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  • The Effect of Thermal Pad Patterning on QFN Voiding
    Voiding under QFNs is a major challenge in the electronics industry. However, voiding can be suppressed by improving venting accessibility on the thermal pad by using solder mask dividing strips. Venting accessibility is defined as the perimeter length per unit area of the metal pad. Regardless
  • Thermal Pad Design and Process for Voiding Control at QFN Assembly
    Quad-flat no-leads (QFN) package designs are receiving more and more attention in the electronics industry. This package offers a number of benefits including (1) small size, such as a near die size footprint, thin profile, and light weight; (2) easy PCB trace routing due to the use of perimeter I
  • How Stencil Design and Reflow Profiles Affect Variation in QFN Voiding Data: A Case Study
    This study will review several cases where changing the stencil design or reflow profile dialed in the variation of comparative results.
  • Minimizing Voiding in SMT Assembly of BTCs
    As a result of the voiding concern, we and our colleagues have performed a thorough analysis and experimental plan to minimize voiding in QFN assembly. Our experimental plan covers many process and materials parameters. We were successful in reducing voiding to less than 10% in most instances.
  • Kelvin Testing
    that are to be measured. A further complication arises when accurate measurements are required in very small packages. Many analog functions are being packaged in MLF/QFN packages. These devices have pitches as low as 0.4mm and lead dimensions in the range of 0.5mm x 0.25mm. A bottom view of an MLF/QFN
  • LFPAK88 Takes a Shorter Path to Efficiency
    By eliminating internal bond wires and reducing source lead length, Nexperia's LFPAK88 minimizes parasitic source inductance created during switching, resulting in greater efficiency. While alternatives like leadless (QFN) packages or utilizing a Kelvin source connection can offer similar benefits
  • Broadcast FM Radio Tuner for Portable Applications
    measurement. Programmable de-emphasis (50/75 µs). Adaptive noise suppression. Volume control. Line-level analog output. 32.768 kHz reference clock. 2-wire and 3-wire control interface. 2.7 to 5.5 V supply voltage. Integrated LDO regulator allows direct connection to battery. 3 x 3 mm 20-pin QFN package

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