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  • Unique Application of Solder Ball Technology on QFP Pads Improves Processing Reliability
    IC complexity and higher I/O counts have pushed older technology like Quad Flat Pack packages (QFP) to the limit of finer pin placement. Solder bridging between closely spaced gull wing leads of fine pitch QFP packages presents a significant yield issue in production. This, along with other
  • Ceramics Capillary for Improving Wire Bonding Efficiency
    or substrate. Today, even there are more advanced packaging technologies (QFP, PFP, PGA, BGA, etc.) invented, the wire bonding technology is still the mainstream deployed in the semiconductor packaging industry. Wire bonding is generally considered to be a cost-effective and widely applicable interconnection

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