Polyimide Foam

Description: THERMAL/ACOUSTIC INSULATION BARRIER MATERIAL: POLYIMIDE FOAM

Description: Insulation, Thermal and Acoustic Absorptive, Cellular Polyimide Foam

Description: INSULATION, THERMAL AND ACOUSTIC ABSORPTIVE, CELLULAR POLYIMIDE FOAM

Description: INSULATION PANEL, THERMAL AND ACOUSTIC ABSORPTIVE, OPEN-CELL POLYIMIDE FOAM

Description: This specification covers the material and process requirements for fabricating sandwich radomes having polyimide-resin-impregnated quartz cloth shells and polyimide-resin syntactic foam cores.

Description: This specification covers the material and process requirements for fabricating sandwich radomes having hot-melt, addition-reaction polyimide-resin-impregnated quartz cloth shells and polyimide-resin syntactic foam cores.

Description: This specification covers the material and process requirements for fabricating sandwich radomes having hot-melt, addition-reaction polyimide-resin-impregnated quartz cloth shells and polyimide-resin syntactic foam cores.

Description: This specification covers one type of hot-melt, addition-type, polyimide adhesive in the form of supported film furnished in rolls or cut sheets.

Description: SOLIMIDE ® AC-530 polyimide foam is used in aircraft, aerospace and industrial markets as a lightweight, non-wicking, thermal and acoustic foam insulation material where fire resistance, non-toxic properties, and the absence of smoke generation are critical. It is formaldehyde

• Bulk Density: 0.34 lbs/ft³
• Noise Reduction Coefficient (NRC): 0.7
• Use Temperature: 400 F
• Thermal Conductivity: 0.33974009189622817 BTU-in/hr-ft²-F

Description: Through a proprietary manufacturing process, SOLIMIDE ® polyimide open-cell foam insulation is densified to a desired density and thickness, providing vibration damping with enhanced thermal management for small spaces. Introduced in 2016, the new product is an extension of the

• Bulk Density: 4 lbs/ft³
• Use Temperature: 575 F
• Thermal Conductivity: 0.22187108042202655 BTU-in/hr-ft²-F
• Applications: Acoustics / Sound Proofing, Aerospace, Medical

Description: ThermaCool K271 is manufactured with a 1.0 mil thick thermally conductive DuPont® Kapton® polyimide film. The film is coated with 1.5 mils of thermally conductive acrylic pressure-sensitive adhesive on one side, and 2.0 mils of thermally conductive silicone rubber on the other side.

• Thickness: 0.0044881914 inch
• Operating Temperature: -20.2 F
• Features: Adhesive Backed, Color Options
• Material: Foam, Silicone Rubber

Description: This specification establishes the composition and physical properties of rigid polyimide cellular foams intended for use as thermal and sound-isolating insulation in commercial and industrial environments. The polyimide insulations covered are classified into three types (Types

Description: This specification covers the composition and physical properties of lightweight, flexible open-cell polyimide foam insulation intended for use as thermal and sound-absorbing insulation for a certain temperature range in commercial and industrial environments. The insulations are

Description: SOLIMIDE® polyimide foam was developed with U.S. government agency, NASA, for the Apollo spacecraft and has since been used by dozens of the world’s leading OEMs, including most major commercial aircraft manufacturers as aircraft insulation across a variety of applications. The

• Applications: Acoustics / Sound Proofing, Aerospace
• Form / Shape: Fabricated Shapes / Parts (Molded, Cast)
• Type: Flexible, Open Cellular
• Material / Composition: Plastic / Polymer, Polyimide

Description: RS PRO 6MMZOTEKSAB Acoustic Insulation

• Use Temperature: -94 to 401 F
• Applications: Acoustics / Sound Proofing
• Material / Composition: Plastic / Polymer, Polyimide
• Features: Specialty / Other

Description: Reticulated Polyurethane Foam Thermal Insulation Our deep technical knowledge of reticulated polyurethane foams and polyethylene foams is utilized when creating custom thermal insulation components. UFP Technologies will work with you to design and fabricate your custom

• Capabilities: Low Volume, Cutting, Fabrication, High Volume, Laminating, Molding
• Industry: Aerospace, Automotive, Consumer, Electrical / Electronics, General Industrial, Medical
• Services: Design, Prototype
• Materials: Foam, Natural / Biological, Plastics

Description: specialization in selecting best gasket material and gasket design for applications like an intake gasket, oil pan gasket, exhaust gasket, manifold gasket, enclosure door gasket or closed cell foam pad as well as vibration dampers, various mechanical seals and rubber grommets. Solutions

• Features: Adhesive Backed, Color Options, EMI / RFI Shielding
• Material: Cork, Ethylene Propylene (EPDM), Foam, Neoprene, Nitrile (NBR - Buna-N), Polyethylene (PE), Polyurethane / Urethane, Polyvinyl Chloride (PVC), Silicone Rubber, Steel
• Gasket Type: Gasket Strip, Sheet / Die-cut, Weatherstripping, Window Gasket

Description: ±2μm Applicable workpieces: ceramics, glass, quartz, indium phosphide, alloys,tungsten copper, polymers,Rogers boards, polyimide.

• Type: Complete / Turnkey System
• Laser Operation: Laser Cutting
• Options / Components: Laser Head / Focusing Unit, Laser Optics / Beam Delivery, Laser System Enclosure, Monitoring Sensors / System
• Workpiece Material: Metal / Conductive Materials, Semiconductors / Electronics

Description: the design, specifying the materials, and selecting the right manufacturing process. 3. Flex PCB Manufacturing: The next step is to print circuit traces onto a flexible substrate material, such as polyimide, using specialized machines. Laser cutting is used to remove excess material and

• Features: East Asia / Pacific Only, United States Only
• PCB Type: Flexible Boards
• Supplier Capability: PCB Assembly

Description: bismaleimide, epoxy, phenolic, poly(amideimide), polybenzimidazole, polyester (thermosetting and thermoplastic), poly(ether ether ketone), poly(ether imide), polyimide (thermosetting and thermoplastic), poly(phenylene sulfide), or polysulfone matrices; and alumina, aramid, boron, carbon,

Description: composites, sandwich core materials, and filament-wound pressure vessels containing but not limited to bismaleimide, epoxy, phenolic, poly(amideimide), polybenzimidazole, polyester (thermosetting and thermoplastic), poly(ether ether ketone), poly(ether imide), polyimide (thermosetting and