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Supplier: MacDermid Alpha Electronics Solutions
Description: This thermally conductive polyurethane encapsulation and potting compound is a two-part system with a black finish. Product Overview UR5097 Thermally Conductive Polyurethane Potting Compound exhibits excellent thermal
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrically Conductive, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Encapsulants and Potting Compounds - Thermally conductive polyurethane potting compound -- 50-2368FRSupplier: Epoxies Etc...
Description: 50-2368 FR is a thermally conductive polyurethane potting compound. This is a faster gelling version of 50-2366 FR. 50-2368 FR polyurethane resin system is formulated for applications requiring low exotherm, low shrinkage, and excellent electrical
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 4.3
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Supplier: Epoxies Etc...
Description: 20-2175 is a two-component and dielectric potting and encapsulating compound. This product has unique flow and rheology characteristics that allows filling of cavities with small holes where traditional materials would leak. 20-2175 was formulated for use in potting cable end
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Room Temp. Cure / Vulcanizing, Two Component System
- Dielectric Constant (Relative Permittivity): 6.63
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Supplier: Epoxies Etc...
Description: 50-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 50-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Filled
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Epoxies Etc...
Description: 20-2366 FR is a new thermally conductive polyurethane potting compound. This flexible system is designed for low stress on sensitive components during and after cure. 20-2366 FR polyurethane resin system is formulated for applications requiring low exotherm,
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 90 µin/in-F
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
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Supplier: Protavic America, Inc.
Description: a unique combination of excellent wetting, flow, good thermal expansion properties, thermal shock resistance, and outstanding electrical properties. Adhesion is excellent to metals, most engineered plastics, and glass.
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Composition: Unfilled
- Compound Type: Electrically Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, UV / Radiation Cured (also EB, Light), Two Component System
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AN is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 47 to 53 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: Master Bond, Inc.
Description: Master Bond Polymer System EP21TDC-2LO is a low outgassing two component highly flexible, thermally conductive epoxy resin compound for high performance bonding sealing, coating, and encapsulation. It is formulated to cure fully at ambient temperature or more quickly at elevated
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive
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Supplier: Master Bond, Inc.
Description: Featuring resounding softness and dimensional stability, Super Gel 9AO is a two component system that delivers superior thermal conductivity and electrical insulation values. Excellent flow properties and low exotherm enable it to be cast in larger sections up to 2-3 inches thick. Super Gel 9
- Chemical / Polymer System Type: Polyurethane (PU, PUR), Silicone, Epoxy (EP)
- Composition: Unfilled
- Compound Type: Electrical Insulation / Dielectric, Thermal Compound / Thermally Conductive
- Cure Type / Technology: Thermosetting / Crosslinking, Room Temp. Cure / Vulcanizing, Two Component System
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Supplier: Henkel Corporation - Industrial
Description: LOCTITE STYCAST US 0155, Urethane, Potting and Encapsulating LOCTITE® STYCAST US 0155 is a low viscosity, flexible, flame retardant, castor oil/MDI based urethane potting/encapsulatin g compound. This material was designed for potting indoor and outdoor telephone
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 60.56 µin/in-F
- Compound Type: Thermally Conductive
- Cure Type / Technology: Two Component System
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant two-part epoxy potting and encapsulating compound, offering a cost-effective solution for various applications. Product Overview ER2188 General Purpose Epoxy Potting Compound is a two-part epoxy resin designed for general use in the electronics industry.
- Chemical / Polymer System Type: Epoxy (EP)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: MacDermid Alpha Electronics Solutions
Description: Flame-retardant polyurethane UL94-approved resin. Soft enough for dig-out work, it remains flexible over a wide temperature range. Product Overview UR5044 Flame Retardant Polyurethane Resin is a UL94-approved two-part system developed for potting and encapsulation of electronics
- Chemical / Polymer System Type: Polyurethane (PU, PUR)
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
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Supplier: Master Bond, Inc.
Description: by weight. The cured compound exhibits a high 31% elongation truly exceptional for a high thermal conductive epoxy. As very little exotherm is developed during cure the Master Bond EP21TDC-2AO is suitable for potting and encapsulation very thick as well as thin sectioned
- Chemical / Polymer System Type: Epoxy (EP), Polyurethane (PU, PUR)
- Coeff. of Thermal Expansion (CTE): 50 to 56 µin/in-F
- Composition: Filled
- Compound Type: Electrically Conductive, Thermally Conductive
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Supplier: RS Components, Ltd.
Description: Two part polyurethane resin potting and encapsulating compound supplied in handy 250g â??duo-sachetâ?? pack for easy mixing and pouring with no mess. Quick setting, flame retardant and thermally conductive encapsulant designed for general purpose use. The cured
- Form / Function: Specialty / Other, Encapsulant / Potting Compound
- Thermal Conductivity: 0.6500 W/m-K
- Use Temperature: -40 to 230 F
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Supplier: MacDermid Alpha Electronics Solutions
Description: High-reliability, two-component polyurethane conformal coating for demanding applications. Product Overview Electrolube® 2K301P is a high-performance, two-component conformal coating specifically formulated for selective coating processes. It features increased coating
- Compound Type: Thermal Compound / Thermally Conductive
- Cure Type / Technology: Two Component System
- Electrical / Electronics Applications: Electronics (PCB / SMT Assembly), Semiconductors / IC Packaging
- Form / Function: Conformal / Encapsulating Coating
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… or premixed and frozen single-component systems, but now the Polytec PU 1000 polyurethane solution provides an … Boron-filled thermally conductive potting compound fills miniature thermistor and thermocouple cavities .
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Epoxy, Silicone, Polyurethane , Polysulfide and UV Cure Systems Master Bond manufactures innovative, technologically advanced adhesives, sealants, coatings, potting and encapsulation compounds designed to meet specific application requirements. These include electrical insulative, thermally conductive , electrically conductive, high temperature and chemically resistant grades.
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The TCNQ doped elastomers have useful properties comparable to those of conventional polyurethane elastomers. In addition to being semi conducting , they develop conduction anisotropy on uniaxial elongation.221 They are not suitable for structural materials or high … … environments, but they can be very useful for applications requiring a moderately conductive vibration damping material or potting compound . Conduction follows a simple thermally activated temperature dependence, and the inverse square root dependence of pressure indicates …
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Contamination control of space-based laser instruments
A two component, thermally conductive epoxy encapsulant Cure at the recommended schedule, follow with a post cure of 2 - 4 hours at the highest expected use temperature Polyurethane used as adhesive, stacking, and potting compound Air cured for 24 hours at room temperature .