additives to prepare a uniform and stable slurry (slurry); then the slurry is evenly coated on a carrier film (such as PET film) through a doctor blade, and after drying and removing the solvent, a green tape with a certain strength is formed (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd.
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What is a PLCC Socket?
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit boards (PCBs).
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Preventing a Line-Down Crisis from End-of-Life Semiconductor Components
Rochester Electronics assembled a Plastic Leaded Chip Carrier (PLCC) package for an Industrial OEM manufacturer facing a line-down crisis, through our partnership with the original component manufacturer.
More Information Top
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LED Manufacturer Profiles - World - 2013
DomiLED uses a PLCC ( Plastic leaded chip carrier ) type package with a size of 3.5x2.8mm which enables input current from IF=20mA to 40mA.
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Reliability behavior of lead-free solder joints in electronic components
The appearance of PLCC ( Plastic Leaded Chip Carrier ) is similar to that of QFP devices.
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Forensic Computing
More likely today, however, SRAM will be in PLCC ( Plastic Leaded Chip Carrier ) or TQFP (Thin Quad Flat Plastic) packages, that are surface mounted onto the motherboard.
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PCB Design for Manufacturability
PLCC ( PLASTIC LEADED CHIP CARRIER ) - A square component package commonly having J-leads on all four sides.
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Achieving accurate thermal characterization using a CFD code-case study of plastic packages
… set of modeling guidelines which are then applied to a larger spectrum of cases to yield predictions of component-level thermal perfor- mance. “he component used to develop the guidelines was an 84- PLCC ( plastic leaded chip carrier ) and the rules were …