PLCC Plastic Leaded Chip Carrier

Description: TE Connectivity extraction tool is designed to remove chip carries from AMP surface mount low insertion force sockets, SOJ (Small Outline J-Leaded) sockets, and soldertail sockets.

• Application / Connector Type: General Application
• Form Factor: Handheld
• Technology: Hand Tools
• Tool Type: Other

Description: SPECIFICATION FOR LEADFRAMES FOR PLASTIC LEADED CHIP CARRIER (PLCC) PACKAGES

Description: PLCC Test Adapter Kits Test adapters designed for plastic-leaded chip carriers (PCC or PLCC) with “J” leads. Snap-ring design allows Quad Clip® Test Adapter to fit directly into IC, providing hands-free testing. Upper: 0.025" square pins, gold-plated, phosphor

• Current Rating: 1 amps
• Voltage Rating: 500 volts

Description: chip carriers (LCC). The AD640J is specified for the commercial temperature range of 0°C to +70°C, and is available in both 20-lead plastic DIP (N) and PLCC (P) packages. This device is now available to Standard Military Drawing (DESC) number 5962-9095501MRA and

• Operating Temperature: -55 to 125 C
• Package Type: CDIP, PDIP, PLCC, Other
• Pin Count: 20

Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation

• Contact Plating: Copper Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 1 amps
• Mounting: Through-hole, Solder

Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation

• Contact Plating: Copper Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 1 amps
• Mounting: Through-hole, Solder

Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation

• Contact Plating: Copper Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 1 amps
• Mounting: Through-hole, Solder

Description: Plastic leaded chip carrier (PLCC) sockets with through hole solder tails. 2.54mm grid matching JEDEC patterns. Stand - offs aid cleaning and heat dissipation. Suitable extraction tool (stock no. 480-3005). Insulation material: Glass filled polyester. Insulation

• Contact Plating: Copper Plating, Other
• Contacts Pitch: 1.27 mm
• Current Rating: 1 amps
• Mounting: Through-hole, Solder

Description: Temperature Ranges Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.600" Wide, Plastic Dual Inline Package (PDIP) 28-lead, 0.300" Wide,

• Access Time: 150 ns
• Data Retention: 10 years
• Density: 64 kbits
• IC Package Type: SOIC, DIP, Other

Description: Data retention > 10 years Temperature Ranges Standard Temperature Range: -40°C to 85°C Military Temperature Range: -55°C to 125°C Available in Green (Pb/Halide-free) Packaging 32-lead, Plastic J-leaded Chip Carrier (PLCC

• Access Time: 70 to 120 ns
• Data Retention: 10 years
• Density: 256 kbits
• IC Package Type: SOIC, DIP, Other

Description: , Plastic J-leaded Chip Carrier (PLCC) 32-lead, Plastic Thin Small Outline Package (TSOP) Available in dual marked (5962-382670xxx) CERAMIC Hermetic Packaging 32-Lead, 0.600" Wide, Non-Windowed, Ceramic Dual Inline (Cerdip) 32-Lead,

• Access Time: 120 to 150 ns
• Data Rate: 120 MHz
• Data Retention: 10 years
• Density: 1000 kbits

Description: Standard Temperature Range: -40°C to 85°C Available in Green (Pb/Halide-free) Packaging Only 32-lead, Plastic J-leaded Chip Carrier (PLCC) 28-lead, 0.300" Wide, Plastic Gull Wing Small Outline (SOIC) 28-lead, Plastic Thin Small

• Access Time: 200 ns
• Data Retention: 10 years
• Density: 64 kbits
• IC Package Type: SOIC, Other

Description: AD7878 is fabricated in Linear Compatible CMOS (LC2 MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in four package styles, 28-pin plastic and hermetic dual-in-line package (DIP), leadless ceramic

Description: -scale and offset errors, the part is also specified for dynamic performance parameters including harmonic distortion and signal-to-noise ratio.Power dissipation in normal mode is 90 mW typical while in the standby mode this is reduced to 75 °W typ. The part is available in a 44-pin plastic

• IC Package Type: Other
• Resolution: 12 bits
• Sample Rate: 500 kSamples/Sec

Description: ensures greater functionality with low power dissipation. The part is packaged in both a 0.6', 40-pin plastic DIP and a 44-pin plastic leaded (J-lead) chip carrier, PLCC.

• IC Package Type: CSP
• Resolution: 10 bits

Description: process. Its monolithic CMOS construction ensures greater functionality with low power dissipation. The part is packaged in both a 0.6', 40-pin plastic DIP and a 44-pin plastic leaded (J-lead) chip carrier, PLCC.

• IC Package Type: Other
• Interface Type: Parallel
• Operating Temperature: 0.0 to 70 C
• Pin Count: 48

Description: . Full power output signals up to 20kHz can be created.The AD7840 is fabricated in linear compatible CMOS (LC2MOS), an advanced, mixed technology process that combines precision bipolar circuits with low power CMOS logic. The part is available in a 24-pin plastic and hermetic dual-in-line

• Resolution: 14 bits

Description: user-programmable with two external capacitors and one resistor. Input offset voltage can be trimmed to zero with an external potentiometer. The AD650JN and AD650KN are offered in a plastic 14-pin DIP package. The AD650JP and AD650KP are available in a 20-pin plastic leaded

• Signal Converter Type: Frequency-to-Voltage Converter, Voltage-to-Frequency Converter