Products/Services for Premolded QFN
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IC Package Converters and Adapters - (56 companies)Ball-grid array (BGA), land-grid array (LGA), pin grid array (PGA), and interstitial package grid array (IPGA). Single in-line package (SIP), dual in-line package (DIP), quad flat package (QFP) and quad flat non-leaded package (QFN, QFNL). Small...Product TypeRoHS CompliantTop (Input) Side Package -
IC Sockets and Headers - (345 companies)IC sockets and headers are board-mounted female connectors that serve as carriers for integrated circuit (IC) chips. -
IC Interconnect Components - (527 companies)IC interconnect components interface or connect a microelectronic semiconductor chip to a board or larger scale device. -
Ear Protection - (420 companies)Ear protection devices protect the ears and ear organs from elevated decibel levels and debris and water ingress. -
Rules and Length Gauges - (244 companies)Rules and length gauges are flat, graduated scales used for length measurement. For OEM applications, digital or electronic linear scales are often used. -
Electronics Test Fixtures - (75 companies)Electronics test fixtures are used to test contact points on circuit boards during manual or automated testing.
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IC Timers - (120 companies)IC timers are semiconductor circuits that generate or set timing for electronic circuits.
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IC Phase-locked Loops (PLL) - (121 companies)IC phase-locked loops (PLL) are closed-loop frequency controls that are based on the phase difference between the input signal and the output signal of a controlled oscillator.
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Plugs, Stoppers, and Inserts - (416 companies)Plugs, stoppers and inserts fit into holes or cavities and are designed for the ends of shafts, tubes, pipes, fittings, connectors, screws, bars, or other shapes.
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IC Signal Generators - (43 companies)IC waveform generators provide several different waveforms or functions at the desired frequency.
Product News
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Rochester Electronics
QFN and DFN Assemblies As the market shifts towards substrate BGA, QFN, and DFN assemblies, the future of SOIC and low pin-count PLCCs will be significantly impacted. Rochester's investment in QFN/DFN assemblies ensures continued support for long-term system companies and flexibility, with footprint compatibility and minor board changes. Learn how we are solving another component of the obsolescence puzzle for our global customers. (read more)Browse Uncategorized Products Datasheets for Rochester Electronics -
Win Source Electronics
Marvell 88E6320 High-Popularity QFN Component Key Features and Professional Benefits of Marvell 88E6320. Halogen-Free Compliance: Meets environmental safety standards, making it suitable for eco-conscious projects. High Popularity: Widely recognized and utilized in industrial and electronic applications, ensuring reliability and industry acceptance. Balanced Supply and Demand: Stable availability reduces procurement risks for manufacturers and engineers. QFN Package: Offers compact, robust design for space-constrained environments... (read more)Browse IC Interfaces Datasheets for Win Source Electronics -
Hammond Manufacturing Company Inc.
1556 Series Modern General Purpose Enclosure in pack of 4, can be installed facing outwards for heavy duty wall mounting, or inside the pre-molded foot slots on the back of the enclosure for flush wall mounting. Each enclosure includes adhesive rubber feet, which prevent enclosures from jostling and sliding when mounted on a desk or tabletop. The enclosure lid is secured by installing four self-tapping Plastite screws into pre-molded screw posts. Optional aluminum inner panels are available for all sizes. Features. Made with UL94-V0 rated flame... (read more)Browse Electronic and Instrument Enclosures Datasheets for Hammond Manufacturing Company Inc. -
DigiKey
Hammond 1556 Series ABS Plastic Enclosures for heavy-duty wall mounting or inside the pre-molded foot slots on the back of the enclosure for flush wall mounting. Adhesive rubber feet are included with each enclosure which prevent unwanted movement when mounted on a desk or tabletop. Aluminum inner panels are available for all sizes. The enclosure lid is secured by installing four self-tapping Plastite screws into pre-molded screw posts. Features. Molded in UL94-V0-rated, flame-retardant ABS plastic. Designed to meet IP54 standards. 14 sizes... (read more)Browse Industrial Enclosures Datasheets for DigiKey -
Marki Microwave LLC
High Performance Comes in Small Packages Current industry demands on size and performance require filters to be extremely small and capable of reliably operating at higher and higher frequencies. Marki Microwave 's newest GaAs MMIC filters feature low 1-2 dB passband insertion loss at center frequency and high frequency coverage currently up to 40 GHz in a compact 5x5mm QFN. (read more)Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
Marki Microwave LLC
Broad Bandwidth GaAs MMIC Doubler The MMD-0415HPSM is a MMIC doubler fabricated with GaAs Schottky diodes, operating over a guaranteed 2 to 7.5 GHz input frequency range or a doubled output frequency range of 4 to 15 GHz. It features excellent conversion loss, superior isolations, and harmonic suppressions across a broad bandwidth. Available as a 3x3mm QFN. (read more)Browse RF Frequency Multipliers Datasheets for Marki Microwave LLC -
Marki Microwave LLC
High Performance MMIC Filters Current industry demands on size and performance require filters to be extremely small and capable of reliably operating at higher and higher frequencies. Marki Microwave 's newest GaAs MMIC filters feature low 1 to 2dB passband insertion loss at center frequency and high frequency coverage currently up to 40 GHz in a compact 5x5 mm QFN. (read more)Browse RF Band Pass Filters Datasheets for Marki Microwave LLC -
Rochester Electronics
Exploring the Semiconductor Manufacturing Puzzle There are many pieces to any semiconductor product "puzzle " that can result in obsolescence. As the industry shifted to offshore assembly, Rochester Electronics has invested in both lead frame assemblies as well as substrate-based QFN and BGA assemblies onshore to provide continued long-term support. (read more)Browse Uncategorized Products Datasheets for Rochester Electronics -
Marki Microwave LLC
AMM-9860PSM - 3 to 30 GHz Surface Mount LNA AMM-9860PSM - Marki Microwave 's new AMM-9860PSM offers industry-leading LNA performance from 3 to 30 GHz in a compact 3mm QFN offering exceptionally flat response across its entire operating bandwidth. Capable of providing 13.5dB gain and +28dBm OIP3 with a low 2.7 dB typical noise figure, the AMM-9860PSM is an ideal linear signal amplifier for applications requiring low power consumption and small form-factors. (read more)Browse RF Amplifiers Datasheets for Marki Microwave LLC -
Marki Microwave LLC
AMM-9858PSM - 2 to 20 GHz Surface Mount LNA AMM-9858PSM - Marki Microwave 's new AMM-9858PSM offers industry-leading LNA performance from 2 to 20 GHz in a compact 3mm QFN offering exceptionally flat response across its entire operating bandwidth. Capable of providing 17dB gain and +30dBm OIP3 with a low 1.9 dB typical noise figure, the AMM-9858PSM is an ideal linear signal amplifier for applications requiring low power consumption and small form-factors. (read more)Browse RF Amplifiers Datasheets for Marki Microwave LLC
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Electrochemical migration failure on FR-4 PCB by hygro-thermo-vapor pressure coupled analysis
[3] H. C. Hsu, L. M. Chu and S. L. Fu, “Hygro-Thermo-Vapor Pressure Coupled Model on Premold QFN COMS Image Sensor,” Advanced Science Letter, Vol. 4, pp. 1981-1987, June 2011.
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Packaged integrated transceiver for short-range high data-rate communications at 60 GHz
… work, a low-cost solution is proposed to improve the radiation performances of an integrated on-chip folded dipole antenna using a patch radiating element placed under the removable lid of a standard QFN (Quad Flat No Lead) pre- molded cavity package.
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Power Electronic Packaging
Packages such as MLP, thin MLP, premolded and MicroPak MLP, WLCSP, QFN , dual row MLP are widely used today for the power IC products.
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Advanced Microsystems for Automotive Applications 2005
Due to the premolded housing the per- formance of the sensor is the same before and after … … pointed out that VTI is pursuing housing solutions with over-molded low-cost QFN housings as well.
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LCP device housing enables selective thermal management for RF device packages
… first with gold/silicon or gold/tin eutectic to the metal base and then the premolded plastic package body … QFN package designs are now being used for RF devices, especially MMIC units, which require a larger …
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Advanced Microsystems for Automotive Applications 2007
Compared to the standard QFN housing the pins realized here are having excess leads of 0.3 … Due to the premolded housing the perfor- mance of the sensor is the same before and after …
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Springer Handbook of Nanotechnology
This bonded unit is mounted in a premolded plastic package and protected from the ambient environment by … lows the product to be molded in 6×6 mm2 quad flat no-lead ( QFN ) packages (Fig. 51 …
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Packaging technologies for highly integrated 77 GHz automotive radar sensors
This radar sensor in a premold SMD package was assembled using Au- wire bonding technology and epoxy … … Rogers 3003 substrate and integrated with the SiGe-MMIC in a compact ceramic QFN -package with outer …
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Autonomous Sensor Networks
… to a carrier, e.g. a ceramic package, a metal header, or a premolded plastic lead frame … QFN .
