Products & Services
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Supplier: Allied Electronics, Inc.
Description: TE Connectivity extraction tool is designed to remove chip carries from AMP surface mount low insertion force sockets, SOJ (Small Outline J-Leaded) sockets, and soldertail sockets.
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Supplier: PUI - Projections Unlimited, Inc.
Description: 120 Milliwatt (mW) Power Dissipation (PD) (Green) Plastic Leaded Chip Carrier (PLCC) Surface-Mount Light Emitting Diode (LED)
- Forward Current: 30 milliamps
- Viewing Angle: 120 degrees
- LED Type: Multi-Colored
- Features: Other
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Supplier: Allied Electronics, Inc.
Description: PLCC Test Adapter Kits Test adapters designed for plastic-leaded chip carriers (PCC or PLCC) with “J” leads. Snap-ring design allows Quad Clip® Test Adapter to fit directly into IC, providing hands-free testing. Upper: 0.025" square pins, gold-plated,
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Supplier: Microchip Technology, Inc.
Description: 100,000 erase/write cycles Data retention > 10 years Temperature Ranges Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.600" Wide, Plastic Dual Inline
- Density: 64 kbits
- Access Time: 150 ns
- Data Retention: 10 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: (Pb/Halide-free) Packaging Low Power Consumption Read / Write current 40 mA (Max) 32-lead, Plastic J-leaded Chip Carrier (PLCC) Standby current TTL 2 mA (Max), CMOS 200 μA (Max) Write-Protection Hardware Protection Software Data Protect Data retention > 10 years
- Density: 256 kbits
- Access Time: 150 to 250 ns
- Data Retention: 10 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 4,000 kbits
- Access Time: 70 to 90 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Microchip Technology, Inc.
Description: (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 32-lead, 0.600" wide, plastic, dual inline package (PDIP)
- Density: 8,000 kbits
- Access Time: 90 ns
- Data Retention: 20 years
- Operating Temperature: -40 to 85 C
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Supplier: Richardson RFPD
Description: greater functionality with low power dissipation. The part is packaged in both a 0.6', 40-pin plastic DIP and a 44-pin plastic leaded (J-lead) chip carrier, PLCC.
- Resolution: 10 bits
- Package Type: CSP
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Supplier: Richardson RFPD
Description: (LCCC) or plastic leaded chip carrier (PLCC).
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with dispersants, binders, plasticizers, and other additives to prepare a uniform and stable slurry (slurry); then the slurry is evenly coated on a carrier film (such as PET film) through a doctor blade, and after drying and removing the solvent, a green tape with a certain strength is formed (read more)
Browse Silicon Nitride and Silicon Nitride Ceramics Datasheets for Xiamen Unipretec Ceramic Technology Co., Ltd.
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What is a PLCC Socket?
Plastic leaded chip carriers (PLCC) sockets are a type of chip carrier used to form connections between integrated circuits (ICs) and printed circuit boards (PCBs).
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Preventing a Line-Down Crisis from End-of-Life Semiconductor Components
Rochester Electronics assembled a Plastic Leaded Chip Carrier (PLCC) package for an Industrial OEM manufacturer facing a line-down crisis, through our partnership with the original component manufacturer.
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LED Manufacturer Profiles - World - 2013
DomiLED uses a PLCC ( Plastic leaded chip carrier ) type package with a size of 3.5x2.8mm which enables input current from IF=20mA to 40mA.
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Reliability behavior of lead-free solder joints in electronic components
The appearance of PLCC ( Plastic Leaded Chip Carrier ) is similar to that of QFP devices.
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Forensic Computing
More likely today, however, SRAM will be in PLCC ( Plastic Leaded Chip Carrier ) or TQFP (Thin Quad Flat Plastic) packages, that are surface mounted onto the motherboard.
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PCB Design for Manufacturability
PLCC ( PLASTIC LEADED CHIP CARRIER ) - A square component package commonly having J-leads on all four sides.
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Achieving accurate thermal characterization using a CFD code-case study of plastic packages
… set of modeling guidelines which are then applied to a larger spectrum of cases to yield predictions of component-level thermal perfor- mance. “he component used to develop the guidelines was an 84- PLCC ( plastic leaded chip carrier ) and the rules were …