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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5097 thermally conductive polyurethane potting compound exhibits excellent thermal conductivity making it ideal for applications where heat dissipation is required. The cured resin is resistant to a wide or cycling temperature range
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Epoxies Etc...
Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Epoxies Etc...
Description: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Product Description UR5547 general purpose electrical potting compound is a black polyurethane resin ideally suited to electronics with small or delicate components. The cured resin is semi-rigid, exhibiting very little stress on components, even when thermally cycled
- Form / Function: Encapsulant / Potting Compound
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 47 to 53 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Master Bond, Inc.
Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Silicone, Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Protavic America, Inc.
Description: a unique combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulatin g compound. This material was designed for potting indoor and outdoor telephone
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 60.56 µin/in-F
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: RS Components, Ltd.
Description: Two part polyurethane resin potting and encapsulating compound supplied in handy 250g â??duo-sachetâ?? pack for easy mixing and pouring with no mess. Quick setting, flame retardant and thermally conductive encapsulant designed for general purpose use. The cured
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AO is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Protavic America, Inc.
Description: The two component polyurethane compound described in this data sheet is specifically designed for the encapsulation by casting of completed circuit board. The cured material meets the flammability requirements of UL 94, V-O at thickness of 0.070 in. and greater (UL File Number E116296)
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PNU-56200™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Protavic America, Inc.
Description: PNU 46220™ is an electronics grade; unfilled, room temperature fast curing; two-component polyurethane adhesive is designed for the adhesion and encapsulation of circuit boards, circuit board components and for screw-thread sealing. The cured materials provide long-term circuit protection
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 11000 to 17000 cP
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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3503Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Rubber Based / Elastomeric: Yes
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Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: MG Chemicals 4223 Urethane Conformal Coating offers a highly chemical-resistant finish that meets UL standards for indoor conformal coatings. This PU protects electric circuits against corrosive chemicals, moisture, dirt, dust, thermal shocks and scratches, alongside is also insulates against
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Conformal / Encapsulating Coating
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST U 2500 HTR, Polyurethane, Potting, Encapsulant, Low Viscosity, Excellent Wetting LOCTITE® STYCAST U 2500 HTR flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 74.44 µin/in-F
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.5000 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0138, Urethane, Potting and Encapsulating, Extended polybutadiene/MDI base Sealant LOCTITE® STYCAST US 0138 is an extended polybutadiene/MDI base encapsulant/sealant formulated for potting electronics or devices for protection against environmental hazards. It
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 0.5600 W/m-K
- UL Approved: Yes
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Supplier: Dow Polyurethanes
Description: Dow provides a wide variety of VORANOL* polyether polyols with an extensive selection of performance and processing attrib- utes. Designed to meet your needs, this large family of polyols is sure to provide the balance of properties needed within rigid and molded foam and isocyanate product
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Specialty / Other
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Other
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST U 2500 TEM, Flexible, Polyurethane, Encapsulant LOCTITE® STYCAST U 2500 TEM flexible polyurethane encapsulant is formulated to have low viscosity and excellent wetting properties allowing complete impregnation of either small slightly wound coils or large castings.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Tensile Strength (Break): 507 psi
- Thermal Conductivity: 0.6000 W/m-K
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Encapsulants and Potting Compounds - Techsil® PU20968 Black Flexible Polyurethane 100gm -- TEPU14453Supplier: Techsil Limited
Description: Techsil® PU20968 is a two-part, flexible polyurethane that offers excellent water resistance and electrical insulation characteristics. Product Benefits Non-toxic Low viscosity Excellent seawater resistance Excellent resistance to aqueous based cleaning chemicals Excellent toughness and
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
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Supplier: Dow Polyurethanes
Description: manage energy resources. Dow Formulated Systems, a leading solutions provider of polyurethane and epoxy technology, offers VORATRON™ Electrical Encapsulation Systems, one of Dow’s proud innovations in its growing portfolio of energy management solutions. VORATRON
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Epoxy (EP)
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
- Form / Function: Encapsulant / Potting Compound
- Industry Applications: Other
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Supplier: Dow Polyurethanes
Description: Series-Six Polyurethane Encapsulant is a two-component, modified polyurethane system. The Series-Six system includes: Series-Six Rail Embedment Material Series-Six One-Part Primer Series-Six A55 Rail Embedment Material Series-Six A65
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Thermosetting / Crosslinking
- Electrical / Electronics Applications: Electrical Power / HV (Coils, Motors)
- Industry Applications: Automotive
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Encapsulants and Potting Compounds - Techsil® PU23930 Pearl Polyurethane Twinpack 250gm -- TEEP14087Supplier: Techsil Limited
Description: Techsil® PU23930 is a two-part, flexible, room temperature curing polyurethane resin designed for the potting and encapsulation of LED arrays and lighting equipment. Product Features Excellent long term UV stability Scratch and mark resistant Non-toxic High mechanical strength Easy to
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Digi-Key Electronics
Description: EPOXY POTTING COMPOUND BLACK/YEL
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Digi-Key Electronics
Description: THERMAL POTTING EPOXY 0.75KG PAC
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 83.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 13.89 to 72.22 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3 to 4.6
- Dielectric Strength: 585 kV/in
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 98.33 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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… or premixed and frozen single-component systems, but now the Polytec PU 1000 polyurethane solution provides an … Boron-filled thermally conductive potting compound fills miniature thermistor and thermocouple cavities .
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Industrial Adhesives - Epoxy, Silicone, Polyurethane, Polysulfide and UV Cure Systems for Industrial Applications by Master Bond Inc.
Epoxy, Silicone, Polyurethane , Polysulfide and UV Cure Systems Master Bond manufactures innovative, technologically advanced adhesives, sealants, coatings, potting and encapsulation compounds designed to meet specific application requirements. These include electrical insulative, thermally conductive , electrically conductive, high temperature and chemically resistant grades.
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Conformal Coatings - Environmentally Friendly Conformal Coatings for Electronic Circuitry by Master Bond Inc.
• Industrial Adhesives - Epoxy, Silicone, Polyurethane , Polysulfide and UV Cure Systems for Industrial Applications by Master Bond … • Superior Heat Dissipation with Thermally Conductive Adhesives, Sealants, Coatings, Potting and Encapsulation Compounds by Master Bond Inc.
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Adhesive Bonding Systems for Aerospace, Optical, Electronics, Medical and Automotive Industry by Master Bond Inc.
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Spacecraft Dielectric Material Properties and Spacecraft Charging > Evaluation of Polymers That Might Prevent Spacecraft Charging
The TCNQ doped elastomers have useful properties comparable to those of conventional polyurethane elastomers. In addition to being semi conducting , they develop conduction anisotropy on uniaxial elongation.221 They are not suitable for structural materials or high … … environments, but they can be very useful for applications requiring a moderately conductive vibration damping material or potting compound . Conduction follows a simple thermally activated temperature dependence, and the inverse square root dependence of pressure indicates …
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Potting and Encapsulants for Electronics - Protection of Electronic Devices with Potting and Encapsulation Compounds from Master Bond Inc.
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Low Outgassing Adhesives
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UV Adhesives - Properties of UV Curable Adhesives, Sealants, Coatings and Potting and Encapsulation Compounds by Master Bond
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Metal Adhesives - Properties and Applications of Metal Bonding Adhesives by Master Bond Inc.
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Contamination control of space-based laser instruments
A two component, thermally conductive epoxy encapsulant Cure at the recommended schedule, follow with a post cure of 2 - 4 hours at the highest expected use temperature Polyurethane used as adhesive, stacking, and potting compound Air cured for 24 hours at room temperature .