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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Epoxies Etc...
Description: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 47 to 53 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Master Bond, Inc.
Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Silicone, Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Protavic America, Inc.
Description: unique combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal / Heat Insulating
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 60.56 µin/in-F
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: RS Components, Ltd.
Description: Two part polyurethane resin potting and encapsulating compound supplied in handy 250g ‘duo-sachet’ pack for easy mixing and pouring with no mess. Quick setting, flame retardant and thermally conductive encapsulant designed for general purpose use. The cured
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AO is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 83.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 8.33 to 35.56 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Techsil Limited
Description: TSE3331 is a two part, heat curing silicone from Momentive Performance Materials designed for potting and encapsulation where flammability and/or thermal conductivity is of concern. It provides excellent flame retardant properties and very stable dielectric properties over a broad
- Chemical / Polymer System Type: Silicone
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Supplier: Techsil Limited
Description: Techsil® EP25485 is a low viscosity, thermally conductive flame retardant potting and encapsulating compound. The mixed system has a long usable life and may be hot or cold cured. The system exhibits a good surface finish, high electrical strength, high thermal
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
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Supplier: Epoxy Technology
Description: EPO-TEK® medical grade (or biocompatible) epoxy adhesives are used extensively throughout the healthcare and biotech industries. ?Device manufacturers making cardiac, ophthalmic, skeletal and neurological implants rely on our adhesives for protection, while the endoscopy camera market requires their
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 20.56 to 98.33 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
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Supplier: Epoxy Technology
Description: , including high-temperature, chemicals, solvents, and radiation. The most common applications of TCAs are semiconductor packaging, heat sinking electronics, and potting high-powered devices such as transformers. EPO-TEK® Thermally Conductive Adhesives are used in the following
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 17.22 to 78.89 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Encapsulants and Potting Compounds - Techsil® Non Silicone Heat Transfer Compound 620gm -- TEOT04005Supplier: Techsil Limited
Description: Techsil® HTC is a non-silicone heat transfer compound with a high thermal conductivity (0.9W/mK) designed for thermal coupling of electrical components. HTC is recommended where the efficient and reliable thermal coupling of electrical and electronic components is
- Compound Type: Thermal Compound / Thermally Conductive
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Use Temperature: -50 to 130 F
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Supplier: Digi-Key Electronics
Description: EPOXY POTTING COMPOUND BLACK/YEL
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Digi-Key Electronics
Description: THERMAL POTTING EPOXY 0.75KG PAC
- Compound Type: Thermal Compound / Thermally Conductive
- Form / Function: Encapsulant / Potting Compound
- Thermal Conductivity: 1.1 W/m-K
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Supplier: Protavic America, Inc.
Description: PNS-56225™ is a two-component clear ONE TO ONE MIX RATIO room temperature cure silicone encapsulant. It is designed for clear LED potting, encapsulation by casting of completed circuit boards, hybrid circuits, and power supplies, where flexibility, reparability, and high temperature
- Chemical / Polymer System Type: Silicone
- Coeff. of Thermal Expansion (CTE): 3056 µin/in-F
- Composition: Unfilled
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: PTE-36977 ™ is a two-component epoxy designed for encapsulation or casting of high voltage coils and transformers where high temperature, high voltage, and high thermal conductivity are required. PTE-36977 ™ is heat stable up to 150°C.
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 12.22 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is a two-component system, solvent free, electrically insulating epoxy adhesive, which is specially designed for protecting the devices from heat, humidity and mechanical damages. The PROTAVIC® PNE 40824-A and PROTAVIC® PNE 40824-B is recommended
- Chemical / Polymer System Type: Epoxy (EP)
- Coeff. of Thermal Expansion (CTE): 83.33 to 88.89 µin/in-F
- Composition: Filled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Henkel Corporation - Industrial
Description: catalysts. For more information on mixed properties when used with other available catalysts, please contact your local technical service representative for assistance and recommendations. High thermal conductivity Low thermal expansion Low CTE Electrically Insulating Excellent
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Thermal Conductivity: 1.38 W/m-K
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST 2762FT, Epoxy, High Temperature Resistance, High Thermal Conductivity, Potting, Encapsulant LOCTITE® STYCAST 2762FT epoxy encapsulant is designed for potting electronic components exposed to harsh environments. This material is also ideal for large and complex
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Viscosity: 25000 cP
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Supplier: Hapco, Inc.
Description: DI-COAT R-4721 / DI-COAT R-4721 LV (lower viscosity) Shore 90 D, room temperature curing, medium to high thixotropic coating for dielectric insulating applications. DI-COAT R-4721 is ideal for use on vertical or sloping surfaces where flow or drain-off cannot be tolerated. DI-COAT R-4721 is easy to
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.4 to 4.6
- Dielectric Strength: 654 kV/in
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Supplier: OMEGA Engineering, Inc.
Description: products. OMEGABOND and OMEGATHERM products are compounded and packaged for convenient, easy mixing and application. Each formulation exhibits important characteristics necessary for accurate, fast, reliable temperature measurement. These are: good adhesion and strength, high temperature
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: OMEGA Engineering, Inc.
Description: Chemical Set Cements set or cure by an internal chemical action which does not require exposure to air. Chemical Set Cements can be used in thick applications (applied in thicknesses greater than 1/4")*. SELECTION CRITERIA FOR CEMENTS 1. Type of Application Potting
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 2.6 to 12.4 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: OMEGATHERM thermal conducting paste is a high temperature and high thermally conductive paste product. They are specially formulated for permanent and temporary bonding of thermocouples, thin film RTDs, thermistors and other temperature sensors, to most surfaces metals,
- Chemical / Polymer System Type: Silicone
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Easily pourable, thermally conductive, shock resistant potting compounds that are ideally suited for low and high production applications. This series of DI-PAK products reduce rejects by exhibiting extremely low stress on potted components. All three of the above DI-PAK
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Two Component System
- Dielectric Constant (Relative Permittivity): 4.1 to 4.4
- Dielectric Strength: 400 kV/in
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST EE 4215/HD 3561, Epoxy, Potting and Encapsulating LOCTITE® STYCAST EE 4215/HD 3561 is a filled system recommended for potting applications where rigid or flexible wire leads protrude directly from the encapsulation and where high impact strength is required. This
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: OMEGA Engineering, Inc.
Description: Application Potting, sealing, encapsulating, assembling, bonding. Is a thick or thin film of cement required? This dictates whether or not an air set or a chemical set cement should be used. 2. Thermal Considerations What is the maximum temperature that the cement must withstand? What
- Chemical / Polymer System Type: Ceramic / Inorganic Cement
- Coeff. of Thermal Expansion (CTE): 6.2 to 13 µin/in-F
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Single Component System, Two Component System
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Supplier: Techsil Limited
Description: Techsil PU23955 is a two part component potting compound which cures to an opaque translucent material that is stable in UV light. Once mixed, the system reacts at room temperature to produce a tough abrasion resistant material with good hydrolysis resistance. There are many
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly)
- Form / Function: Encapsulant / Potting Compound
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Encapsulants and Potting Compounds - Filter-bond? Elastomeric Casting and Potting Compound -- E-3568Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond™ E-Series is manufactured to ultra-high quality standards and has been used by customers to pass
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Flexible / Dampening: Yes
- Form / Function: Encapsulant / Potting Compound
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Supplier: Hapco, Inc.
Description: Filter-bond™ is a series of casting and potting compounds ideally suited for potting, sealing, and bonding filtration and ultrafiltration products. The Filter-bond R-Series is manufactured to ultra-high quality standards and has been used by customers to pass FDA
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Cure Type / Technology: Two Component System
- Form / Function: Encapsulant / Potting Compound
- Viscosity: 8000 to 14000 cP
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… or premixed and frozen single-component systems, but now the Polytec PU 1000 polyurethane solution provides an … Boron-filled thermally conductive potting compound fills miniature thermistor and thermocouple cavities .
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Industrial Adhesives - Epoxy, Silicone, Polyurethane, Polysulfide and UV Cure Systems for Industrial Applications by Master Bond Inc.
Epoxy, Silicone, Polyurethane , Polysulfide and UV Cure Systems Master Bond manufactures innovative, technologically advanced adhesives, sealants, coatings, potting and encapsulation compounds designed to meet specific application requirements. These include electrical insulative, thermally conductive , electrically conductive, high temperature and chemically resistant grades.
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Conformal Coatings - Environmentally Friendly Conformal Coatings for Electronic Circuitry by Master Bond Inc.
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Spacecraft Dielectric Material Properties and Spacecraft Charging > Evaluation of Polymers That Might Prevent Spacecraft Charging
The TCNQ doped elastomers have useful properties comparable to those of conventional polyurethane elastomers. In addition to being semi conducting , they develop conduction anisotropy on uniaxial elongation.221 They are not suitable for structural materials or high … … environments, but they can be very useful for applications requiring a moderately conductive vibration damping material or potting compound . Conduction follows a simple thermally activated temperature dependence, and the inverse square root dependence of pressure indicates …
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Contamination control of space-based laser instruments
A two component, thermally conductive epoxy encapsulant Cure at the recommended schedule, follow with a post cure of 2 - 4 hours at the highest expected use temperature Polyurethane used as adhesive, stacking, and potting compound Air cured for 24 hours at room temperature .