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Supplier: Aries Electronics, Inc.
Description: KEY PERFORMANCE ELEMENTS – Series AR4HT High-Temperature 200°C (high-frequency bandwidth, low inductance, high-current, reliable, durable) Excellent Compliance (shorter than other low-profile contacts, enables reliable ATE testing and burn-in). Excellent choice
- Contacts Pitch: 10.16 mm
- Current Rating: 4 amps
- Features: Clamshell Socket
- Operating Temperature: -55 to 200 C
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Supplier: Aries Electronics, Inc.
Description: FEATURES Low resistance testing using dual independent Aries Kelvin spring-probe technology per device pad for testing of MLF, QFN, LGA and other leadless devices Socket is easily mounted and removed to & from the test board due to solderless pressure mount
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating, Nickel Plating
- Contacts Pitch: 0.4000 to 0.4500 mm
- Features: Solderless, Clamshell Socket
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Supplier: JC Cherry, Inc.
Description: Test Socket GU29 Frame / QFN pkg Size 29x30.6mm / 1.14"x1.20" Can also be used as Burn in Socket ?High reliability ?Cost competitive ?Temperature: -40 to +150? For QFN Device How to order for Custom design GQ29-QFNxxxxxxx *P/N will be informed after fixing
- Package Type: Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Aries Electronics, Inc.
Description: testing and burn-in). Excellent choice for low-cost hand test applications MECHANICAL CONTACT LENGTH (compressed): 0.45mm PITCH: Released to <0.4mm – Mixed Pitch Available PACKAGES: BGA, LGA, QFN, DFN, CSP, POP – Full and Partial Arrays
- Contacts Pitch: 2.54 mm
- Features: Clamshell Socket
- Operating Temperature: -67 to 392 C
- Package Type: BGA, CSP, LGA, QFN, Test / Prototyping Socket, Other
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Supplier: Ironwood Electronics, Inc.
Description: GHz QFN sockets provide 10 GHz bandwidth in a small cost effective ZIF socket for prototype and test applications. The GHz QFN socket is a simple mechanical socket based on an elastomer connector technology. The GHz QFN socket is a
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.4000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: JC Cherry, Inc.
Description: Test & Burn-In Socket GU22 Frame Series Size 22x22mm / 0.87"x0.87" Can also be used as Burn in Socket ?Highly reliable M-pin Probes as contact parts ?High Frequency For BGA Device, QFN Device 0.4mm/0.016" Pitch : 16x16 Contact Max 0.5mm/0.020" Pitch : 10x10 Contact Max
- Contact Resistance: 100 milliohms
- Contacts Pitch: 0.4000 to 0.5000 mm
- Current Rating: 1 amps
- Operating Temperature: -40 to 150 C
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Supplier: Ironwood Electronics, Inc.
Description: SS-BGA sockets provide high bandwidth in a small, cost effective ZIF socket for prototype, test and burn-in applications. SS-BGA socket is a simple, mechanical socket based on spring pin technology. SS-BGA socket is a solder-less socket that can be
- Contact / Pin Type: Spring Loaded
- Contact Plating: Gold Plating
- Contacts Pitch: 0.5000 mm
- Features: Solderless, ZIF Lock, Clamshell Socket
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Supplier: DigiKey
Description: TEST SOCKET FOR QFN-20 0.5MM IC
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Supplier: Molex Signal Tech Industrial Ltd.
Description: to +125 °C Consistent stable contact resistance 120 m? (Ave) Designed for manual test, bench test, and HVM Production Test using the same socket Solution for BGA, LGA, QFN, DFN, and other variants, ideal for minimum pitch 0.35 mm Floating base or Hi Low
- Package Type: BGA, LGA, QFN, Test / Prototyping Socket
- Product Type: IC Socket
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Supplier: Ironwood Electronics, Inc.
Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.8000 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: Ironwood Electronics, Inc.
Description: The Ironwood Electronics line of sockets for BGA, QFN, LGA, and other SMT packages provide a selection for both laboratory test and high volume test. We presently offer 4 major contactor types to handle laboratory testing, high volume test, and temperature
- Contact / Pin Type: Other
- Contact Plating: Gold Plating
- Contacts Pitch: 0.6500 mm
- Features: Solderless, ZIF Lock, Screw Lock
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 40
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 48
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Supplier: RS Components, Ltd.
Description: Clamshell test sockets for QFNs. Spring loaded hinged lid latches to retain ICs. Easy, repeatable access for test purposes. High reliability, durability and temperature range. Body material Glass Filled PES, Glass Filled PEI. Contact material Beryllium Copper. Contact
- Contact Plating: Gold Plating, Nickel Plating, Other
- Contacts Pitch: 0.5000 mm
- Mounting: Solder
- Number of Contacts: 32
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QFN
QFN Test Sockets .
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Innovative approaches for realisation of embedded chip packages - Technological challenges and achievements
This setup is based on a QFN test socket card and automated, parallel daisy chain and four point testing, using a labVIEW environment.
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Emulation Technology, Inc.
ET offers a range of products including BGA socket systems, QFN /MLF test sockets , MICTOR test accessories, spring-probe test clips, programming adapters, prototyping adapters, ASIC and FPGA development systems, wireless products, high speed board to board interconnects as well as soldering …
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http://repositories.lib.utexas.edu/bitstream/handle/2152/22041/hamiltondiss.pdf?sequence=1
The primary socket used for QFN testing of this prototype is the Iron- .
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QFN Test & Burn-In Socket from Yamaichi
QFN Test & Burn-In Socket from Yamaichi .
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Kelvin Testing
Kelvin Testing Using a GHz socket for MLF/ QFN packages .
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QFN 0.5 mm Pitch Test & Burn-In Sockets
QFN 0.5 mm Pitch Test & Burn-In Sockets .
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A SOC/SOP co-design approach for mmW CMOS in QFN technology
For millimeter wave radio “Bits-in / Bits-out” solution integrated into BGA or QFN package, a simple design of the test socket lid allows for sorting tests from antenna radiation pattern to Digital and DC test.
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Pads / Sockets
QFN / QFP / SOP - High Performance Test Socket .
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Package Test / ATE
QFN /QFP/MLF - High Performance ATE Test Sockets for Chipscale Packages .