Thermally Conductive Polyurethane Potting Compounds

Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical

• Viscosity: 150 to 17,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 1.1538232 W/m-K
• Tensile Strength (Break): 2,200 psi

Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal

• Type: Electrically Conductive
• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Thermal Compound / Heat Conductive
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging

Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,

• Viscosity: 150 to 17,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 1.1538232 W/m-K
• Coeff. of Thermal Expansion (CTE): 90 µin/in-F

Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end

• Viscosity: 500 to 3,000 cP
• Thermal Conductivity: 0.297109474 W/m-K
• Dielectric Strength: 400.000000000001 to 609.9999999999997 kV/in
• Dielectric Constant (Relative Permittivity): 6.63

Description: is ideal for meter mix and dispense equipment. This system is a good choice for potting applications containing surface mount components. It can be cured at room temperature or with mild heat. The flame retardant & thermally conductive version of this product is 20-2366 FR.

• Viscosity: 150 to 6,000 cP
• Use Temperature: -85 to 275 F
• Thermal Conductivity: 0.50479765 W/m-K
• Coeff. of Thermal Expansion (CTE): 90 µin/in-F

Description: weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned

• Viscosity: 200,000 cP
• Use Temperature: -300 to 250 F
• Thermal Conductivity: 2.594 W/m-K
• Coeff. of Thermal Expansion (CTE): 46.99999999999999 to 53 µin/in-F

Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry.

• Features: Electronics, Encapsulant / Potting Compound, Flame Retardant (e.g. UL 94 Rated)
• Chemical System: Epoxy (EP)
• Industry: Semiconductors / IC Packaging
• Type: Thermal Compound / Thermally Conductive

Description: Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of

• Features: Electronics, Encapsulating / Potting, Flame Retardant (e.g. UL 94 Rated), Marine, Thermal Compound / Heat Conductive
• Chemical System: Polyurethane (PU, PUR)
• Industry: Semiconductors / IC Packaging
• Cure / Technology: Two Component System

Description: LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector

• Viscosity: 3,500 cP
• Thermal Conductivity: 0.47 W/m-K
• Coeff. of Thermal Expansion (CTE): 60.55555555555556 µin/in-F
• Tensile Strength (Break): 320 psi

Description: ANA-97174 UV is a clear Ultraviolet/ Visible light curing adhesive. It is a low viscosity urethane modified acrylic casting system. It was developed for adhesive and coating applications. It is recommended for small electrical/electronic casting and encapsulating applications that require a unique

• Viscosity: 625 cP
• Use Temperature: -85 to 347 F
• Dielectric Constant (Relative Permittivity): 4.3
• Water Absorption: 1.5 %

Description: High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating thickness, enhanced

• Use Temperature: -85 to 302 F
• Industry: Automotive, Semiconductors / IC Packaging
• Form / Function: Conformal / Encapsulating Coating
• Features: Electronics

Description: weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AO is suitable for potting and encapsulation very thick as well as thin sectioned

• Use Temperature: -300 to 250 F
• Thermal Conductivity: 1.297 W/m-K
• Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
• Tensile Strength (Break): 1,070 psi

Description: ratio by weight. The cured compound has remarkably high peel strength of more than 30 pli along with an elongation of over 150%. EP21TDC-2 develops very little exotherm while curing, making it well suited for potting or encapsulating in thicker sections. It bonds well to many

• Viscosity: 70,000 to 80,000 cP
• Use Temperature: -452 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 39 to 50 µin/in-F

Description: Master Bond Polymer Adhesive EP21TDC is a two component epoxy adhesive for general purpose bonding formulated to cure at room temperature or more rapidly at elevated temperatures, with a one-to-one mix ratio, weight or volume. It readily develops a high bonding strength of more than 2800 psi at

• Viscosity: 60,000 cP
• Use Temperature: -60 to 250 F
• Thermal Conductivity: 0.288 to 0.432 W/m-K
• Coeff. of Thermal Expansion (CTE): 28 to 39 µin/in-F